Demo Data from SIGIR 2026 / reviewers in the wild / expert
Jincheng Zhang 0001
dblp:96/6144-1
· DBLP profile ↗
16ranked-venue papers
2as first author
14since 2021 · last 2026
0000-0001-7332-6704ORCID · conflict
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 16 · 2 first-author · 14 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
14 papers |
Integrated circuit design · 92% Hardware reliability and fault tolerance · 6% Emerging computing paradigms · 2% | |
| Interdisciplinary, comprehensive, and emerging computing
1 paper |
Computational science and engineering · 100% |
Topics — the 22 heaviest of 24, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
power semiconductor devices |
4.1 | 7 | 2026 | 2.5 kV/674 MW/cm2 or 100 A/2 kV β-Ga2O3 heterojunction diodes with large surge current and small recovery time · Sci. China Inf. Sci. 2026 1.56 kV/30 A vertical β-Ga2O3 Schottky barrier diodes with composite edge terminations · Sci. China Inf. Sci. 2025 1.7 kV normally-off p-GaN gate high-electron-mobility transistors on a semi-insulating SiC substrate · Sci. China Inf. Sci. 2023 |
Integrated circuit design › semiconductor devices
GaN HEMT |
2.6 | 5 | 2026 | Coordinated B diffusion Gaussian distribution AlGaN/GaN HEMT device by quasi-van der Waals epitaxy · Sci. China Inf. Sci. 2026 1.7 kV normally-off p-GaN gate high-electron-mobility transistors on a semi-insulating SiC substrate · Sci. China Inf. Sci. 2023 Unidirectional p-GaN gate HEMT with composite source-drain field plates · Sci. China Inf. Sci. 2022 |
Integrated circuit design
analog and mixed-signal circuits |
2.4 | 4 | 2026 | First demonstration of heterogeneous integrated limiter chip with breakdown-enhanced GaN SBDs · Sci. China Inf. Sci. 2026 High-Al-composition AlGaN/GaN MISHEMT on Si with fT of 320 GHz · Sci. China Inf. Sci. 2024 Design and simulation of reverse-blocking Schottky-drain AlN/AlGaN HEMTs with drain field plate · Sci. China Inf. Sci. 2022 |
Integrated circuit design › semiconductor devices › diode
schottky barrier diodes |
1.5 | 2 | 2025 | 1.56 kV/30 A vertical β-Ga2O3 Schottky barrier diodes with composite edge terminations · Sci. China Inf. Sci. 2025 2.29-kV GaN-based double-channel Schottky barrier diodes on Si substrates with high VON uniformity · Sci. China Inf. Sci. 2023 |
Integrated circuit design › semiconductor devices › heterostructure devices
high electron mobility transistor |
1.3 | 2 | 2024 | High-Al-composition AlGaN/GaN MISHEMT on Si with fT of 320 GHz · Sci. China Inf. Sci. 2024 Design and simulation of reverse-blocking Schottky-drain AlN/AlGaN HEMTs with drain field plate · Sci. China Inf. Sci. 2022 |
Integrated circuit design
semiconductor device fabrication |
1.2 | 2 | 2026 | Coordinated B diffusion Gaussian distribution AlGaN/GaN HEMT device by quasi-van der Waals epitaxy · Sci. China Inf. Sci. 2026 2.29-kV GaN-based double-channel Schottky barrier diodes on Si substrates with high VON uniformity · Sci. China Inf. Sci. 2023 |
Integrated circuit design
emerging device technologies |
0.8 | 1 | 2024 | Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024 |
Integrated circuit design
power electronics |
