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Susumu Sugiyama

dblp:72/4103 · DBLP profile ↗
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6ranked-venue papers
0as first author
0since 2021 · last 2011
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 4Systems, architecture and hardware · 3Applied, interdisciplinary, general and emerging computing · 2Graphics, computer vision, multimedia, augmented reality and games · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Artificial intelligence
2 papers
Robot manipulation · 100%
Computer architecture, parallel and distributed computing, and storage systems
2 papers
Embedded and real-time systems · 95% Integrated circuit design · 5%
Computer graphics and multimedia
1 paper
Virtual and augmented reality · 100%
Human-computer interaction and pervasive computing
1 paper
Haptics and multimodal interaction · 100%

Topics — the 8 heaviest of 8, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Robotics › Robot manipulation
tactile sensing
0.222011
Development and Analysis of a Sliding Tactile Soft Fingertip Embedded With a Microforce/Moment Sensor · IEEE Trans. Robotics 2011
Design of a small-scale tactile sensor with three sensing points for using in robotic fingertips · ICRA 2010
Robotics › Robot manipulation › tactile sensing
slip detection
0.112011
Development and Analysis of a Sliding Tactile Soft Fingertip Embedded With a Microforce/Moment Sensor · IEEE Trans. Robotics 2011
Embedded and real-time systems › sensor systems
tactile sensing
0.112010
Design of a small-scale tactile sensor with three sensing points for using in robotic fingertips · ICRA 2010
Robotics › Robot manipulation
dexterous manipulation
0.012011
Development and Analysis of a Sliding Tactile Soft Fingertip Embedded With a Microforce/Moment Sensor · IEEE Trans. Robotics 2011
Virtual and augmented reality
immersive interaction
0.012002
Development of Passive Elements with Variable Mechanical Impedance for Wearable Robots · ICRA 2002
Haptics and multimodal interaction
wearable haptic device
0.012002
Development of Passive Elements with Variable Mechanical Impedance for Wearable Robots · ICRA 2002
Robotics › Robot manipulation
grasping
0.012010
Design of a small-scale tactile sensor with three sensing points for using in robotic fingertips · ICRA 2010
Integrated circuit design
microelectromechanical systems
0.011998
Vacuum-sealed silicon micromachined pressure sensors · Proc. IEEE 1998

Methods — techniques the papers use, named apart from their topics

printed circuit board integration · 0.2micro force moment sensing · 0.2static and dynamic analysis · 0.1force/moment sensing · 0.1passive element design · 0.1thermal out-diffusion · 0.0low-pressure chemical vapor deposition · 0.0anodic bonding · 0.0
YearPublicationVenuePosition
2011 Development and Analysis of a Sliding Tactile Soft Fingertip Embedded With a Microforce/Moment Sensor
abstract
We describe the development of a tactile hemispherical soft fingertip (FT) of a size similar to that of a human thumb. The sensory core consists of a microscaled force/torque sensor that can output one component of force and two components of moment simultaneously, which was developed beforehand. This sensor is embedded in a polyurethane rubber hemispherical dome to form a complete soft, compliant, and perceptible robotic FT. This system is designed for easy fabrication, high reliability in outputting signals, and stable operation. Static and dynamic mathematical analyses were utilized to investigate the responses of the sensor during the typical sliding motion of an FT. This was followed by experiments to show its potential in tactile and texture recognition. Especially, incipient-slip detection, which is critical in grasping manipulations, can be assessed properly and in a timely way. The development of this tactile FT is considered significant in the field of dexterous manipulation.
Van Anh Ho, Dzung Viet Dao, Susumu Sugiyama, Shinichi Hirai
IEEE Trans. Robotics3
2010 Design of a small-scale tactile sensor with three sensing points for using in robotic fingertips
abstract
This paper describes our initial research on development of a tactile sensor, which can be employed in anthropomorphic soft fingertips, with multi-sensing points that uses 3-DOF micro force moment sensing chips (MFMS) which are able to measure forces up to nearly a Newton. Three sensing points are integrated on a compact printed circuit board with an in-built multiplexer circuit for the purpose of saving energy and reducing the number of outputs. This system was designed for the purpose of manipulating small-scaled objects, and realizing special characteristics of the objects such as distribution of edges/borders. The process including design, fabrication, and calibration will be explained in detail in this paper.
Van Anh Ho, Dzung Viet Dao, Susumu Sugiyama, Shinichi Hirai
ICRA3
2009 Analysis of sliding of a soft fingertip embedded with a novel micro force/moment sensor: Simulation, experiment, and application
abstract
We have investigated the deformation of a soft fingertip when it slides. This process was first simulated using the non-linear Finite Element Analysis (FEA) method. Based on the results of this simulation, we designed experiments to observe the sliding and object grasping of a soft fingertip, in which a 3-DOF (degree of freedom) micro force/moment sensor was embedded. With this sensor, forces and moments acting in the fingertip are measured based on the piezoresistive effect. These measurements provide information on the status of contact and sliding of a soft fingertip on a surface. Based on these results, incipient slip, which has an important role in object gripping by a robot manipulator, can be realized. Textile's texture recognition experiments were also conducted to assess potentials of the fingertip in tactile and texture perception.
Van Anh Ho, Dzung Viet Dao, Susumu Sugiyama, Shinichi Hirai
ICRA3
2008 Force/moment sensing during sliding motion using a micro sensor embedded in a soft fingertip
abstract
We have investigated the deformation of a soft fingertip when it slides. This process was first simulated using ANSYS software with non-linear Finite Element Analysis (FEA). Based on the results of this simulation, we designed experiments to observe the sliding and object grasping of a soft fingertip, in which, a 4-DOF (degree of freedom) micro force/moment sensor was embedded inside the soft fingertip. With this sensor, values of force and moment acting in the fingertip are measured, based on the piezoresistive effect. These measurements provide information on the status of contact and sliding of a soft fingertip on a surface. Based on these results, incipient slip, which has an important role in object gripping by a robot manipulator, can be realized.
Van Anh Ho, Dzung Viet Dao, Susumu Sugiyama, Shinichi Hirai
ICARCV3
2002 Development of Passive Elements with Variable Mechanical Impedance for Wearable Robots
abstract
A new type of passive element with variable mechanical impedance is proposed. Since the proposed elements are lighter, smaller and softer than the previous passive elements, these elements have the possibility to develop wearable robots. In the paper, the principles of the variable mechanical impedance are explained and the basic experimental results demonstrate the performance of the proposed element. Moreover, a wearable robot for virtual reality is developed by using the proposed element and it is shown that the developed wearable robot is utilized as a force display in the virtual world.
Sadao Kawamura, D. Ishida, Tetsuya Ogata, Y. Nakayama, Osamu Tabata, Susumu Sugiyama
ICRA7
1998 Vacuum-sealed silicon micromachined pressure sensors
abstract
Considerable progress in silicon pressure sensors has been made in recent years. This paper discusses three types of vacuum-sealed silicon micromachined pressure sensors that represent the present state of the art in this important area. The devices are a capacitive vacuum sensor, a surface-micromachined microdiaphragm pressure sensor, and a resonant pressure sensor. Vacuum sealing for these devices is accomplished using anodic bonding, films deposited using low-pressure chemical vapor deposition, and thermal out-diffusion of hydrogen, respectively. These sensors emphasize high sensitivity, small size, and excellent stability, respectively. The silicon-diaphragm vacuum sensor uses electrostatic force balancing to achieve a wide pressure measurement range.
Masayoshi Esashi, Susumu Sugiyama, Kyoichi Ikeda, Yuelin Wang, Haruzo Miyashita
Proc. IEEE2