NAND flash memory density continues to scale to keep up with the increasing storage demands of data-intensive applications. Unfortunately, as a result of this scaling, the lifetime of NAND flash memory has been decreasing. Each cell in NAND flash memory can endure only a limited number of writes, due to the damage caused by each program and erase operation on the cell. This damage can be partially repaired on its own during the idle time between program or erase operations (known as the dwell time), via a phenomenon known as the self-recovery effect. Prior works study the self-recovery effect for planar (i.e., 2D) NAND flash memory, and propose to exploit it to improve flash lifetime, by applying high temperature to accelerate self-recovery. However, these findings may not be directly applicable to 3D NAND flash memory, due to significant changes in the design and manufacturing process that are required to enable practical 3D stacking for NAND flash memory. In this paper, we perform the first detailed experimental characterization of the effects of self-recovery and temperature on real, state-of-the-art 3D NAND flash memory devices. We show that these effects influence two major factors of NAND flash memory reliability: (1) retention loss speed (i.e., the speed at which a flash cell leaks charge), and (2) program variation (i.e., the difference in programming speed across flash cells). We find that self-recovery and temperature affect 3D NAND flash memory quite differently than they affect planar NAND flash memory, rendering prior models of self-recovery and temperature ineffective for 3D NAND flash memory. Using our characterization results, we develop a new model for 3D NAND flash memory reliability, which predicts how retention, wearout, self-recovery, and temperature affect raw bit error rates and cell threshold voltages. We show that our model is accurate, with an error of only 4.9%. Based on our experimental findings and our model, we propose HeatWatch, a new mechanism to improve 3D NAND flash memory reliability. The key idea of HeatWatch is to optimize the read reference voltage, i.e., the voltage applied to the cell during a read operation, by adapting it to the dwell time of the workload and the current operating temperature. HeatWatch (1) efficiently tracks flash memory temperature and dwell time online, (2) sends this information to our reliability model to predict the current voltages of flash cells, and (3) predicts the optimal read reference voltage based on the current cell voltages. Our detailed experimental evaluations show that HeatWatch improves flash lifetime by 3.85× over a baseline that uses a fixed read reference voltage, averaged across 28 real storage workload traces, and comes within 0.9% of the lifetime of an ideal read reference voltage selection mechanism.

Modern NAND flash memory chips provide high density by storing two bits of data in each flash cell, called a multi-level cell (MLC). An MLC partitions the threshold voltage range of a flash cell into four voltage states. When a flash cell is programmed, a high voltage is applied to the cell. Due to parasitic capacitance coupling between flash cells that are physically close to each other, flash cell programming can lead to cell-to-cell program interference, which introduces errors into neighboring flash cells. In order to reduce the impact of cell-to-cell interference on the reliability of MLC NAND flash memory, flash manufacturers adopt a two-step programming method, which programs the MLC in two separate steps. First, the flash memory partially programs the least significant bit of the MLC to some intermediate threshold voltage. Second, it programs the most significant bit to bring the MLC up to its full voltage state. In this paper, we demonstrate that two-step programming exposes new reliability and security vulnerabilities. We experimentally characterize the effects of two-step programming using contemporary 1X-nm (i.e., 15–19nm) flash memory chips. We find that a partially-programmed flash cell (i.e., a cell where the second programming step has not yet been performed) is much more vulnerable to cell-to-cell interference and read disturb than a fully-programmed cell. We show that it is possible to exploit these vulnerabilities on solid-state drives (SSDs) to alter the partially-programmed data, causing (potentially malicious) data corruption. Building on our experimental observations, we propose several new mechanisms for MLC NAND flash memory that eliminate or mitigate data corruption in partially-programmed cells, thereby removing or reducing the extent of the vulnerabilities, and at the same time increasing flash memory lifetime by 16%.

