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Fengyun Yan

dblp:357/2659 · DBLP profile ↗
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3ranked-venue papers
0as first author
3since 2021 · last 2025
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 3 · 3 since 2021Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
2 papers
Hardware accelerators and domain-specific architectures · 50% Memory systems · 50%
Artificial intelligence
2 papers
Efficient and distributed learning · 72% Language models and text generation · 28%

Topics — the 8 heaviest of 8, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Memory systems
3d-stacked memory
0.912025
3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025
Hardware accelerators and domain-specific architectures › machine learning accelerator
in-memory computing accelerator
0.912025
3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025
Hardware accelerators and domain-specific architectures
machine learning accelerator
0.912025
3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025
Memory systems
processing-in-memory
0.912025
3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025
Natural language and speech › Language models and text generation
large language model inference
0.312025
3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025
Machine learning › Efficient and distributed learning › inference acceleration
speculative decoding
0.312025
3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference · DAC 2025
Machine learning › Efficient and distributed learning › edge computing
edge inference
0.212023
A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware · DAC 2023
Machine learning › Efficient and distributed learning
resource-constrained learning
0.212023
A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware · DAC 2023

Methods — techniques the papers use, named apart from their topics

token-stationary dataflow · 1.7architecture exploration · 1.7roofline model · 1.3low-voltage operation · 1.3design space exploration · 1.3
YearPublicationVenuePosition
2025 3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference
abstract
The LLM decoding process poses a significant challenge for memory bandwidth due to its autoregressive nature. Prior 2D memory solutions fail to overcome this memory bottleneck due to limited memory-to-logic bandwidth. In this work, we propose 3D-TokSIM, a cross-stack solution by stacking 3D memory on logic die with a specially designed token-stationary compute-in-memory (CIM) to efficiently accelerate speculative decoding. Our CIM is developed with novel token-stationary dataflow to reduce data movement on logic die to save power and balance computation and memory access. To further reduce the buffer requirements, we perform architecture exploration and allocate notable CIM resources for achieving higher decoding parallelism. Compared to RTX 3090 GPU, 3D-TokSIM achieves 15.1 $\times$ throughput and $324 \times$ energy efficiency improvements on speculative Llama2-7B decoding.
Boya Lv, Meng Wu 0005, Fengyun Yan, Yufei Ma 0002, Ru Huang 0001, Le Ye
DAC5
2023 A Model-Specific End-to-End Design Methodology for Resource-Constrained TinyML Hardware
abstract
Tiny machine learning (TinyML) becomes appealing as it enables machine learning on resource-constrained devices with ultra low energy and small form factor. In this paper, a model-specific end-to-end design methodology is presented for TinyML hardware design. First, we introduce an end-to-end system evaluation method using Roofline models, which considering both AI and other general-purpose computing to guide the architecture design choices. Second, to improve the efficiency of AI computation, we develop an enhanced design space exploration framework, TinyScale, to enable optimal low-voltage operation for energy-efficient TinyML. Finally, we present a use case driven design selection method to search the optimal hardware design across a set of application use cases. Our model-specific design methodology is evaluated on both TSMC 22nm and 55nm technology for MLPerf Tiny benchmark and a keyword spotting (KWS) SoC design. With the help of our end-to-end design methodology, an optimal TinyML hardware can be automatically explored with significant energy and EDP improvements for a diverse of TinyML use cases.
Yanchi Dong, Kaixuan Du, Yiqi Jing, Qijun Wang, Pixian Zhan, Fengyun Yan, Yufei Ma 0002, Yun Liang 0001, Le Ye, Ru Huang 0001
DAC8
2023 DCIM-3DRec: A 3D Reconstruction Accelerator with Digital Computing-in-Memory and Octree-Based Scheduler
abstract
Learning-based 3D reconstruction has evolved rapidly with promising quality, while it requires high-performance hardware for interactive applications. In this work, a reconstruction accelerator called DCIM-3DRec is presented which leverages digital computing-in-memory (DCIM) design to facilitate learning-based reconstruction deployment on realtime and low-power edge platforms. The DCIM-3DRec is designed with the following features: a reconfigurable DCIM macro array for high data reuse and macro utilization, and an Octree-based subdivision scheduler for efficient management of 3D space prediction. The DCIM-3DRec accelerator is implemented and evaluated in TSMC 55 nm technology, with a DCIM macro efficiency of 19.4 TOPS/W at INT8. Overall, the DCIM-3DRec accelerator achieves 23× performance gain and four orders of magnitude energy efficiency improvement compared to a Nvidia RTX3090 GPU.
Yiqi Jing, Meng Wu 0005, Fengyun Yan, Yufei Ma 0002, Le Ye
ISLPED6