Deploying Vision Transformer (ViT) models on edge devices poses significant challenges due to the high bandwidth, energy demands, and latency associated with transmitting large weight parameter sets to the sensing unit, along with limited on-chip memory resources, which are often insufficient for storing these parameters. To address these constraints, we present a software-hardware co-design framework that incorporates a novel in-sensor Compressed Weight Retrieval mechanism within an intelligent vision sensor. This framework offers two key contributions. First, we propose an innovative hardware-friendly weight compression algorithm that substantially reduces bandwidth and power consumption by optimizing on-chip memory usage for storing weight parameters. Second, we leverage the exceptional efficiency of Silicon Photonic (SiPh) devices and design a novel in-sensor accelerator called INSPIRE for the first time to perform in-sensor retrieval of the compressed weights and parallel fine-grained convolution operations next to the pixel array, enabling low-power adaptable ViT inference on resource-constrained edge platforms. Our extensive simulation results show that INSPIRE can remarkably reduce the memory footprint of ViT results with favorable accuracy. Besides, INSPIRE significantly reduces the bandwidth and power requirements associated with storing weight parameters in on-chip memory. INSPIRE achieves up to 245.4 Kilo FPS/W and reduces the data transfer energy by a factor of ∼11× on average compared with 4-bit quantized ViTs.

Edge sensing systems require front-end architectures that reduce data movement, latency, and energy before full downstream processing. This paper presents a mixed-signal implementation and system-level adaptation of an ADC-less ping-pong temporal sensor front-end for low-overhead frame-difference sensing. The underlying ping-pong PWM pixel principle is adopted from prior CMOS vision-sensor work; this paper does not claim the base ping-pong pixel concept itself as new. Instead, the contribution is the implementation, validation, and sensor-to-photonic interface adaptation of that temporal front-end. The adopted front-end uses odd/even phased analog state reuse and in-pixel temporal differencing to extract motion-relevant information before full-frame digitization. A PWM representation of temporal difference is digitized by a compact counter-based readout path, producing a DATA_VALID-qualified digital interface. Preliminary one-pixel mixed-signal results in a TSMC 0.18 μm environment demonstrate functionally correct operation, stable analog boundary waveforms, verified odd/even lane alternation, and repeatable interleaved 8-bit code capture. Simulation-extracted readout timing shows a 1.017 μs DATA_VALID window with zero odd/even overlap, while current architecture-level estimates indicate 70 μW to 75 μW total power and 700 fps to 1000 fps potential. The same front-end provides an electrical interface to a downstream near-sensor photonic processing stage, where temporally preprocessed outputs can be converted to optical activations rather than exporting raw image data.

Edge intelligence is rapidly shifting computation from centralized cloud infrastructure toward the point of data generation. This shift is especially important for visual sensing systems, where continuous streams of high-dimensional pixel data must be converted, stored, transmitted, and processed under strict energy and latency constraints. While processing-in-sensor and processing-near-sensor architectures have reduced data movement, they remain limited by analog-to-digital conversion, memory access, electronic bandwidth, and the difficulty of supporting increasingly complex models near the sensor. This invited paper argues that integrated photonics can provide a new substrate for edge processing by enabling high-bandwidth, low-latency, and naturally parallel analog computation close to the sensing interface. We review the basic principles of photonic computing and discuss how it can be used to realize near-sensor multiply-and-accumulate operations. We then use recent work from our group as representative case studies, including optical in-sensor acceleration, optical near-sensor acceleration with compressive acquisition, near-sensor neuro-symbolic photonic computing, and in-sensor compressed weight retrieval for vision transformers. These examples motivate a broader research agenda in which photonics is not only a fast accelerator for neural operations, but also a system-level enabler for data-centric, energy-aware, and real-time edge intelligence.

Silicon photonic devices are essential components of integrated optical communication systems and emerging photonic processors. However, their performance is notably impacted by fabrication-process variations (FPVs), which primarily stem from optical lithography imperfections. The impact of FPVs can accumulate and deteriorate the system-level performance through, for example, increasing system power consumption, accumulated crosstalk noise, and degrading signal integrity in photonic systems. In this paper, we discuss the promise of variation-aware design-space exploration and optimization to enhance photonic device robustness under different FPVs while considering two silicon photonic devices used widely in different applications, namely Microring Resonators (MRRs) and Mach-Zehnder Interferometers (MZIs). In addition, we consider a system-level case study of an MZI-based coherent neural network, where we show how our proposed variation-aware design optimization at the device level helps improve the network accuracy by up to 88% under FPVs.

Vision Transformers (ViTs) have emerged as a powerful architecture for computer vision tasks due to their ability to model long-range dependencies and global contextual relationships. However, their substantial compute and memory demands hinder efficient deployment in scenarios with strict energy and bandwidth limitations. In this work, we propose Opto-ViT, the first near-sensor, region-aware ViT accelerator leveraging silicon photonics (SiPh) for real-time and energy-efficient vision processing. Opto-ViT features a hybrid electronic-photonic architecture, where the optical core handles compute-intensive matrix multiplications using Vertical-Cavity Surface-Emitting Lasers (VCSELs) and Microring Resonators (MRs), while nonlinear functions and normalization are executed electronically. To reduce redundant computation and patch processing, we introduce a lightweight Mask Generation Network (MGNet) that identifies regions of interest in the current frame and prunes irrelevant patches before ViT encoding. We further co-optimize the ViT backbone using quantization-aware training and matrix decomposition tailored for photonic constraints. Experiments across device fabrication, circuit and architecture co-design, to classification, detection, and video tasks demonstrate that Opto-ViT achieves 100.4 KFPS/W with up to 84% energy savings with less than 1.6% accuracy loss, while enabling scalable and efficient ViT deployment at the edge.

Silicon photonics promises revolutionary advancements in communication and computing, leveraging the integration of photonic components onto silicon platforms. However, a critical challenge remains in achieving robust device performance under inevitable process variations inherent in CMOS fabrication. Existing design methodologies often fall short in assessing and mitigating the impact of these variations on device behavior, particularly in microring resonators (MRRs). To address this challenge, we present a novel, comprehensive workflow for designing process-variation-resilient silicon photonic MRRs, which we have integrated into a variation-aware design optimization framework called process variation analysis tool. Our approach seamlessly integrates process-variation robustness directly into the design phase, enabling early optimization of device performance characteristics. By exploring diverse process-variation scenarios, our workflow provides crucial insights into design tradeoffs and strategies for enhancing MRR robustness. Furthermore, we achieve this analysis efficiently through the use of compact models, striking a balance between accuracy and computational cost. This approach significantly reduces design cycles and resource requirements, offering a practical and cost-effective path toward optimizing MRR performance under real-world manufacturing conditions.