0.8 | 1 | 2024 | Current collapse suppressed GaN diodes with 38 Watts high RF power rectifier capability · Sci. China Inf. Sci. 2024 |
Integrated circuit design › semiconductor devices › semiconductor device design
transistor design |
0.8 | 1 | 2024 | Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024 |
Hardware reliability and fault tolerance
radiation effects |
0.6 | 1 | 2022 | Investigation of heavy ion irradiation effects on 650-V p-GaN normally-off HEMTs · Sci. China Inf. Sci. 2022 |
Hardware reliability and fault tolerance › radiation effects
single event effects |
0.6 | 1 | 2022 | Investigation of heavy ion irradiation effects on 650-V p-GaN normally-off HEMTs · Sci. China Inf. Sci. 2022 |
Emerging computing paradigms
optical computing |
0.5 | 1 | 2021 | Recent progress of integrated circuits and optoelectronic chips · Sci. China Inf. Sci. 2021 |
Integrated circuit design
optoelectronic integrated circuits |
0.5 | 1 | 2021 | Recent progress of integrated circuits and optoelectronic chips · Sci. China Inf. Sci. 2021 |
Integrated circuit design
photonic integrated circuits |
0.5 | 1 | 2021 | Recent progress of integrated circuits and optoelectronic chips · Sci. China Inf. Sci. 2021 |
Integrated circuit design › semiconductor devices
semiconductor device physics |
0.4 | 2 | 2026 | First demonstration of heterogeneous integrated limiter chip with breakdown-enhanced GaN SBDs · Sci. China Inf. Sci. 2026 The mobility of two-dimensional electron gas in AlGaN/GaN heterostructures with varied Al content · Sci. China Ser. F Inf. Sci. 2008 |
Integrated circuit design › semiconductor device fabrication
epitaxy |
0.3 | 1 | 2026 | Coordinated B diffusion Gaussian distribution AlGaN/GaN HEMT device by quasi-van der Waals epitaxy · Sci. China Inf. Sci. 2026 |
Integrated circuit design › emerging device technologies
gallium oxide devices |
0.3 | 1 | 2025 | 1.56 kV/30 A vertical β-Ga2O3 Schottky barrier diodes with composite edge terminations · Sci. China Inf. Sci. 2025 |
Integrated circuit design
heterogeneous integration |
0.2 | 1 | 2024 | Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024 |
Integrated circuit design › 3d integration
monolithic 3d integration |
0.2 | 1 | 2024 | Two-dimensional materials for future information technology: status and prospects · Sci. China Inf. Sci. 2024 |
Integrated circuit design
semiconductor devices |
0.2 | 1 | 2024 | High-Al-composition AlGaN/GaN MISHEMT on Si with fT of 320 GHz · Sci. China Inf. Sci. 2024 |
Integrated circuit design › semiconductor devices
wide bandgap semiconductor devices |
0.2 | 1 | 2023 | 1.7 kV normally-off p-GaN gate high-electron-mobility transistors on a semi-insulating SiC substrate · Sci. China Inf. Sci. 2023 |
Computational science and engineering
finite element analysis |
0.1 | 1 | 2010 | Finite element analysis and optimization of temperature field in GaN-MOCVD reactor · Sci. China Inf. Sci. 2010 |
Methods — techniques the papers use, named apart from their topics
heterogeneous integration · 1.5quasi-van der waals epitaxy · 1.0machine learning for material growth · 0.8current collapse suppression · 0.8MISHEMT · 0.8device fabrication · 0.7p-gan gate · 0.6heavy ion irradiation testing · 0.6field plate · 0.6drain field plate · 0.6finite element analysis · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2026 | 2.5 kV/674 MW/cm2 or 100 A/2 kV β-Ga2O3 heterojunction diodes with large surge current and small recovery time
