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Yi Wang 0020

dblp:17/221-20 · DBLP profile ↗
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2ranked-venue papers
0as first author
1since 2021 · last 2023
0000-0002-8726-402XORCID · verified

Domains — the database's venue-derived domains; a paper can count in several

Computer networks · 1Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer networks
1 paper
Physical-layer communications · 100%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 50% Reconfigurable computing and FPGAs · 50%
Human-computer interaction and pervasive computing
1 paper
Wearable and physiological sensing · 100%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Physical-layer communications
antenna design
0.712023
Circuits and Antennas Incorporating Gallium-Based Liquid Metal · Proc. IEEE 2023
Physical-layer communications › antenna systems › antenna theory
reconfigurable antenna
0.712023
Circuits and Antennas Incorporating Gallium-Based Liquid Metal · Proc. IEEE 2023
Integrated circuit design
radio-frequency circuit design
0.712023
Circuits and Antennas Incorporating Gallium-Based Liquid Metal · Proc. IEEE 2023
Reconfigurable computing and FPGAs › reconfigurable architecture
reconfigurable logic
0.712023
Circuits and Antennas Incorporating Gallium-Based Liquid Metal · Proc. IEEE 2023
Wearable and physiological sensing
flexible electronics
0.212023
Circuits and Antennas Incorporating Gallium-Based Liquid Metal · Proc. IEEE 2023

Methods — techniques the papers use, named apart from their topics

liquid metal actuation · 2.0fluidic channel fabrication · 2.0
YearPublicationVenuePosition
2023 Circuits and Antennas Incorporating Gallium-Based Liquid Metal
abstract
This article reviews the application and technology advancement of gallium (Ga)-based liquid metal (LM) in high-frequency circuits and antennas. It discusses the material properties of common LMs, the fluidic channels used to contain LM and their manufacturing techniques, and the actuation techniques, which are all critical for the design and implementation of LM-based devices. LM’s fluidic and pliable nature, together with its excellent electrical, thermal, and rheological (i.e., fluid flow) properties, provides some unique and innovative solutions to flexible/wearable electronics, reconfigurable circuits, and antennas. This article provides a comprehensive review of a wide range of LM-enabled high-frequency circuits and antennas, including interconnects and transitions, reconfigurable passive circuits (such as resonators, filters, and couplers), switches, phase shifters, reconfigurable antennas, flexible and wearable antennas, and metamaterials (i.e., periodic materials with properties not found in nature). This article presents various design concepts and implementation techniques, highlights key capabilities, and discusses the challenges and opportunities with the use of Ga-based LM materials.
Yi-Wen Wu, Shaker Alkaraki, Yi Wang 0020, James R. Kelly
Proc. IEEE4
2018 Ka-Band LTCC Stacked Substrate Integrated Waveguide Bandpass Filter
abstract
A Ka‐band substrate integrated waveguide bandpass filter has been designed and fabricated using low temperature co‐fired ceramic (LTCC) technology. The in‐house developed SICCAS‐K5F3 material with a permittivity of 6.2 and a loss tangent of 0.002 was used. The size and surface area of the proposed bandpass filter are reduced by exploiting vertical coupling in vertically laminated three‐dimensional structures. The coupling between adjacent cavities is realized by a narrow slot. A vertical transition structure between the coplanar‐waveguide feed line and the substrate integrated waveguide is adopted to facilitate the internal signal connection. The demonstrated third‐order filter has a compact size of 6.79 mm×4.13 mm×1.34 mm (0.63λ0 × 0.38λ0 × 0.12λ0) and exhibits good performance with a low insertion loss of 1.74 dB at 27.73 GHz and a 3 dB fractional bandwidth of 10 %.
Zhifu Liu, Mingsheng Ma, Yi Wang 0020
Wirel. Commun. Mob. Comput.4