This paper proposes a high-performance and energy-efficient optical near-sensor accelerator for vision applications, called Lightator. Harnessing the promising efficiency offered by photonic devices, Lightator features innovative compressive acquisition of input frames and fine-grained convolution operations for low-power and versatile image processing at the edge for the first time. This will substantially diminish the energy consumption and latency of conversion, transmission, and processing within the established cloud-centric architecture as well as recently designed edge accelerators. Our device-to-architecture simulation results show that with favorable accuracy, Lightator achieves 84.4 Kilo FPS/W and reduces power consumption by a factor of ~24× and 73× on average compared with existing photonic accelerators and GPU baseline.

In the rapidly evolving landscape of artificial intelligence., large language models (LLMs) and graph processing have emerged as transformative technologies for natural language processing (NLP)., computer vision., and graph-structured data applications. However., the complex structures of these models pose challenges for acceleration on conventional electronic platforms. In this paper., we describe novel hardware accelerators based on silicon photonics to accelerate transformer neural networks that are used in LLMs and graph neural networks for graph data processing. Our analysis demonstrates that both hardware accelerators achieve at least$10.2\times$throughput improvement and$3.8\times$better energy efficiency over multiple state-of-the-art electronic hardware accelerators designed for LLMs and graph processing.

Targeting vision applications at the edge, in this work, we systematically explore and propose a high-performance and energy-efficient Optical In-Sensor Accelerator architecture called OISA for the first time. Taking advantage of the promising efficiency of photonic devices, the OISA intrinsically implements a coarse-grained convolution operation on the input frames in an innovative minimum-conversion fashion in low-bit-width neural networks. Such a design remarkably reduces the power consumption of data conversion, transmission, and processing in the conventional cloud-centric architecture as well as recently-presented edge accelerators. Our device-to-architecture simulation results on various image data-sets demonstrate acceptable accuracy while OISA achieves 6.68 TOp/s/W efficiency. OISA reduces power consumption by a factor of 7.9 and 18.4 on average compared with existing electronic in-/near-sensor and ASIC accelerators.

Traditional DRAM-based main memory systems face several challenges with memory refresh overhead, high latency, and low throughput as the industry moves towards smaller DRAM cells. These issues have been exacerbated by the emergence of data-intensive applications in recent years. Memories based on phase change materials (PCMs) offer promising solutions to these challenges. PCMs store data in the material's phase, which can shift between amorphous and crystalline states when external thermal energy is supplied. This is often achieved using electrical pulses. Alternatively, using laser pulses and integration with silicon photonics offers a unique opportunity to realize high-bandwidth and low-latency photonic memories. But to realize photonic memories, several challenges that are unique to the photonic domain such as crosstalk, optical loss management, and laser power overhead must be addressed. In this work, we present COMET, the first cross-layer optimized optical main memory architecture that uses PCMs. In architecting COMET, we explore how to use silicon photonics technology and PCMs together to design a large-scale main memory system while exploring related challenges and proposing solutions at the PCM cell, photonic memory circuit, and memory architecture levels. Based on our evaluations, COMET offers 5.l× better bandwidth (BW), 12.9× lower energy-per-bit (EPB), and 65.8x better BW/EPB than the best-known prior work on photonic main memory architecture design.

Heterogeneous 2.5D integration enables seamless integration of chiplets, hence reducing design time and costs. Concerns arise when dealing with untrustworthy chiplets, emphasizing the need for dependable Network-on-Interposer (NoI). This paper introduces SCRIPT, a secure routing framework to mitigate Distributed Denial-of-Service (DDoS) attacks in chiplet systems. SCRIPT obscures predictable paths exploited by attackers, disrupting orchestrated attacks. SCRIPT considers chiplet trust and criticality and employs a multi-objective optimization technique to enhance NoI performance and reliability. Evaluations show that SCRIPT enhances NoI security by at least 64% against DDoS attacks.

Large language models (LLMs) are foundational to the advancement of state-of-the-art natural language processing (NLP) and computer vision applications. However, their intricate architectures and the complexity of their underlying neural networks present significant challenges for efficient acceleration on conventional electronic platforms. Silicon photonics offers a compelling alternative. In this paper, we describe our recent efforts on developing a novel hardware accelerator that leverages silicon photonics to accelerate transformer neural networks integral to LLMs. Our evaluation demonstrates that the proposed accelerator delivers up to 14× higher throughput and 8× greater energy efficiency compared to leading-edge LLM hardware accelerators, including CPUs, GPUs, and TPUs.

Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and throughput demands. Even though modern digital electronic accelerators are gradually adopting 2.5D architectures with multiple smaller chiplets to improve scalability, they face fundamental limitations due to a reliance on slow metallic interconnects. This paper outlines how optical communication and computation can be leveraged in 2.5D platforms to realize energy-efficient and high throughput 2.5D ML accelerator architectures.

Recent advances in machine learning (ML) have spotlighted the pressing need for computing architectures that bridge the gap between memory bandwidth and processing power. The advent of deep neural networks has pushed traditional Von Neumann architectures to their limits due to the high latency and energy consumption costs associated with data movement between the processor and memory for these workloads. One of the solutions to overcome this bottleneck is to perform computation within the main memory through processing-in-memory (PIM), thereby limiting data movement and the costs associated with it. However, dynamic random-access memory-based PIM struggles to achieve high throughput and energy efficiency due to internal data movement bottlenecks and the need for frequent refresh operations. In this work, we introduce OPIMA, a PIM-based ML accelerator, architected within an optical main memory. OPIMA has been designed to leverage the inherent massive parallelism within main memory while performing high-speed, low-energy optical computation to accelerate ML models based on convolutional neural networks. We present a comprehensive analysis of OPIMA to guide design choices and operational mechanisms. In addition, we evaluate the performance and energy consumption of OPIMA, comparing it with conventional electronic computing systems and emerging photonic PIM architectures. The experimental results show that OPIMA can achieve$2.98\times $higher throughput and$137\times $better energy efficiency than the best known prior work.

