Demo Data from SIGIR 2026 / reviewers in the wild / expert
Clark T.-C. Nguyen
dblp:54/430
· DBLP profile ↗
2ranked-venue papers
2as first author
0since 2021 · last 2005
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1 · 1 first-authorApplied, interdisciplinary, general and emerging computing · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer networks
2 papers |
Physical-layer communications · 100% | |
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 100% |
Topics — the 6 heaviest of 6, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
radio-frequency circuit design |
0.1 | 1 | 2005 | RF MEMS in wireless architectures · DAC 2005 |
Physical-layer communications
antenna design |
0.0 | 1 | 1998 | Micromachined devices for wireless communications · Proc. IEEE 1998 |
Physical-layer communications
microwave and millimeter-wave devices |
0.0 | 1 | 1998 | Micromachined devices for wireless communications · Proc. IEEE 1998 |
Physical-layer communications › receiver design
RF front-end |
0.0 | 1 | 2005 | RF MEMS in wireless architectures · DAC 2005 |
Physical-layer communications › RF circuit design
transceiver architecture |
0.0 | 1 | 2005 | RF MEMS in wireless architectures · DAC 2005 |
Physical-layer communications › wireless communication systems
wireless transceiver |
0.0 | 1 | 1998 | Micromachined devices for wireless communications · Proc. IEEE 1998 |
Methods — techniques the papers use, named apart from their topics
MEMS fabrication · 0.1micromachining · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2005 | RF MEMS in wireless architecturesabstractMicromechanical (or “µmechanical”) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are then presented that use these micromechanical circuits in large quantities to enhance robustness and substantially reduce power consumption. Among the more aggressive architectures proposed are one based on a µmechanical RF channel-selector and one featuring an all-MEMS RF front-end. Clark T.-C. Nguyen |
DAC | 1 |
| 1998 | Micromachined devices for wireless communicationsabstractAn overview of recent progress in the research and development of micromachined devices for use in wireless communication subsystems is presented. Among the specific devices described are tunable micromachined capacitors, integrated high-Q inductors, micromachined low-loss microwave and millimeter-wave filters, low-loss micromechanical switches, microscale vibrating mechanical resonators with Q's in the tens of thousands, and miniature antennas for millimeter-wave applications. Specific applications are reviewed for each of these components with emphasis on methods for miniaturization and performance enhancement of existing and further wireless transceivers. Clark T.-C. Nguyen, Linda Katehi, Gabriel M. Rebeiz |
Proc. IEEE | 1 |