Demo Data from SIGIR 2026 / reviewers in the wild / expert
Fengyun Yan
dblp:357/2659
· DBLP profile ↗
3ranked-venue papers
0as first author
3since 2021 · last 2025
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 3 · 3 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Hardware accelerators and domain-specific architectures · 50% Memory systems · 50% | |
| Artificial intelligence
2 papers |
Efficient and distributed learning · 72% Language models and text generation · 28% |
Topics — the 8 heaviest of 8, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Memory systems
3d-stacked memory |
0.9 | 1 | 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025 |
Hardware accelerators and domain-specific architectures › machine learning accelerator
in-memory computing accelerator |
0.9 | 1 | 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025 |
Hardware accelerators and domain-specific architectures
machine learning accelerator |
0.9 | 1 | 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025 |
Memory systems
processing-in-memory |
0.9 | 1 | 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025 |
Natural language and speech › Language models and text generation
large language model inference |
0.3 | 1 | 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025 |
Machine learning › Efficient and distributed learning › inference acceleration
speculative decoding |
0.3 | 1 | 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025 |
Machine learning › Efficient and distributed learning › edge computing
edge inference |
0.2 | 1 | 2023 | A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware · DAC 2023 |
Machine learning › Efficient and distributed learning
resource-constrained learning |
0.2 | 1 | 2023 | A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware · DAC 2023 |
Methods — techniques the papers use, named apart from their topics
token-stationary dataflow · 1.7architecture exploration · 1.7roofline model · 1.3low-voltage operation · 1.3design space exploration · 1.3
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2025 | 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM InferenceabstractThe LLM decoding process poses a significant challenge for memory bandwidth due to its autoregressive nature. Prior 2D memory solutions fail to overcome this memory bottleneck due to limited memory-to-logic bandwidth. In this work, we propose 3D-TokSIM, a cross-stack solution by stacking 3D memory on logic die with a specially designed token-stationary compute-in-memory (CIM) to efficiently accelerate speculative decoding. Our CIM is developed with novel token-stationary dataflow to reduce data movement on logic die to save power and balance computation and memory access. To further reduce the buffer requirements, we perform architecture exploration and allocate notable CIM resources for achieving higher decoding parallelism. Compared to RTX 3090 GPU, 3D-TokSIM achieves 15.1 $\times$ throughput and $324 \times$ energy efficiency improvements on speculative Llama2-7B decoding. Boya Lv, Meng Wu 0005, Fengyun Yan, Yufei Ma 0002, Ru Huang 0001, Le Ye |
DAC | 5 |
| 2023 | A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML HardwareabstractTiny machine learning (TinyML) becomes appealing as it enables machine learning on resource-constrained devices with ultra low energy and small form factor. In this paper, a model-specific end-to-end design methodology is presented for TinyML hardware design. First, we introduce an end-to-end system evaluation method using Roofline models, which considering both AI and other general-purpose computing to guide the architecture design choices. Second, to improve the efficiency of AI computation, we develop an enhanced design space exploration framework, TinyScale, to enable optimal low-voltage operation for energy-efficient TinyML. Finally, we present a use case driven design selection method to search the optimal hardware design across a set of application use cases. Our model-specific design methodology is evaluated on both TSMC 22nm and 55nm technology for MLPerf Tiny benchmark and a keyword spotting (KWS) SoC design. With the help of our end-to-end design methodology, an optimal TinyML hardware can be automatically explored with significant energy and EDP improvements for a diverse of TinyML use cases. Yanchi Dong, Kaixuan Du, Yiqi Jing, Qijun Wang, Pixian Zhan, Fengyun Yan, Yufei Ma 0002, Yun Liang 0001, Le Ye, Ru Huang 0001 |
DAC | 8 |
| 2023 | DCIM-3DRec: A 3D Reconstruction Accelerator with Digital Computing-in-Memory and Octree-Based SchedulerabstractLearning-based 3D reconstruction has evolved rapidly with promising quality, while it requires high-performance hardware for interactive applications. In this work, a reconstruction accelerator called DCIM-3DRec is presented which leverages digital computing-in-memory (DCIM) design to facilitate learning-based reconstruction deployment on realtime and low-power edge platforms. The DCIM-3DRec is designed with the following features: a reconfigurable DCIM macro array for high data reuse and macro utilization, and an Octree-based subdivision scheduler for efficient management of 3D space prediction. The DCIM-3DRec accelerator is implemented and evaluated in TSMC 55 nm technology, with a DCIM macro efficiency of 19.4 TOPS/W at INT8. Overall, the DCIM-3DRec accelerator achieves 23× performance gain and four orders of magnitude energy efficiency improvement compared to a Nvidia RTX3090 GPU. Yiqi Jing, Meng Wu 0005, Fengyun Yan, Yufei Ma 0002, Le Ye |
ISLPED | 6 |