Demo Data from SIGIR 2026 / reviewers in the wild / expert
C. Rebizant
dblp:33/3397
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 1990
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 75% Integrated circuit design · 25% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
analog and mixed-signal circuits |
0.0 | 1 | 1990 | System Simulation of Printed Circuit Boards Including Packages and Connectors · DAC 1990 |
Electronic design automation › circuit simulation
analog circuit simulation |
0.0 | 1 | 1990 | System Simulation of Printed Circuit Boards Including Packages and Connectors · DAC 1990 |
Electronic design automation
hardware verification and test |
0.0 | 1 | 1990 | System Simulation of Printed Circuit Boards Including Packages and Connectors · DAC 1990 |
Electronic design automation › interconnect modeling
transmission line modeling |
0.0 | 1 | 1990 | System Simulation of Printed Circuit Boards Including Packages and Connectors · DAC 1990 |
Methods — techniques the papers use, named apart from their topics
transmission-line model · 0.0electromagnetic field analysis · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1990 | System Simulation of Printed Circuit Boards Including Packages and ConnectorsabstractAn efficient method for analog simulation of printed circuit board systems is proposed. It is based on the transmission line model derived from the analysis of the electromagnetic field in a two-dimensional cross-section of devices. Simulation results for two circuits with IC package, cable and connector models are presented. The results confirm the effectiveness of this method. K. Adamiak, R. Allen, J. Poltz, C. Rebizant, A. Wexler |
DAC | 4 |