NAND flash memory is ubiquitous in everyday life today because its capacity has continuously increased and cost has continuously decreased over decades. This positive growth is a result of two key trends: 1) effective process technology scaling; and 2) multi-level (e.g., MLC, TLC) cell data coding. Unfortunately, the reliability of raw data stored in flash memory has also continued to become more difficult to ensure, because these two trends lead to 1) fewer electrons in the flash memory cell floating gate to represent the data; and 2) larger cell-to-cell interference and disturbance effects. Without mitigation, worsening reliability can reduce the lifetime of NAND flash memory. As a result, flash memory controllers in solid-state drives (SSDs) have become much more sophisticated: they incorporate many effective techniques to ensure the correct interpretation of noisy data stored in flash memory cells. In this article, we review recent advances in SSD error characterization, mitigation, and data recovery techniques for reliability and lifetime improvement. We provide rigorous experimental data from state-of-the-art MLC and TLC NAND flash devices on various types of flash memory errors, to motivate the need for such techniques. Based on the understanding developed by the experimental characterization, we describe several mitigation and recovery techniques, including 1) cell-to-cell interference mitigation; 2) optimal multi-level cell sensing; 3) error correction using state-of-the-art algorithms and methods; and 4) data recovery when error correction fails. We quantify the reliability improvement provided by each of these techniques. Looking forward, we briefly discuss how flash memory and these techniques could evolve into the future.

NAND flash memory is a widely used storage medium that can be treated as a noisy channel. Each flash memory cell stores data as the threshold voltage of a floating gate transistor. The threshold voltage can shift as a result of various types of circuit-level noise, introducing errors when data are read from the channel and ultimately reducing flash lifetime. An accurate model of the threshold voltage distribution across flash cells can enable mechanisms within the flash controller that improve channel reliability and device lifetime. Unfortunately, existing threshold voltage distribution models are either not accurate enough or have high computational complexity, which makes them unsuitable for online implementation within the controller. We propose a new low-complexity flash memory model, built upon a modified version of the Student's t-distribution and the power law, which captures the threshold voltage distribution and predicts future distribution shifts as wear increases. Using our experimental characterization of the state-of-the-art 1X-nm (i.e., 15-19 nm) multi-level cell NAND flash chips, we show that our model is highly accurate (with an average modeling error of 0.68%), and also simple to compute within the flash controller (requiring 4.41 times less computation time than the most accurate prior model, with negligible decrease in accuracy). Our model also predicts future threshold voltage distribution shifts with a 2.72% modeling error. We demonstrate several example applications of our model in the flash controller, which improve flash channel reliability significantly, including a new mechanism to predict the remaining lifetime of a flash device. Our evaluations for two of these applications show that our model: 1) helps improve flash memory lifetime by 48.9% and/or (2) enables the flash device to safely sustain 69.9% more write operations than manufacturer specifications. We hope and believe that the analyses and models developed in this paper can inspire other novel approaches to flash memory reliability and modeling.

NAND flash memory reliability continues to degrade as the memory is scaled down and more bits are programmed per cell. A key contributor to this reduced reliability is read disturb, where a read to one row of cells impacts the threshold voltages of unread flash cells in different rows of the same block. Such disturbances may shift the threshold voltages of these unread cells to different logical states than originally programmed, leading to read errors that hurt endurance. For the first time in open literature, this paper experimentally characterizes read disturb errors on state-of-the-art 2Y-nm (i.e., 20-24 nm) MLC NAND flash memory chips. Our findings (1) correlate the magnitude of threshold voltage shifts with read operation counts, (2) demonstrate how program/erase cycle count and retention age affect the read-disturb-induced error rate, and (3) identify that lowering pass-through voltage levels reduces the impact of read disturb and extend flash lifetime. Particularly, we find that the probability of read disturb errors increases with both higher wear-out and higher pass-through voltage levels. We leverage these findings to develop two new techniques. The first technique mitigates read disturb errors by dynamically tuning the pass-through voltage on a per-block basis. Using real workload traces, our evaluations show that this technique increases flash memory endurance by an average of 21%. The second technique recovers from previously-uncorrectable flash errors by identifying and probabilistically correcting cells susceptible to read disturb errors. Our evaluations show that this recovery technique reduces the raw bit error rate by 36%.

Retention errors, caused by charge leakage over time, are the dominant source of flash memory errors. Understanding, characterizing, and reducing retention errors can significantly improve NAND flash memory reliability and endurance. In this paper, we first characterize, with real 2y-nm MLC NAND flash chips, how the threshold voltage distribution of flash memory changes with different retention age - the length of time since a flash cell was programmed. We observe from our characterization results that 1) the optimal read reference voltage of a flash cell, using which the data can be read with the lowest raw bit error rate (RBER), systematically changes with its retention age, and 2) different regions of flash memory can have different retention ages, and hence different optimal read reference voltages. Based on our findings, we propose two new techniques. First, Retention Optimized Reading (ROR) adaptively learns and applies the optimal read reference voltage for each flash memory block online. The key idea of ROR is to periodically learn a tight upper bound, and from there approach the optimal read reference voltage. Our evaluations show that ROR can extend flash memory lifetime by 64% and reduce average error correction latency by 10.1%, with only 768 KB storage overhead in flash memory for a 512 GB flash-based SSD. Second, Retention Failure Recovery (RFR) recovers data with uncorrectable errors offline by identifying and probabilistically correcting flash cells with retention errors. Our evaluation shows that RFR reduces RBER by 50%, which essentially doubles the error correction capability, and thus can effectively recover data from otherwise uncorrectable flash errors.

