Demo Data from SIGIR 2026 / reviewers in the wild / expert
Patrik Tuteleers
dblp:314/5138
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2000
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer networks
1 paper |
Optical networks · 100% | |
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Interconnection networks and networks-on-chip · 100% |
Topics — the 2 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Optical networks › optical interconnect
free-space optical interconnection |
0.0 | 1 | 2000 | Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communication · Proc. IEEE 2000 |
Optical networks
optical interconnect |
0.0 | 1 | 2000 | Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communication · Proc. IEEE 2000 |
Methods — techniques the papers use, named apart from their topics
injection molding · 0.1deep proton lithography · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2000 | Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communicationabstractWe design and fabricate a prototype scalable multichannel free-space interconnection module with the potential for Tb/s/spl middot/cm/sup 2/ aggregate bit-rate capacity over inter- and intra-MCM interconnection distances. The component is fabricated in a high quality optical plastic, PMMA, using deep proton lithography, an ion-based rapid prototyping technology. As a feasibility demonstration, data communication is achieved at 622 Mb/s per channel with a bit error rate smaller than 10/sup -13/ for 16 channels with an interchannel crosstalk lower than -22 dB. We perform a sensitivity analysis for misalignments and fabrication errors and study the fabrication issues of these components with injection molding techniques. Finally, we provide evidence that these modules can be mass fabricated with the required precision. Hugo Thienpont, Christoph Debaes, Valerie Baukens, Heidi Ottevaere, Pedro Vynck, Patrik Tuteleers, Guy Verschaffelt, Bart Volckaerts, Alex Hermanne, Mike Hanney |
Proc. IEEE | 6 |