Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

Zifei Cai

dblp:389/7197 · DBLP profile ↗
← Back
1ranked-venue papers
1as first author
1since 2021 · last 2024
0009-0007-1606-7428ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 67% Integrated circuit design · 33%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › technology computer-aided design
device simulation
0.812024
Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices · DAC 2024
Integrated circuit design
semiconductor device modeling
0.812024
Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices · DAC 2024
Electronic design automation
technology computer-aided design
0.812024
Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices · DAC 2024

Methods — techniques the papers use, named apart from their topics

radial basis function neural network · 0.8physics-informed neural network · 0.8
YearPublicationVenuePosition
2024 Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices
abstract
Technology Computer Aided Design (TCAD) is a crucial step in the design and manufacturing of semiconductor devices. It involves solving physical equations that describe the behavior of semiconductor devices to predict various device parameters. Traditional TCAD methods, such as finite volume and finite element methods, discretize relevant physical equations to achieve numerical simulations of devices, significantly burdening the computation resources. For the first time, this paper proposes a novel method for TCAD simulation based on Physics-Informed Neural Networks (PINNs). We proposed multi-order differential neural network (MDNN), an improved Radial Basis Function Neural Network (RBFNN) model. By training MDNN, it achieves the couple solution of the Poisson equation and drift-diffusion equation under steady-state conditions, without the need for a pre-existing dataset. To the best of our knowledge, this marks the first instance of an ML-TCAD simulation that does not require any pre-existing data. For an example of PN junction diode, this method effectively simulates the basic physical characteristics of the device, with a self-consistent solution error of less than 1×10−5.
Zifei Cai, Anaoxue Huang, Yifeng Xiong, Dejiang Mu, Xiangshui Miao, Xingsheng Wang
DAC1