2.5D integration offers a cost-effective and reliable solution for implementing large-scale modular systems. A 2.5D chiplet system can be designed by connecting smaller chiplets through an interposer, where the chiplets may have heterogeneous architectures. In addition to the intra-chiplet network (e.g., a network-on-chip on the chiplet), a network is used on the interposer to enable efficient and scalable communication among different chiplets. However, this global network, which consists of intra-chiplet and inter-chiplet networks, is susceptible to deadlock, despite using deadlock-free networks on the chiplets and interposer. Moreover, 2.5D networks are not only vulnerable to horizontal link (HL) faults but also to those in the vertical links (VLs) connecting the chiplets to the interposer. In addition, such faults cannot be effectively addressed by existing fault-tolerant routing techniques designed for 2D and 3D networks-on-chip. To overcome these challenges, this paper introduces a novel Reliable and Deadlock-free routing algorithm, called ReD, for fault-tolerant communication in 2.5D chiplet systems. ReD leverages a virtual-network-based approach to guarantee deadlock freedom while tolerating VL and HL faults. Besides VL faults, due to the difference in VL technology (i.e., microbump technology), the number of VLs connecting a chiplet to the interposer is limited, making VLs a source of congestion. ReD enhances VL selection in such scenarios to tolerate VL faults and improve network congestion by balancing VL utilization. Compared to the state-of-the-art routing algorithms, simulation results obtained by simulating chiplet systems under HL and VL faults demonstrate that ReD significantly improves the network reachability by up to 75% and reduces the network latency by up to 40%, while incurring less than 2% area overhead.

Domain-specific machine learning (ML) accelerators such as Google's TPU and Apple's Neural Engine now dominate CPUs and GPUs for energy-efficient ML processing. However, the evolution of electronic accelerators is facing fundamental limits due to the limited computation density of monolithic processing chips and the reliance on slow metallic interconnects. In this paper, we present a vision of how optical computation and communication can be integrated into 2.5D chiplet platforms to drive an entirely new class of sustainable and scalable ML hardware accelerators. We describe how cross-layer design and fabrication of optical devices, circuits, and architectures, and hardware/software codesign can help design efficient photonics-based 2.5D chiplet platforms to accelerate emerging ML workloads.

Transformer neural networks are rapidly being integrated into state-of-the-art solutions for natural language processing (NLP) and computer vision. However, the complex structure of these models creates challenges for accelerating their execution on conventional electronic platforms. We propose the first silicon photonic hardware neural network accelerator called TRON for transformer-based models such as BERT, and Vision Transformers. Our analysis demonstrates that TRON exhibits at least 14× better throughput and 8× better energy efficiency, in comparison to state-of-the-art transformer accelerators.

The integration of silicon photonics (SiPh) and phase change materials (PCMs) has created a unique opportunity to realize adaptable and reconfigurable photonic systems. In particular, the nonvolatile programmability in PCMs has made them a promising candidate for implementing optical memory systems. In this paper, we describe the design of an optical memory cell based on PCMs while exploring the design space of the cell in terms of PCM material choice (e.g., GST, GSST, Sb2Se3), cell bit capacity, latency, and power consumption. Leveraging this design-space exploration for the design of efficient optical memory cells, we present the design and implementation of an optical memory array and explore its scalability and power consumption when using different optical memory cells. We also identify performance bottlenecks that need to be alleviated to further scale optical memory arrays with competitive latency and energy consumption, compared to their electronic counterparts.

Emerging AI applications such as ChatGPT, graph convolutional networks, and other deep neural networks require massive computational resources for training and inference. Contemporary computing platforms such as CPUs, GPUs, and TPUs are struggling to keep up with the demands of these AI applications. Non-coherent optical computing represents a promising approach for light-speed acceleration of AI workloads. In this paper, we show how cross-layer design can overcome challenges in non-coherent optical computing platforms. We describe approaches for optical device engineering, tuning circuit enhancements, and architectural innovations to adapt optical computing to a variety of AI workloads. We also discuss techniques for hardware/ software co-design that can intelligently map and adapt AI software to improve performance on non-coherent platforms.

Silicon photonics (SiPh) has different applications, from enabling fast and high-bandwidth communication for high-performance computing systems to realizing energy-efficient optical computation for AI hardware accelerators. However, integrating SiPh with electronic sub-systems can introduce new security vulnerabilities that cannot be adequately addressed using existing hardware security solutions for electronic systems. This paper introduces SerIOS, the first framework aimed at enhancing hardware security in optoelectronic systems by leveraging the unique properties of optical lithography. SerIOS employs cryptographic keys generated based on imperfections in the optical lithography process and an online detection mechanism to detect attacks. Simulation and synthesis results demonstrate SerIOS's effectiveness in detecting and preventing attacks, with a small area footprint of less than 15% and a 100% detection rate across various attack scenarios and optoelectronic architectures, including photonic AI accelerators.

Unlike conventional 2D Networks-on-Chip (NoCs), 3D NoCs offer a scalable and energy efficient on-chip communication. Vertical die stacking of 3D NoCs is enabled using inter-layer Through-Silicon Via (TSV) links. However, TSV technology suffers from low reliability and high fabrication costs. To mitigate these costs, Partially Connected 3D NoCs (PC-3DNoCs), which use fewer vertical TSV links, have been introduced. However, with fewer vertical links (a.k.a. elevators), elevator-less routers will have to send their traffic to nearby elevators for inter-layer traffic, increasing the traffic load and congestion at these elevators and potentially reducing performance. Therefore, it is important that elevator-less routers choose elevators that balance the traffic load among the available elevators. To address this problem, this paper presents an ad aptive congestion- and energy-aware ele vator-selection algorithm, called AdEle+. AdEle+ employs an offline multi-objective simulated-annealing-based optimization to find good elevator subsets for routers. In addition, during high traffic loads, AdEle+ uses an adaptive and online elevator selection algorithm to select an elevator from the elevator subset to dynamically manage traffic congestion on elevators. Moreover, in low congestion circumstances, AdEle+ switches to a minimal distance selection to improve energy efficiency. Compared to state-of-the-art selection algorithms under various PC-3DNoC configurations and traffic patterns, AdEle+ reduces the average latency by 9.5% on average and up to 11.2% while reducing the hardware overhead by 10.1% due to its efficient online selection in the routers.

Graph neural networks (GNNs) have emerged as a powerful approach for modelling and learning from graph-structured data. Multiple fields have since benefitted enormously from the capabilities of GNNs, such as recommendation systems, social network analysis, drug discovery, and robotics. However, accelerating and efficiently processing GNNs require a unique approach that goes beyond conventional artificial neural network accelerators, due to the substantial computational and memory requirements of GNNs. The slowdown of scaling in CMOS platforms also motivates a search for alternative implementation substrates. In this paper, we present GHOST , the first silicon-photonic hardware accelerator for GNNs. GHOST efficiently alleviates the costs associated with both vertex-centric and edge-centric operations. It implements separately the three main stages involved in running GNNs in the optical domain, allowing it to be used for the inference of various widely used GNN models and architectures, such as graph convolution networks and graph attention networks. Our simulation studies indicate that GHOST exhibits at least 10.2 × better throughput and 3.8 × better energy efficiency when compared to GPU, TPU, CPU and multiple state-of-the-art GNN hardware accelerators.

