Demo Data from SIGIR 2026 / reviewers in the wild / expert
Je-Wei Chuang
dblp:357/2589
· DBLP profile ↗
3ranked-venue papers
2as first author
3since 2021 · last 2026
0009-0001-9106-8937ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 3 · 2 first-author · 3 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
3 papers |
Electronic design automation · 100% |
Topics — the 4 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation
physical design |
2.4 | 3 | 2026 | Redistribution Layer Routing With Dynamic via Insertion Under Irregular via Structures · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 Redistribution Layer Routing with Dynamic Via Insertion Under Irregular Via Structures · DAC 2024 Any-Angle Routing for Redistribution Layers in 2.5D IC Packages · DAC 2023 |
Electronic design automation › physical design › routing › package routing
redistribution layer routing |
2.4 | 3 | 2026 | Redistribution Layer Routing With Dynamic via Insertion Under Irregular via Structures · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 Redistribution Layer Routing with Dynamic Via Insertion Under Irregular Via Structures · DAC 2024 Any-Angle Routing for Redistribution Layers in 2.5D IC Packages · DAC 2023 |
Electronic design automation › physical design
routing |
2.4 | 3 | 2026 | Redistribution Layer Routing With Dynamic via Insertion Under Irregular via Structures · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2026 Redistribution Layer Routing with Dynamic Via Insertion Under Irregular Via Structures · DAC 2024 Any-Angle Routing for Redistribution Layers in 2.5D IC Packages · DAC 2023 |
Electronic design automation › physical design › routing › VLSI routing
any-angle routing |
0.7 | 1 | 2023 | Any-Angle Routing for Redistribution Layers in 2.5D IC Packages · DAC 2023 |
Methods — techniques the papers use, named apart from their topics
routing graph model · 1.8any-angle routing · 1.090- and 135-degree routing · 0.8tile routing · 0.7global routing · 0.7dynamic programming · 0.7
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | Redistribution Layer Routing With Dynamic via Insertion Under Irregular via StructuresabstractIn modern advanced packaging, redistribution layers (RDLs) are often used for signal transmission among chips, and vias are used for communication among different layers. Most existing RDL routers perform via planning before routing. However, since vias can be placed at arbitrary locations under the irregular via structure, via planning limits the solution space and reduces layout flexibility. This work proposes a new flow with a novel routing graph model for 90-and 135-degree routing, which allows dynamic via insertion during routing. The proposed algorithm enlarges the solution space by providing more choices during path-finding, achieving higher routing quality. The experimental results based on commonly used benchmark suites show that our router achieves shorter wirelength and runtime than state-of-the-art works, including an any-angle router. Je-Wei Chuang, Zong-Han Wu, Bo-Ying Huang, Yao-Wen Chang |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 1 |
| 2024 | Redistribution Layer Routing with Dynamic Via Insertion Under Irregular Via StructuresabstractIn modern advanced packaging, redistribution layers (RDLs) are often used for signal transmission among chips, and vias are used for communication among different layers. Most existing RDL routers perform via planning before routing. However, since vias can be placed at arbitrary locations under the irregular via structure, via planning limits the solution space and reduces layout flexibility. This paper proposes a new flow with a novel routing graph model for 90- and 135-degree routing, which allows dynamic via insertion during routing. The proposed algorithm enlarges the solution space by providing more choices during path-finding, achieving higher routing quality. The experimental results based on commonly used benchmark suites show that our router achieves over 10% better wirelength with over 29X speedup over the state-of-the-art work and even achieves 0.4% better wirelength with 55X speedup over the state-of-the-art any-angle router. Je-Wei Chuang, Zong-Han Wu, Bo-Ying Huang, Yao-Wen Chang |
DAC | 1 |
| 2023 | Any-Angle Routing for Redistribution Layers in 2.5D IC PackagesabstractRedistribution layers (RDLs) are widely applied for signal transmissions in advanced packages. Traditional redistribution layer (RDL) routers use only 90- and 135-degree turns for routing. With technological advances, routing in RDLs can be any obtuse angle, leading to larger routing solution spaces and shorter total wirelength. This paper proposes the first any-angle routing algorithm in the literature for multiple RDLs. We first give a novel global routing algorithm with accurate routing resource estimation. A multi-net access point adjustment method is then proposed based on dynamic programming and our partial net separation scheme. Finally, we develop an efficient tile routing algorithm to obtain valid routes with fixed access points. Experimental results show that our algorithm can achieve a 15.7% shorter wirelength compared with a traditional RDL router. Min-Hsuan Chung, Je-Wei Chuang, Yao-Wen Chang |
DAC | 2 |