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Hugo Thienpont

dblp:29/4004 · DBLP profile ↗
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4ranked-venue papers
1as first author
0since 2021 · last 2012
0000-0003-0483-0960ORCID · verified

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2Graphics, computer vision, multimedia, augmented reality and games · 1Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer networks
1 paper
Optical networks · 100%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Interconnection networks and networks-on-chip · 100%

Topics — the 2 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Optical networks › optical interconnect
free-space optical interconnection
0.012000
Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communication · Proc. IEEE 2000
Optical networks
optical interconnect
0.012000
Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communication · Proc. IEEE 2000

Methods — techniques the papers use, named apart from their topics

injection molding · 0.1deep proton lithography · 0.1
YearPublicationVenuePosition
2012 Efficient disparity vector prediction schemes with modified P frame for 2D camera arrays
Aykut Avci, Jan De Cock, Peter Lambert, Roel Beernaert, Jelle De Smet, Lawrence Bogaert, Youri Meuret, Hugo Thienpont, Herbert De Smet
J. Vis. Commun. Image Represent.8
2007 Predicting reconfigurable interconnect performance in distributed shared-memory systems
Wim Heirman, Joni Dambre, Iñigo Artundo, Christof Debaes, Hugo Thienpont, Dirk Stroobandt, Jan M. Van Campenhout
Integr.5
2000 Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communication
abstract
We design and fabricate a prototype scalable multichannel free-space interconnection module with the potential for Tb/s/spl middot/cm/sup 2/ aggregate bit-rate capacity over inter- and intra-MCM interconnection distances. The component is fabricated in a high quality optical plastic, PMMA, using deep proton lithography, an ion-based rapid prototyping technology. As a feasibility demonstration, data communication is achieved at 622 Mb/s per channel with a bit error rate smaller than 10/sup -13/ for 16 channels with an interchannel crosstalk lower than -22 dB. We perform a sensitivity analysis for misalignments and fabrication errors and study the fabrication issues of these components with injection molding techniques. Finally, we provide evidence that these modules can be mass fabricated with the required precision.
Hugo Thienpont, Christoph Debaes, Valerie Baukens, Heidi Ottevaere, Pedro Vynck, Patrik Tuteleers, Guy Verschaffelt, Bart Volckaerts, Alex Hermanne, Mike Hanney
Proc. IEEE1
1997 Proposal for Stochastic Bit Stream Processing Using Optoelectronic Smart Pixels: A Neural Network Architectural Case Study
M. A. Hands, W. Pfeiffer, Hugo Thienpont, Andrew G. Kirk, Trevor J. Hall, D. Pignon, P. Parmiter
J. Parallel Distributed Comput.3