Sparse neural networks can greatly facilitate the deployment of neural networks on resource-constrained platforms as they offer compact model sizes while retaining inference accuracy. Because of the sparsity in parameter matrices, sparse neural networks can, in principle, be exploited in accelerator architectures for improved energy-efficiency and latency. However, to realize these improvements in practice, there is a need to explore sparsity-aware hardware-software co-design. In this paper, we propose a novel silicon photonics-based sparse neural network inference accelerator called SONIC. SONIC takes advantage of the high energy-efficiency and low latency of photonic devices along with software co-optimization to accelerate sparse neural networks. Our experimental analysis shows that SONIC can achieve up to 5.8* better performance-per-watt and 8.4* lower energy-per-bit than state-of-the-art sparse electronic neural network accelerators; and up to 13.8* better performance-per-watt and 27.6* lower energy-per-bit than the best known photonic neural network accelerators.

By interconnecting smaller chiplets through an interposer, 2.5D integration offers a cost-effective and high-yield solution to implement large-scale modular systems. Nevertheless, the underlying network is prone to deadlock, despite deadlock-free chiplets, and to different faults on the vertical links used for connecting the chiplets to the interposer. Unfortunately, existing fault-tolerant routing techniques proposed for 2D and 3D on-chip networks cannot be applied to chiplet networks. To address these problems, this paper presents the first deadlock-free and fault-tolerant routing algorithm, called DeFT, for 2.5D integrated chiplet systems. DeFT improves the redundancy in vertical-link selection to tolerate faults in vertical links while considering net-work congestion. Moreover, DeFT can tolerate different vertical-link-fault scenarios while accounting for vertical-link utilization. Compared to the state-of-the-art routing algorithms in 2.5D chiplet systems, our simulation results show that DeFT improves network reachability by up to 75% with a fault rate of up to 25% and reduces the network latency by up to 40% for multi-application execution scenarios with less than 2% area overhead.

Compared to electronic accelerators, integrated silicon-photonic neural networks (SP-NNs) promise higher speed and energy efficiency for emerging artificial-intelligence applications. However, a hitherto overlooked problem in SP-NNs is that the underlying silicon photonic devices suffer from intrinsic optical loss and crosstalk noise, the impact of which accumulates as the network scales up. Leveraging precise device-level models, this paper presents the first comprehensive and systematic optical loss and crosstalk modeling framework for SP-NNs. For an SP-NN case study with two hidden layers and 1380 tunable parameters, we show a catastrophic ~84% drop in inferencing accuracy due to optical loss and crosstalk noise.

Parameter quantization in convolutional neural networks (CNNs) can help generate efficient models with lower memory footprint and computational complexity. But, homogeneous quantization can result in significant degradation of CNN model accuracy. In contrast, heterogeneous quantization represents a promising approach to realize compact, quantized models with higher inference accuracies. In this paper, we propose HQNNA, a CNN accelerator based on non-coherent silicon photonics that can accelerate both homogeneously quantized and heterogeneously quantized CNN models. Our analyses show that HQNNA achieves up to 73.8x better energy-per-bit and 159.5x better throughput-energy efficiency than state-of-the-art photonic CNN accelerators

2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics technology has shown great promise towards handling a high volume of traffic with low latency in intra-chip network-on-chip (NoC) fabrics. Although recent advances in silicon photonic devices have extended photonic NoCs to enable high bandwidth communication in 2.5D chiplet systems, such interposer-based photonic networks still suffer from high power consumption. In this work, we design and analyze a novel Reconfigurable power-efficient and congestion-aware Silicon-Photonic 2.5D Interposer network, called ReSiPI. Considering runtime traffic, ReSiPI is able to dynamically deploy inter-chiplet photonic gateways to improve the overall network congestion. ReSiPI also employs switching elements based on phase change materials (PCMs) to dynamically reconfigure and power-gate the photonic interposer network, thereby improving the network power efficiency. Compared to the best prior state-of-the-art 2.5D photonic network, ReSiPI demonstrates, on average, 37% lower latency, 25% power reduction, and 53% energy minimization in the network.

Photonic network-on-chip (PNoC) architectures employ photonic links with dense wavelength-division multiplexing (DWDM) to enable high throughput on-chip transfers. Unfortunately, increasing the DWDM degree (i.e., using a larger number of wavelengths) to achieve a higher aggregated data rate in photonic links and, hence, higher throughput in PNoCs, requires sophisticated and costly laser sources along with extra photonic hardware. This extra hardware can introduce undesired noise to the photonic link and increase the bit error rate (BER), power, and area consumption of PNoCs. To mitigate these issues, the use of 4-pulse amplitude modulation (4-PAM) signaling, instead of the conventional on-off keying (OOK) signaling, can halve the wavelength signals utilized in photonic links for achieving the target aggregate data rate while reducing the overhead of crosstalk noise, BER, and photonic hardware. There are various designs of 4-PAM modulators reported in the literature. For example, the signal superposition (SS)–, electrical digital-to-analog converter (EDAC)–, and optical digital-to-analog converter (ODAC)–based designs of 4-PAM modulators have been reported. However, it is yet to be explored how these SS-, EDAC-, and ODAC-based 4-PAM modulators can be utilized to design DWDM-based photonic links and PNoC architectures. In this article, we provide a systematic analysis of the SS, EDAC, and ODAC types of 4-PAM modulators from prior work with regards to their applicability and utilization overheads. We then present a heuristic-based search method to employ these 4-PAM modulators for designing DWDM-based SS, EDAC, and ODAC types of 4-PAM photonic links with two different design goals: (i) to attain the desired BER of 10 -9 at the expense of higher optical power and lower aggregate data rate and (ii) to attain maximum aggregate data rate with the desired BER of 10 -9 at the expense of longer packet transfer latency. We then employ our designed 4-PAM SS–, 4-PAM EDAC–, 4-PAM ODAC–, and conventional OOK modulator–based photonic links to constitute corresponding variants of the well-known CLOS and SWIFT PNoC architectures. We eventually compare our designed SS-, EDAC-, and ODAC-based variants of 4-PAM links and PNoCs with the conventional OOK links and PNoCs in terms of performance and energy efficiency in the presence of inter-channel crosstalk. From our link-level and PNoC-level evaluation, we have observed that the 4-PAM EDAC–based variants of photonic links and PNoCs exhibit better performance and energy efficiency compared with the OOK-, 4-PAM SS–, and 4-PAM ODAC–based links and PNoCs.