Yitao Feng, Guotao Tian, Yue Hao 0001, Jincheng Zhang 0001 |
Sci. China Inf. Sci. | 8 |
| 2026 | First demonstration of heterogeneous integrated limiter chip with breakdown-enhanced GaN SBDs
Jincheng Zhang 0001, Shudong Huo, Zhengxing Zhang, Mengjiao Xiang, Menghan Zheng, Yachao Zhang 0002, Xiufeng Song, Kui Dang, Yue Hao 0001 |
Sci. China Inf. Sci. | 1 |
| 2026 | Coordinated B diffusion Gaussian distribution AlGaN/GaN HEMT device by quasi-van der Waals epitaxy
Yanning Zhang 0001, Haidi Wu, Xinchen Ji, Zhichun Yang, Xinbo Zhang, Ling Bai, Juncheng Zheng, Yue Hao 0001, Jincheng Zhang 0001 |
Sci. China Inf. Sci. | 13 |
| 2025 | 1.56 kV/30 A vertical β-Ga2O3 Schottky barrier diodes with composite edge terminations
Yitao Feng, Sami Alghamdi, Guotao Tian, Saud Wasly, Yue Hao 0001, Jincheng Zhang 0001 |
Sci. China Inf. Sci. | 10 |
| 2024 | $\beta$-Ga2O3-on-SiC RF MOSFETs $\beta$abstractIn this letter, we demonstrate the ß-Ga2O3-on-SiC RF power MOSFETs with peak transconductance$(\mathrm{g}_{\mathrm{m},\max})$of 57 mS/mm, output power density$(\mathrm{P}_{\text{out}})/\text{power}$added efficiency (PAE) of 2.4 W/mm/27.4%and a peak PAE of 36.2%@2 GHz, benefiting from a heavily doped channel to reduce channel resistance and a high thermal conductivity SiC substrate to enhance heat dissipation. Meanwhile, we report the microwave noise characteristics of$\beta-\text{Ga}2\mathrm{O}_{3}$RF transistors with a low minimum-noise figure$(\text{NF}_{\min})$of 2.6 dB @2 GHz.$\beta-\text{Ga}2\mathrm{O}_{3}$-on-SiC RF power MOSFETs with heavily doped channel verify the great promise for future high voltage, high power and low noise RF applications. Jincheng Zhang 0001, Yue Hao 0001 |
TENCON | 3 |
| 2024 | Current collapse suppressed GaN diodes with 38 Watts high RF power rectifier capability
Kui Dang, Zhilin Qiu, Shudong Huo, Peng Zhan, Huining Liu, Yachao Zhang 0002, Jincheng Zhang 0001 |
Sci. China Inf. Sci. | 9 |
| 2024 | High-Al-composition AlGaN/GaN MISHEMT on Si with fT of 320 GHz
Hanghai Du, Lu Hao, Yachao Zhang 0002, Kui Dang, Zan Li 0001, Jincheng Zhang 0001, Yue Hao 0001 |
Sci. China Inf. Sci. | 10 |
| 2024 | Two-dimensional materials for future information technology: status and prospectsabstractAbstract Over the past 70 years, the semiconductor industry has undergone transformative changes, largely driven by the miniaturization of devices and the integration of innovative structures and materials. Two-dimensional (2D) materials like transition metal dichalcogenides (TMDs) and graphene are pivotal in overcoming the limitations of silicon-based technologies, offering innovative approaches in transistor design and functionality, enabling atomic-thin channel transistors and monolithic 3D integration. We review the important progress in the application of 2D materials in future information technology, focusing in particular on microelectronics and optoelectronics. We comprehensively summarize the key advancements across material production, characterization metrology, electronic devices, optoelectronic