Accurate modeling of noise coupling effects due to crosstalk via the substrate is an increasingly important concern for the design and verification of mixed analog-digital systems. In this paper we present a technique to accelerate the model computation using BEM methods that can be used for accurate and efficient extraction of substrate coupling parameters in mixed-signal designs.

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effects in mixed-signal integrated circuits.

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigen-decomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effects in mixed-signal integrated circuits.