Silicon photonic microring resonators (MRRs) offer many advantages (e.g., compactness) and are often considered as the fundamental building block in optical interconnects and emerging photonic nanoprocessors and accelerators. Such devices are, however, sensitive to inevitable fabrication-process variations (FPVs) stemming from optical lithography imperfections. Consequently, silicon photonic integrated circuits (PICs) integrating MRRs often suffer from high power overhead required to compensate for the impact of FPVs on MRRs and, hence, realizing a reliable operation. On the other hand, the design space of MRRs is complex, including several correlated design parameters, thereby further exacerbating the design optimization of MRRs under FPVs. In this article, we present, for the first time, a comprehensive design-space exploration in passive and active MRRs under FPVs. In addition, we present design optimization in MRRs under FPVs while considering different performance metrics, such as tolerance to FPVs, quality factor, and 3-dB bandwidth in MRRs. Simulation and fabrication results obtained by measuring multiple fabricated MRRs designed using our design-space exploration demonstrate a significant 70% improvement on average in the MRRs’ tolerance to different FPVs. Furthermore, we apply the proposed design optimization to a case study of a wavelength-selective MRR-based demultiplexer, where we show considerable channel-spacing accuracy within 0.5 nm even when the MRRs are placed 500$\mu \text{m}$apart on a chip. Such improvements indicate the efficiency of the proposed design-space exploration and optimization to enable power-efficient and variation-resilient PICs and optical interconnects integrating MRRs.

Domain-specific neural network accelerators have seen growing interest in recent years due to their improved energy efficiency and performance compared to CPUs and GPUs. In this paper, we propose a novel cross-layer optimized neural network accelerator called CrossLight that leverages silicon photonics. CrossLight includes device-level engineering for resilience to process variations and thermal crosstalk, circuit-level tuning enhancements for inference latency reduction, and architecture-level optimizations to enable better resolution, energy-efficiency, and throughput. On average, CrossLight offers 9.5x lower energy-per-bit and 15.9x higher performance-per-watt than state-of-the-art photonic deep learning accelerators.

By lowering the number of vertical connections in fully connected 3D networks-on-chip (NoCs), partially connected 3D NoCs (PC-3DNoCs) help alleviate reliability and fabrication issues. This paper proposes a novel, adaptive congestion- and energy-aware elevator-selection scheme called AdEle to improve the traffic distribution in PC-3DNoCs. AdEle employs an offline multi-objective simulated-annealing-based algorithm to find good elevator subsets and an online elevator selection policy to enhance elevator selection during routing. Compared to the state-of-the-art techniques under different real-application traffics and configuration scenarios, AdEle improves the network latency by 10.9% on average (up to 14.6%) with less than 6.9% energy consumption overhead.

Silicon-photonic neural networks (SPNNs) offer substantial improvements in computing speed and energy efficiency compared to their digital electronic counterparts. However, the energy efficiency and accuracy of SPNNs are highly impacted by uncertainties that arise from fabrication-process and thermal variations. In this paper, we present the first comprehensive and hierarchical study on the impact of random uncertainties on the classification accuracy of a Mach-Zehnder Interferometer (MZI)-based SPNN. We show that such impact can vary based on both the location and characteristics (e.g., tuned phase angles) of a non-ideal silicon-photonic device. Simulation results show that in an SPNN with two hidden layers and 1374 tunable-thermal-phase shifters, random uncertainties even in mature fabrication processes can lead to a catastrophic 70% accuracy loss.

Next-generation multiprocessor systems point to the integration of a large number of cores (e.g., processing and memory) where electrical networks-on-chip (eNoCs) can improve the communication performance. As the number of integrated cores increases, metallic interconnect in eNoCs becomes a bottleneck, leading to communication performance degradation and increased power consumption. Optical interconnection networks (OINs) have emerged to outperform the communication infrastructure in multiprocessor systems. Nevertheless, OINs’ full capability is curbed by high latency electrical controllers required to orchestrate and (re)configure the underlying photonic components, realizing a path between sending and receiving cores. Control techniques impose a high latency to perform the network routing, limiting the full utilization of OINs. In this paper, we design a novel low-latency Hybrid Controller (HyCo) that employs acceleration techniques to reduce its execution time. HyCo is developed based on integrating centralized and distributed control techniques as well as by using pre-calculated network routes and a Bloom filter, all of which result in a considerable reduction in HyCo’s latency. Simulation and prototyping results for networks up to 64×64 indicate a latency smaller than 50 ns, in the worst-case scenario.

Deep learning has led to unprecedented successes in solving some very difficult problems in domains such as computer vision, natural language processing, and general pattern recognition. These achievements are the culmination of decades-long research into better training techniques and deeper neural network models, as well as improvements in hardware platforms that are used to train and execute the deep neural network models. Many application-specific integrated circuit (ASIC) hardware accelerators for deep learning have garnered interest in recent years due to their improved performance and energy-efficiency over conventional CPU and GPU architectures. However, these accelerators are constrained by fundamental bottlenecks due to (1) the slowdown in CMOS scaling, which has limited computational and performance-per-watt capabilities of emerging electronic processors; and (2) the use of metallic interconnects for data movement, which do not scale well and are a major cause of bandwidth, latency, and energy inefficiencies in almost every contemporary processor. Silicon photonics has emerged as a promising CMOS-compatible alternative to realize a new generation of deep learning accelerators that can use light for both communication and computation. This article surveys the landscape of silicon photonics to accelerate deep learning, with a coverage of developments across design abstractions in a bottom-up manner, to convey both the capabilities and limitations of the silicon photonics paradigm in the context of deep learning acceleration.

Domain specific neural network accelerators have garnered attention because of their improved energy efficiency and inference performance compared to CPUs and GPUs. Such accelerators are thus well suited for resource-constrained embedded systems. However, mapping sophisticated neural network models on these accelerators still entails significant energy and memory consumption, along with high inference time overhead. Binarized neural networks (BNNs), which utilize single-bit weights, represent an efficient way to implement and deploy neural network models on accelerators. In this paper, we present a novel optical-domain BNN accelerator, named ROBIN , which intelligently integrates heterogeneous microring resonator optical devices with complementary capabilities to efficiently implement the key functionalities in BNNs. We perform detailed fabrication-process variation analyses at the optical device level, explore efficient corrective tuning for these devices, and integrate circuit-level optimization to counter thermal variations. As a result, our proposed ROBIN architecture possesses the desirable traits of being robust, energy-efficient, low latency, and high throughput, when executing BNN models. Our analysis shows that ROBIN can outperform the best-known optical BNN accelerators and many electronic accelerators. Specifically, our energy-efficient ROBIN design exhibits energy-per-bit values that are ∼4 × lower than electronic BNN accelerators and ∼933 × lower than a recently proposed photonic BNN accelerator, while a performance-efficient ROBIN design shows ∼3 × and ∼25 × better performance than electronic and photonic BNN accelerators, respectively.