Increased NAND flash memory density has come at the cost of lifetime reductions. Flash lifetime can be extended by relaxing internal data retention time, the duration for which a flash cell correctly holds data. Such relaxation cannot be exposed externally to avoid altering the expected data integrity property of a flash device. Reliability mechanisms, most prominently refresh, restore the duration of data integrity, but greatly reduce the lifetime improvements from retention time relaxation by performing a large number of write operations. We find that retention time relaxation can be achieved more efficiently by exploiting heterogeneity in write-hotness, i.e., the frequency at which each page is written. We propose WARM, a write-hotness aware retention management policy for flash memory, which identifies and physically groups together write-hot data within the flash device, allowing the flash controller to selectively perform retention time relaxation with little cost. When applied alone, WARM improves overall flash lifetime by an average of 3.24× over a conventional management policy without refresh, across a variety of real I/O workload traces. When WARM is applied together with an adaptive refresh mechanism, the average lifetime improves by 12.9×, 1.21× over adaptive refresh alone.

Continued scaling of NAND flash memory to smaller process technology nodes decreases its reliability, necessitating more sophisticated mechanisms to correctly read stored data values. To distinguish between different potential stored values, conventional techniques to read data from flash memory employ a single set of reference voltage values, which are determined based on the overall threshold voltage distribution of flash cells. Unfortunately, the phenomenon of program interference, in which a cell's threshold voltage unintentionally changes when a neighboring cell is programmed, makes this conventional approach increasingly inaccurate in determining the values of cells.

With continued scaling of NAND flash memory process technology and multiple bits programmed per cell, NAND flash reliability and endurance are degrading. Understanding, characterizing, and modeling the distribution of the threshold voltages across different cells in a modern multi-level cell (MLC) flash memory can enable the design of more effective and efficient error correction mechanisms to combat this degradation. We show the first published experimental measurement-based characterization of the threshold voltage distribution of flash memory. To accomplish this, we develop a testing infrastructure that uses the read retry feature present in some 2Y-nm (i.e., 20–24nm) flash chips. We devise a model of the threshold voltage distributions taking into account program/erase (P/E) cycle effects, analyze the noise in the distributions, and evaluate the accuracy of our model. A key result is that the threshold voltage distribution can be modeled, with more than 95% accuracy, as a Gaussian distribution with additive white noise, which shifts to the right and widens as P/E cycles increase. The novel characterization and models provided in this paper can enable the design of more effective error tolerance mechanisms for future flash memories.

As NAND flash memory continues to scale down to smaller process technology nodes, its reliability and endurance are degrading. One important source of reduced reliability is the phenomenon of program interference: when a flash cell is programmed to a value, the programming operation affects the threshold voltage of not only that cell, but also the other cells surrounding it. This interference potentially causes a surrounding cell to move to a logical state (i.e., a threshold voltage range) that is different from its original state, leading to an error when the cell is read. Understanding, characterizing, and modeling of program interference, i.e., how much the threshold voltage of a cell shifts when another cell is programmed, can enable the design of mechanisms that can effectively and efficiently predict and/or tolerate such errors. In this paper, we provide the first experimental characterization of and a realistic model for program interference in modern MLC NAND flash memory. To this end, we utilize the read-retry mechanism present in some state-of-the-art 2Y-nm (i.e., 20-24nm) flash chips to measure the changes in threshold voltage distributions of cells when a particular cell is programmed. Our results show that the amount of program interference received by a cell depends on 1) the location of the programmed cells, 2) the order in which cells are programmed, and 3) the data values of the cell that is being programmed as well as the cells surrounding it. Based on our experimental characterization, we develop a new model that predicts the amount of program interference as a function of threshold voltage values and changes in neighboring cells. We devise and evaluate one application of this model that adjusts the read reference voltage to the predicted threshold voltage distribution with the goal of minimizing erroneous reads. Our analysis shows that this new technique can reduce the raw flash bit error rate by 64% and thereby improve flash lifetime by 30%. We hope that the understanding and models developed in this paper lead to other error tolerance mechanisms for future flash memories.

