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Thomas F. Kuech

dblp:322/3379 · DBLP profile ↗
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1ranked-venue papers
1as first author
0since 2021 · last 1992
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 91% Embedded and real-time systems · 9%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design › semiconductor device fabrication
semiconductor growth
0.011992
Recent advances in metal-organic vapor phase epitaxy · Proc. IEEE 1992
Integrated circuit design › semiconductor technology
semiconductor materials
0.011992
Recent advances in metal-organic vapor phase epitaxy · Proc. IEEE 1992
Integrated circuit design › semiconductor devices
wide bandgap semiconductor devices
0.011992
Recent advances in metal-organic vapor phase epitaxy · Proc. IEEE 1992
Embedded and real-time systems › industrial control systems
process control
0.011992
Recent advances in metal-organic vapor phase epitaxy · Proc. IEEE 1992

Methods — techniques the papers use, named apart from their topics

metalorganic chemical vapor deposition · 0.0
YearPublicationVenuePosition
1992 Recent advances in metal-organic vapor phase epitaxy
abstract
Recent progress in the development and application of metal-organic vapor phase epitaxy (MOVPE) is reviewed. The formation of new and unique materials and structures, including wide-bandgap materials of both III-V and II-VI semiconductors, is discussed. The basic studies of the underlying chemistry and fluid flow behavior in MOVPE reactors and resulting improvements in the control of material properties and the uniformity of growth are considered. New growth precursors yielding both selective area growth and improved material purity are discussed. Improved reproducibility of the MOVPE growth product using growth monitors, for the real-time determination of film thickness and composition, which have resulted in greater acceptance of the MOVPE technique in the manufacturing environment, is discussed.>
Thomas F. Kuech
Proc. IEEE1