The approximate computing paradigm advocates for relaxing accuracy goals in applications to improve energy-efficiency and performance. Recently, this paradigm has been explored to improve the energy-efficiency of silicon photonic networks-on-chip (PNoCs). Silicon photonic interconnects suffer from high power dissipation because of laser sources, which generate carrier wavelengths, and tuning power required for regulating photonic devices under different uncertainties. In this article, we propose a framework called AppRoXimation framework for On-chip photonic Networks (ARXON) to reduce such power dissipation overhead by enabling intelligent and aggressive approximation during communication over silicon photonic links in PNoCs. Our framework reduces laser and tuning-power overhead while intelligently approximating communication, such that application output quality is not distorted beyond an acceptable limit. Simulation results show that our framework can achieve up to 56.4% lower laser power consumption and up to 23.8% better energy-efficiency than the best-known prior work on approximate communication with silicon photonic interconnects and for the same application output quality.

With the ever growing complexity of high-performance computing (HPC) systems to satisfy emerging application requirements (e.g., high memory bandwidth requirement for machine learning applications), the performance bottleneck in such systems has moved from being computation-centric to be more communication-centric. Silicon photonic interconnection networks have been proposed to address the aggressive communication requirements in HPC systems, to realize higher bandwidth, lower latency, and better energy efficiency. There have been many successful efforts on developing silicon photonic devices, integrated circuits, and architectures for HPC systems. Moreover, many efforts have been made to address and mitigate the impact of different challenges (e.g., fabrication process and thermal variations) in silicon photonic interconnects. However, most of these efforts have focused only on a single design layer in the system design space (e.g., device, circuit or architecture level). Therefore, there is often a gap between what a design technique can improve in one layer, and what it might impair in another one. In this paper, we discuss the promise of cross-layer design methodologies for HPC systems integrating silicon photonic interconnects. In particular, we discuss how such cross-layer design solutions based on cooperatively designing and exchanging design objectives among different system design layers can help achieve the best possible performance when integrating silicon photonics into HPC systems.

Microring resonators (MRRs) are very often considered as the primary building block in silicon photonic integrated circuits (PICs). Despite many advantages, MRRs are considerably sensitive to fabrication non-uniformity (a.k.a. fabrication process variations), necessitating the use of power-hungry compensation methods (e.g., thermal tuning) to guarantee their reliable operation. Moreover, the design space of MRRs is complicated and includes several highly correlated design parameters, preventing designers from easily exploring and optimizing the design of MRRs against fabrication process variations (FPVs). In this paper, for the first time, we present a comprehensive design space exploration and optimization of MRRs against FPVs. In particular, we indicate how physical design parameters in MRRs can be optimized during design time to enhance their tolerance to FPVs while also improving the insertion loss and quality factor in such devices. Fabrication results obtained by measuring multiple fabricated MRRs designed using our design optimization solution demonstrate a significant 70% improvement on average in MRRs tolerance to different FPVs. Such improvement indicates the efficiency of our novel design optimization solution in reducing the tuning power required for reliable operation of MRRs.

The approximate computing paradigm advocates for relaxing accuracy goals in applications to improve energy-efficiency and performance. Recently, this paradigm has been explored to improve the energy efficiency of silicon photonic networks-on-chip (PNoCs). In this paper, we propose a novel framework (LORAX) to enable more aggressive approximation during communication over silicon photonic links in PNoCs. This is the first work that considers loss-aware laser power management and multilevel signaling to enable effective data approximation and energy-efficiency in PNoCs. Simulation results show that our framework can achieve up to 31.4% lower laser power consumption and up to 12.2% better energy efficiency than the best known prior work on approximate communication in PNoCs, for the same application output quality.

Wavelength-routed optical network-on-chip (WRONoC) design consists of topological and physical synthesis. It covers many interacting design aspects such as wavelength assignment, message routing, network construction, component placement, and waveguide routing. Due to the high complexity of the design problem, current manual design usually trades optimality for scalability and feasibility, which results in performance degradation and waste of resources. In this paper, we will present an overview of the existing design automation approaches that have demonstrated their effectiveness in customizing and optimizing application-specific WRONoC designs, and of the potential design automation directions to address a wider range of design challenges. We will also discuss the advantages of comprehensive optimization considering multiple design aspects simultaneously, and the possible barriers that need to be removed to achieve this goal.

No abstract available.

Silicon photonic interconnects (SPIs) have emerged as a promising solution to outperform the communication infrastructure in multiprocessor systems-on-chip (MPSoCs). Routing a message from one node to another in an MPSoC integrating SPIs, several photonic components (e.g., switching elements) need to be configured to realize an optical path between sending and receiving nodes. Such configurations are performed in an electronic controller, which, if not fast, imposes high latency in SPIs, constraining the application of SPIs in MPSoCs. Realizing a full exploitation of SPIs, this paper presents a look-up-table-based centralized controller (LUCC). We indicate that LUCC has the lowest latency among the state-of-the-art controllers for SPIs while it can be applied to different SPI architectures. Employing acceleration techniques based on off-line routings, we report (simulation and prototyping) a worst-case control latency smaller than 5 ns. Moreover, LUCC is experimentally integrated with a photonic switch in the lab, where we show contention resolution in one clock cycle.

This paper presents an efficient device-level design method to enhance the performance and reliability (DeEPeR) in optical interconnection networks (OINs) under fabrication process variations (PV). Considering different range of variations, DeEPeR explores the design space of fundamental optical components in OINs (e.g., microresonators (MRs)) to improve the overall system performance and reliability. Our study also includes the design and fabrication of several MRs to experimentally validate our proposed method. Moreover, as a system-level case study, we apply DeEPeR to a general passive OIN under PV. Results indicate that DeEPeR considerably improves the optical signal-to-noise ratio (OSNR) in optical interconnection networks.

Recently, interchip/intrachip optical interconnection networks have been proposed for ultrahigh-bandwidth and low-latency communications. These networks employ the microresonators (MRs) to modulate, direct, or detect the optical signal. However, utilized MRs suffer from intrinsic crosstalk noise and signal power loss, degrading the network efficiency via the signal-to-noise ratio (SNR). The amount of crosstalk noise and signal power loss may differ from network to network. Hence, there exists a need to systematically analyze the effect of the crosstalk noise and the power loss issues. In this paper, we have developed the analytical models considering both coherent and incoherent crosstalk for both the interchip and intrachip optical networks. The interchip/intrachip optical interconnection networks—the$\text{I}^{2}$CON—are analyzed as a case study. The quantitative results on the individual networks have demonstrated that the architectural design determines the impact of crosstalk on the SNR. We have also demonstrated that the optical interconnection networks with interchip/intrachip interconnects result in better bit error rate (BER) compared with that of only intrachip interconnect. Our analyses of the worst case can be utilized as a platform to compare the realistic performance among different optical interconnection networks via the degradation of SNR/BER and data bandwidth.

