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Rajarshi Ray 0002

dblp:41/9894 · DBLP profile ↗
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2ranked-venue papers
2as first author
0since 2021 · last 1989
0000-0001-8633-7808ORCID · corroborated

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 2 · 2 first-authorGraphics, computer vision, multimedia, augmented reality and games · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer graphics and multimedia
2 papers
Image and video processing · 48% Multimedia analysis and retrieval · 28% Computational photography and imaging · 12%

Topics — the 4 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Multimedia analysis and retrieval › image analysis › visual inspection
automated visual inspection
0.011989
Automated inspection of solder bumps using visual signatures of specular image-highlights · CVPR 1989
Image and video processing › industrial inspection
solder ball inspection
0.011989
Automated inspection of solder bumps using visual signatures of specular image-highlights · CVPR 1989
Computational photography and imaging
photometric stereo
0.011983
Error Analysis of Surface Normals Determined by Radiometry · IEEE Trans. Pattern Anal. Mach. Intell. 1983
Geometric modeling and processing › surface processing
surface normal estimation
0.011983
Error Analysis of Surface Normals Determined by Radiometry · IEEE Trans. Pattern Anal. Mach. Intell. 1983

Methods — techniques the papers use, named apart from their topics

feature space mapping · 0.0dark-field illumination · 0.0bright-field imaging · 0.0sensitivity analysis · 0.0radiometric calibration · 0.0
YearPublicationVenuePosition
1989 Automated inspection of solder bumps using visual signatures of specular image-highlights
abstract
The author describes a technique for automated inspection of solder bumps by analyzing spatial features and intensity characteristics of image highlights. It is based on high-contrast imaging of specular soldered surfaces against a reflective background using dark-field illumination for selective enhancement of surface topography. Bright-field images of these surfaces are also analyzed to resolve ambiguities in the defect-identification process. The reflectance of solder is studied, for the estimation of corresponding signatures of image specularities, which provide information about surface curvature, metallurgical constituents and topographic discontinuities. During inspection, a specular highlight in the run-time image is mapped into a feature space of reduced dimensionalities for comparison against the features of typical signatures. Based on this principle, visual inspection systems have been designed and implemented for high-speed detection of defective solder bumps and leadless ceramic chip carriers and metallized advanced VLSI wafers.>
Rajarshi Ray 0002
CVPR1
1983 Error Analysis of Surface Normals Determined by Radiometry
abstract
Surface normals can be computed from three images of a workpiece taken under three distinct lighting conditions without requiring surface continuity. Radiometric methods are susceptible to systematic errors such as: errors in the measurement of light source orientations; mismatched light source irradiance; detector nonlinearity; the presence of specular reflection or shadows; the spatial and spectral distribution of incident light; surface size, material, and microstructure; and the length and properties of the light source to target path. Typically, a 1° error in surface orientation of a Lambertian workpiece is caused by a 1 percent change in image intensity due to variations in incident light intensity or a 1° change in orientation of a collimated light source. Tests on a white nylon sphere indicate that by using modest error prevention and calibration schemes, surface angles off the camera axis can be computed within 5°, except at edge pixels. Equations for the sensitivity of surface normals to major error sources have been derived. Results of surface normal estimation and edge extraction experiments on various non-Lambertian and textured workpieces are also presented.
Rajarshi Ray 0002, John R. Birk, Robert B. Kelley
IEEE Trans. Pattern Anal. Mach. Intell.1