As NAND flash memory manufacturers scale down to smaller process technology nodes and store more bits per cell, reliability and endurance of flash memory reduce. Wear-leveling and error correction coding can improve both reliability and endurance, but finding effective algorithms requires a strong understanding of flash memory error patterns. To enable such understanding, we have designed and implemented a framework for fast and accurate characterization of flash memory throughout its lifetime. This paper examines the complex flash errors that occur at 30-40nm flash technologies. We demonstrate distinct error patterns, such as cycle-dependency, location-dependency and value-dependency, for various types of flash operations. We analyze the discovered error patterns and explain why they exist from a circuit and device standpoint. Our hope is that the understanding developed from this characterization serves as a building block for new error tolerance algorithms for flash memory.

With the continued scaling of NAND flash and multi-level cell technology, flash-based storage has gained widespread use in systems ranging from mobile platforms to enterprise servers. However, the robustness of NAND flash cells is an increasing concern, especially at nanometer-regime process geometries. NAND flash memory bit error rate increases exponentially with the number of program/erase cycles. Stronger error correcting codes (ECC) can be used to tolerate higher error rates, but these have diminishing returns with increasing P/E cycles and can have prohibitively high power, area, and latency overheads. The goal of this paper is to develop new techniques that can tolerate high bit error rates without requiring prohibitively strong ECC. Our techniques, called Flash Correct-and-Refresh (FCR) exploit the observation that the dominant error source in NAND flash memory is retention errors, caused by flash cells losing charge over time. The key idea is to periodically read, correct, and reprogram (in-place) or remap the stored data before it accumulates more retention errors than can be corrected by simple ECC. Detailed simulations of a solid-state drive (SSD) storage system driven by measured experimental data from error characterization on real flash memory chips show that our techniques provide 46× average lifetime improvement on a variety of workloads at no additional hardware cost. We also find that our techniques achieve lifetime improvements that cannot feasibly be achieved with stronger ECC.

NAND flash memory has been widely used for data storage due to its high density, high throughput, low cost, and low power. However, as flash memory manufacturers scale to smaller process technologies and store more bits per cell, the reliability and endurance of flash memory are decreasing. Wear-leveling and error correction coding can significantly improve both reliability and endurance, but finding effective algorithms requires quick and accurate characterization of flash memory error patterns. To this end, we have designed and implemented an FPGA-based open framework for quick, accurate, and comprehensive characterization of flash memories. Using this framework, we characterized detailed error patterns of flash memory throughout its entire lifetime. Our implementation uses an error accelerator block to decrease the test time by 20x. Based on these results, we propose and evaluate a smart bad block management policy in flash translation layer to increase SSD lifetime by up to 51%.

NAND Flash memory has been widely used for data storage due to its high density, high throughput, low cost, and low power. However, as the storage cells become smaller and with more bits programmed per cell, they are expected to suffer from reduced reliability and limited endurance. Wear-leveling and signal processing can significantly improve both reliability and endurance. However, finding optimal algorithms would require a quick and accurate characterization of Flash memory providing an insight into the error patterns. To this end, we have designed and implemented an FPGA-based framework for quick, accurate, and comprehensive characterization of Flash memories to allow efficient algorithm explorations.

The Dly-ACK scheme is adopted in IEEE 802.15.3 high-rate WPANs to reduce the overhead of the ACK. Although Dly-ACK improves channel utilization, it also causes additional packet delays if not properly used, which is not good for delay sensitive video-dominating scenarios. In this paper, we first investigate the problems of applying Imm-ACK and fixed burst size Dly-ACK schemes for video streaming over IEEE 802.15.3 WPANs. It is shown that the performance of Imm-ACK degrades first and more quickly as the workload increases due to ACK overhead when the channel is good. N-Dly-ACK works quite well in favorable channel conditions, but it almost can not work when the channel quality is poor. Upon the analysis above, We propose an application-aware Dly-ACK algorithm for video streaming over 802.15.3 WPANs, which includes a frame based dynamic Dly-ACK burst size adjusting algorithm and a min-seq sending up algorithm. In order to evaluate the potential of our mechanism, extensive simulations are carried out. The results show that the proposed algorithm outperforms both Imm-ACK and fixed burst size Dly-ACK consistently over all simulated load levels and channel conditions in terms of fraction of decodable video frames