Optical networks-on-chip (ONoCs) have shown the potential to be substituted for electronic networks-on-chip (NoCs) to bring substantially higher bandwidth and more efficient power consumption in both on- and off-chip communication. However, basic optical devices, which are the key components in constructing ONoCs, experience inevitable crosstalk noise and power loss; the crosstalk noise from the basic devices accumulates in large-scale ONoCs and considerably hurts the signal-to-noise ratio (SNR) as well as restricts the network scalability. For the first time, this paper presents a formal system-level analytical approach to analyze the worst-case crosstalk noise and SNR in arbitrary fat-tree-based ONoCs. The analyses are performed hierarchically at the basic optical device level, then at the optical router level, and finally at the network level. A general 4$\,\times\,$4 optical router model is considered to enable the proposed method to be adaptable to fat-tree-based ONoCs using an arbitrary 4$\,\times\,$4 optical router. Utilizing the proposed general router model, the worst-case SNR link candidates in the network are determined. Moreover, we apply the proposed analyses to a case study of fat-tree-based ONoCs using an optical turnaround router (OTAR). Quantitative simulation results indicate low values of SNR and scalability constraints in large scale fat-tree-based ONoCs, which is due to the high power of crosstalk noise and power loss. For instance, in fat-tree-based ONoCs using the OTAR, when the injection laser power equals 0 dBm, the crosstalk noise power is higher than the signal power when the number of processor cores exceeds 128; when it is equal to 256, the signal power, crosstalk noise power, and SNR are${-}{17.3}$,${-}{11.9}$, and${-}{\rm 5.5}~{\rm dB}$, respectively.

Optical networks-on-chip (ONoCs) using wavelength-division multiplexing (WDM) technology have progressively attracted more and more attention for their use in tackling the high-power consumption and low bandwidth issues in growing metallic interconnection networks in multiprocessor systems-on-chip. However, the basic optical devices employed to construct WDM-based ONoCs are imperfect and suffer from inevitable power loss and crosstalk noise. Furthermore, when employing WDM, optical signals of various wavelengths can interfere with each other through different optical switching elements within the network, creating crosstalk noise. As a result, the crosstalk noise in large-scale WDM-based ONoCs accumulates and causes severe performance degradation, restricts the network scalability, and considerably attenuates the signal-to-noise ratio (SNR). In this paper, we systematically study and compare the worst case as well as the average crosstalk noise and SNR in three well-known optical interconnect architectures, mesh-based, folded-torus-based, and fat-tree-based ONoCs using WDM. The analytical models for the worst case and the average crosstalk noise and SNR in the different architectures are presented. Furthermore, the proposed analytical models are integrated into a newly developed crosstalk noise and loss analysis platform (CLAP) to analyze the crosstalk noise and SNR in WDM-based ONoCs of any network size using an arbitrary optical router. Utilizing CLAP, we compare the worst case as well as the average crosstalk noise and SNR in different WDM-based ONoC architectures. Furthermore, we indicate how the SNR changes in respect to variations in the number of optical wavelengths in use, the free-spectral range, and the microresonators$\boldsymbol {Q}$factor. The analyses’ results demonstrate that the crosstalk noise is of critical concern to WDM-based ONoCs: in the worst case, the crosstalk noise power exceeds the signal power in all three WDM-based ONoC architectures, even when the number of processor cores is small, e.g., 64.

By integrating multiple processing units (PUs) and memories on a single chip, multiprocessor system-on-chip (MPSoC) can provide higher performance per energy and lower cost per function to applications with growing complexity. On the other hand, shrinking feature sizes and reducing power supply voltages also make MPSoCs more susceptible to various reliability threats, such as power/ground (P/G) noises. Power gating is an effective technique to minimize leakage power. However, it also introduces significant P/G noises in MPSoCs. With significant area, power and performance overheads, traditional methods rely on reinforced circuits or fixed protection strategies to reduce P/G noises caused by power gating. In this paper, we propose a systematic approach to actively alleviating P/G noises using the parasitic capacitance of on-chip memories through sensor network on-chip (SENoC). We use the parasitic capacitance of on-chip memories as dynamic decoupling capacitance to suppress P/G noises and develop a detailed HSPICE model for related study. SENoC is developed to not only monitor and report P/G noises, but also coordinate PUs and memories to alleviate such transient threats at run time. Extensive evaluations show that compared with traditional method, our approach saves 12.6%–62.8% energy consumption and achieves 14.3%–69.8% performance improvement for different applications and MPSoCs with different scales. We implement the circuit details of our approach and show its low area and energy consumption overheads.

Manycore processor system is becoming an attractive platform for applications seeking both high performance and high energy efficiency. However, huge communication demands among cores, large power density, and low process yield will be three significant limitations for the scalability of future manycore processors. Breaking a large chip into multiple smaller ones can alleviate the problems of power density and yield, but would worsen the problem of communication efficiency due to the limited off-chip bandwidth. In response, we propose an inter/intra-chip optical network, which will not only fulfill the intra-chip communication requirements but also address the inter-chip communication, by exploiting the advantages of optical links with high bandwidth and energy efficiency. The network is composed of an inter-chip subnetwork and multiple intra-chip subnetworks, and the subnetworks closely coordinate with each other to balance the traffic. The proposed network effectively explores the distinctive properties of optical signals and photonic devices, and dynamically partitions each data channel into multiple sections. Each section can be utilized independently to boost performance as well as reduce energy consumption. Simulation results show that our network can achieve higher throughput with lower power consumption than alternative designs under most of synthetic traffics and real applications.

Basic photonic devices in inter- and intra-chip optical networks suffer from inevitable power loss and crosstalk noise. Incoherent crosstalk introduces quick power fluctuations, while coherent crosstalk varies the optical power of the optical signal in optical interconnection networks (OINs). As a result, the accumulative crosstalk in large scale OINs considerably hurts the signal-to-noise ratio (SNR) and imposes high power penalties. In this work, we aim at studying the worst-case incoherent and coherent crosstalk in OINs at the system level. The proposed analytical models are integrated into a newly developed crosstalk and loss analysis platform, called CLAP, to facilitate the SNR analyses in arbitrary OINs.

