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Xuanke He

dblp:269/4234 · DBLP profile ↗
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1ranked-venue papers
0as first author
1since 2021 · last 2022
0000-0002-1368-5059ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer networks
1 paper
Internet of things and sensor networks · 72% Wireless networking · 22% Physical-layer communications · 6%

Topics — the 6 heaviest of 6, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Internet of things and sensor networks
backscatter communication
0.612022
Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics · Proc. IEEE 2022
Internet of things and sensor networks
energy harvesting
0.612022
Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics · Proc. IEEE 2022
Internet of things and sensor networks › backscatter communication
wirelessly powered backscatter
0.612022
Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics · Proc. IEEE 2022
Wireless networking
wireless power transfer
0.612022
Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics · Proc. IEEE 2022
Physical-layer communications
antenna design
0.212022
Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics · Proc. IEEE 2022
Internet of things and sensor networks › low-power wireless
low-power sensor networks
0.212022
Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics · Proc. IEEE 2022

Methods — techniques the papers use, named apart from their topics

waveform design · 0.6inkjet printing · 0.6channel optimization · 0.6
YearPublicationVenuePosition
2022 Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics
abstract
Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deployment of self-sustainable and maintenance-free low-cost sensing and communication devices. This article will introduce the state-of-the-art antenna design and radio frequency (RF) system integration for wirelessly powered backscatter communications, covering both the node and the base unit. We capture the latest development in ultralow-power RF front ends and coding schemes for$\mu \text{W}$-level backscatter modulators, as well as the latest progress in wireless power transfer (WPT) and energy harvesting (EH) techniques. Newly emerged rectenna system, waveform design, and channel optimization are reviewed in light of the opportunities for adaptively optimizing the WPT/EH efficiency for low-power signals with varying conditions. In addition, advanced device packaging and integration technologies in, e.g., additively manufactured RF components and modules for microwave and millimeter-wave ubiquitous sensing and backscattering energy-autonomous RF structures are reported. Inkjet printing for the sustainable and ultralow-cost fabrication of flexible RF devices and sensors will be reviewed to provide a prospective insight into the future packaging of backscatter communications from the chip-level design to complete system integration. Finally, this article will also address the challenges in fully wireless powered backscatter radio networks and discuss the future directions of backscatter communication in terms of “Green IoT” and “Low Carbon” smart home, smart city, smart skin, and machine-to-machine (M2M) applications.
Chaoyun Song, Yuan Ding 0001, Aline Eid, Jimmy G. Hester, Xuanke He, Ryan A. Bahr, Apostolos Georgiadis, George Goussetis, Manos M. Tentzeris
Proc. IEEE5