We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

This paper describes the electronics and communication system of Odin, a novel heterogeneous modular robot made of links and joints. The electronics is divided into two printed circuit boards: a General board with reusable components and a Specific board with non-reusable components. While the General board is common to the design of every type of module, such as power, actuator, sensor and structure, the Specific board is unique to each type of module. The communication system, one of the most important reusable components of Odin, is based on local buses that can be extended by bridging electrical signals.

As exchange of information is essential to modular robots, deciding between local or global communication is a common design choice. This choice, however, still lacks theoretical support.

Highly sophisticated animals consist of a set of heterogenous modules decided by nature so that they can survive in a complex environment. In this paper we present a new modular robot inspired by biology called Odin. The Odin robot is based on a deformable lattice and consists of an extendable set of heterogeneous modules. We present the design and implementation of a cubic closed-packed (CCP) joint module, a telescoping link, and a flexible connection mechanism. The developed robot is highly versatile and opens up for a wide range of new research in modular robotics.