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Robert J. Trew

dblp:299/7060 · DBLP profile ↗
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2ranked-venue papers
2as first author
0since 2021 · last 2002
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 2 · 2 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Integrated circuit design · 100%
Computer networks
1 paper
Physical-layer communications · 100%

Topics — the 5 heaviest of 7, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design › semiconductor devices
wide bandgap semiconductor devices
0.022002
SiC and GaN transistors - is there one winner for microwave power applications? · Proc. IEEE 2002
The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications · Proc. IEEE 1991
Integrated circuit design › semiconductor devices
GaN HEMT
0.012002
SiC and GaN transistors - is there one winner for microwave power applications? · Proc. IEEE 2002
Integrated circuit design › semiconductor devices
bipolar transistor
0.011991
The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications · Proc. IEEE 1991
Integrated circuit design › semiconductor devices › diode
IMPATT diode
0.011991
The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications · Proc. IEEE 1991
Integrated circuit design › semiconductor devices
microwave and millimeter-wave devices
0.011991
The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications · Proc. IEEE 1991

Methods — techniques the papers use, named apart from their topics

RF performance calculation · 0.0
YearPublicationVenuePosition
2002 SiC and GaN transistors - is there one winner for microwave power applications?
abstract
Wide bandgap semiconductors show promise for high-power microwave electronic devices. Primarily due to low breakdown voltage, it has not been possible to design and fabricate solid-state transistors that can yield radio-frequency (RF) output power on the order of hundreds to thousands of watts. This has severely limited their use in power applications. Recent improvements in the growth of wide bandgap semiconductor materials, such as SiC and the GaN-based alloys, provide the opportunity to now design and fabricate microwave transistors that demonstrate performance previously available only from microwave tubes. The most promising electronic devices for fabrication in wide bandgap semiconductors for these applications are metal-semiconductor field-effect transistors (MESFETs) fabricated from the 4H-SiC polytype and heterojunction field-effect transistors (HFETs) fabricated using the AlGaN/GaN heterojunction. These devices can provide RF output power on the order of 5-6 W/mm and 10-12 W/mm of gate periphery, respectively. 4H-SiC MESFETs should produce useful performance at least through X band and AlGaN/GaN HFETs should produce useful performance well into the millimeter-wave region, and potentially as high as 100 GHz.
Robert J. Trew
Proc. IEEE1
1991 The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications
abstract
The potential of SiC and diamond for producing microwave and millimeter-wave electronic devices is reviewed. It is shown that both of these materials possess characteristics that may permit RF electronic devices with performance similar to or greater than what is available from devices fabricated from the commonly used semiconductors, Si, GaAs, and InP. Theoretical calculations of the RF performance potential of several candidate high-frequency device structures are presented: the metal semiconductor field-effect transistor (MESFET), the impact avalanche transit-time (IMPATT) diode, and the bipolar junction transistor (BJT). Diamond MESFETs are capable of producing over 200 W of X-band power as compared to about 8 W for GaAs MESFETs. Devices fabricated from SiC should perform between these limits. Diamond and SiC IMPATT diodes also are capable of producing improved RF power compared to Si, GaAs, and InP devices at microwave frequencies. RF performance degrades with frequency and only marginal improvements are indicated at millimeter-wave frequencies. Bipolar transistors fabricated from wide bandgap material probably offer improved RF performance only at UHF and low microwave frequencies.>
Robert J. Trew, Jing-Bang Yan, Philip M. Mock
Proc. IEEE1