devices, and heterogeneous integration on silicon. A strategic roadmap and key challenges for the transition of 2D materials from basic research to industrial development are outlined. To facilitate such a transition, key technologies and tools dedicated to 2D materials must be developed to meet industrial standards, and the employment of AI in material growth, characterizations, and circuit design will be essential. It is time for academia to actively engage with industry to drive the next 10 years of 2D material research. Hao Qiu 0001, Zhihao Yu, Tiange Zhao, Mingsheng Xu, Taotao Li, Wenzhong Bao, Yang Chai, Shula Chen, Hui-Ming Cheng, Daoxin Dai, Zengfeng Di, Zhuo Dong, Xidong Duan, Yuhan Feng, Jingshu Guo, Pengwen Guo, Yue Hao 0001, Jingyi Hu, Weida Hu, Zehua Hu, Ali Imran 0004, Ziqiang Kong, Bilu Liu, Chunsen Liu, Guanyu Liu, Kaihui Liu, Donglin Lu, Likuan Ma, Feng Miao, Zhenhua Ni, Anlian Pan, Haowen Shu, Quanyang Tao, Ziao Tian, Haomin Wang 0005, Yeliang Wang, Haidi Wu, Hongzhao Wu, Jiangbin Wu, Yanqing Wu, Longfei Xia, Baixu Xiang, Luwen Xing, Qihua Xiong, Jeffrey Xu, Yang Xu 0035, Yuekun Yang, Jincheng Zhang 0001, Tao Zhang 0090, Xinbo Zhang, Chunsong Zhao, Yuda Zhao, Ting Zheng, Peng Zhou 0021, Shaohua Kevin Zhou, Deren Yang |
Sci. China Inf. Sci. | 88 |
| 2023 | 2.29-kV GaN-based double-channel Schottky barrier diodes on Si substrates with high VON uniformity
Ren Huang, Jincheng Zhang 0001, Chunxu Su, Liyu Fu, Yue Hao 0001 |
Sci. China Inf. Sci. | 3 |
| 2023 | 1.7 kV normally-off p-GaN gate high-electron-mobility transistors on a semi-insulating SiC substrate
Sheng-Lei Zhao, Jincheng Zhang 0001, Yachao Zhang 0002, Lansheng Feng, Xiufeng Song, Yixin Yao, Shengrui Xu, Yue Hao 0001 |
Sci. China Inf. Sci. | 2 |
| 2022 | Unidirectional p-GaN gate HEMT with composite source-drain field plates
Haiyong Wang, Shenglei Zhao, Yuanhao He, Jiabo Chen, Xuefeng Zheng, Chunfu Zhang, Jincheng Zhang 0001, Yue Hao 0001 |
Sci. China Inf. Sci. | 10 |
| 2022 | Investigation of heavy ion irradiation effects on 650-V p-GaN normally-off HEMTs
Yinhe Wu, Jincheng Zhang 0001, Shenglei Zhao, Zhaoxi Wu, Zhongxu Wang, Bo Mei, Dujun Zhao, Yue Hao 0001 |
Sci. China Inf. Sci. | 2 |
| 2022 | Design and simulation of reverse-blocking Schottky-drain AlN/AlGaN HEMTs with drain field plate
Dujun Zhao, Zhaoxi Wu, Bo Mei, Zhongxu Wang, Yinhe Wu, Shenglei Zhao, Jincheng Zhang 0001, Yue Hao 0001 |
Sci. China Inf. Sci. | 13 |
| 2021 | Recent progress of integrated circuits and optoelectronic chips
Yue Hao 0001, Genquan Han, Jincheng Zhang 0001, Xiaohua Ma 0001, Zhangming Zhu, Yanan Han, Ling Yang 0003, Jiangyi Shi, Wei Zhang 0343, Biao Pan, Yangqi Huang, Qi Liu 0010, Yimao Cai, Xin Ou, Tiangui You, Huaqiang Wu, Bin Gao 0006, Guoping Guo, Yonghua Chen, Xiangfei Chen, Chunlai Xue, Lixia Zhao, Xihua Zou, Lianshan Yan |
Sci. China Inf. Sci. | 4 |
| 2010 | Finite element analysis and optimization of temperature field in GaN-MOCVD reactor
Jincheng Zhang 0001, Yue Hao 0001, Peixian Li |
Sci. China Inf. Sci. | 1 |
| 2008 | The mobility of two-dimensional electron gas in AlGaN/GaN heterostructures with varied Al content
Yue Hao 0001, Jincheng Zhang 0001, JinYu Ni |
Sci. China Ser. F Inf. Sci. | 3 |