As transistor density continues to increase with the advent of nanotechnology, reliability issues raised by the more frequent appearance of soft errors are becoming critical for future embedded multiprocessor systems design. State-of-the-art techniques for soft error protections targeting multiprocessor systems result either high chip cost and area overhead or high performance degradation and energy consumption, and do not fulfill the increasing requirements for high performance and dependability. In this article we present a systematic approach, that is, the Sensor Networks-on-Chip (SENoC), to collaboratively and efficiently manage on-chip applications and overcome reliability threats to Multiprocessor Systems-on-Chip (MPSoC). A hardware-software collaborative approach is proposed to solve soft error problems: a hardware-based on-chip sensor network is built for soft error detection, and a software-based recovery mechanism is applied for soft error correction. A two-step scheduling scheme is presented for reliable application and chip management, combining an off-line static optimization stage for application performance maximization and an online lightweight dynamic adjustment stage to handle runtime variations and exceptions. This strategy introduces only trivial overhead on hardware design and much lower overhead on software control and execution, and hence performance degradation and energy consumption is greatly reduced. We build a cycle-accurate simulator using SystemC, and verify the effectiveness of our technique by comparing performance with related techniques on several real-world applications.

Chip multiprocessor (CMP) is becoming an attractive platform for applications seeking both high performance and high energy efficiency. In large-scale CMPs, the communication efficiency among cores is crucial for the overall system performance and energy consumption. In this article, we propose a ring-based optical network-on-chip, called SUOR, to fulfill the communication requirement of CMPs. SUOR effectively explores the distinctive properties of optical signals and photonic devices, and dynamically partitions each data channel into multiple sections. Each section can be utilized independently to boost performance as well as reduce energy consumption. We develop a set of distributed control protocols and algorithms for SUOR, but physically allocate the corresponding cluster agents close to each other to benefit from the strengths of optical interconnects at long distances as well as electrical interconnects at short distances. Simulation results show that SUOR outperforms the alternative optical networks under a wide range of traffic patterns. For example, compared with MWSR design, SUOR achieves 2.58× throughput as well as saves 64% energy consumption on average in a 256-core CMP. Compared with MWMR design, SUOR achieves 1.52× throughput and reduces 73% energy consumption on average.

Chip multiprocessor (CMP) is becoming increasingly popular in the processor industry. Efficient network-on-chip (NoC) that has similar performance to the processor cores is important in CMP design. Fat-tree-based on-chip network has many advantages over traditional mesh or torus-based networks in terms of throughput, power efficiency, and latency. It has a bright future in the development of CMP. However, the floorplan design of the fat-tree-based NoC is very challenging because of the complexity of topology. There are a large number of crossings and long interconnects, which cause severe performance degradation in the network. In electronic NoCs, the parasitic capacitance and inductance will be significant. In optical ones, large crosstalk noise and power loss will be introduced. The novel contribution of this paper is to propose a method to optimize the fat-tree floorplan, which can effectively reduce the number of crossings and minimize the interconnect length. Two types of floorplans are proposed, which could be applied to fat-tree-based networks of arbitrary size. Compared with the traditional one, our floorplans could reduce more than 87% of the crossings. Since the traversal distance for signals is related to the aspect ratio of the processor cores, we also present a method to calculate the optimum aspect ratio of the processor cores to minimize the traversal distance.

Photonic devices are widely used in optical networks-on-chip (ONoCs) and suffer from crosstalk noise. The accumulative crosstalk noise in large scale ONoCs diminishes the signal-to-noise ratio (SNR), causes severe performance degradation, and constrains the network scalability. For the first time, this paper systematically analyzes and models the worst-case crosstalk noise and SNR in folded-torus-based ONoCs. Formal analytical models for the worst-case crosstalk noise and SNR are presented. The crosstalk noise analysis is hierarchically performed at the basic photonic device level, then at the optical router level, and finally at the network level. We consider a general 5$\,\times\,$5 optical router model to enable crosstalk noise and SNR analyses in folded-torus-based ONoCs using an arbitrary 5$\,\times\,$5 optical router. Using the general optical router model, the worst-case SNR link candidates, which restrict the network scalability, are found. Also, we present a novel crosstalk noise and loss analysis platform, called CLAP, which can analyze the crosstalk noise and SNR of arbitrary ONoCs. Case studies of optimized crossbar and Crux optical routers using recent photonic device parameters are presented. Moreover, we compare the worst-case crosstalk noise and SNR in folded-torus-based and mesh-based ONoCs using optimized crossbar and Crux optical routers. The quantitative simulation results show the critical behavior of crosstalk noise in large scale ONoCs. For example, in folded-torus-based ONoCs using the Crux optical router, the noise power exceeds the signal power for network sizes larger than 12$\,\times\,$12; when the network size is 20$\,\times\,$20 and the injection signal power equals 0 dBm, the signal power and noise power are${-}{\rm 9.4}~{\rm dBm}$and${-}{\rm 6.1}~{\rm dBm}$, respectively.

Multiprocessor systems-on-chip show a trend toward integration of tens and hundreds of processor cores on a single chip. With the development of silicon photonics for short-haul optical communication, wavelength division multiplexing (WDM)-based optical networks-on-chip (ONoCs) are emerging on-chip communication architectures that can potentially offer high bandwidth and power efficiency. Thermal sensitivity of photonic devices is one of the main concerns about the on-chip optical interconnects. We systematically modeled thermal effects in optical links in WDM-based ONoCs. Based on the proposed thermal models, we developed OTemp, an optical thermal effect modeling platform for optical links in both WDM-based ONoCs and single-wavelength ONoCs. OTemp can be used to simulate the power consumption as well as optical power loss for optical links under temperature variations. We use case studies to quantitatively analyze the worst-case power consumption for one wavelength in an eight-wavelength WDM-based optical link under different configurations of low-temperature-dependence techniques. Results show that the worst-case power consumption increases dramatically with on-chip temperature variations. Thermal-based adjustment and optimal device settings can help reduce power consumption under temperature variations. Assume that off-chip vertical-cavity surface-emitting lasers are used as the laser source with WDM channel spacing of 1 nm, if we use thermal-based adjustment with guard rings for channel remapping, the worst-case total power consumption is 6.7 pJ/bit under the maximum temperature variation of 60 °C; larger channel spacing would result in a larger worst-case power consumption in this case. If we use thermal-based adjustment without channel remapping, the worst-case total power consumption is around 9.8 pJ/bit under the maximum temperature variation of 60 °C; in this case, the worst-case power consumption would benefit from a larger channel spacing.

As modern computing systems become increasingly complex, communication efficiency among and inside chips has become as important as the computation speeds of individual processing cores. Traditionally, to maximize design flexibility, interchip and intrachip communication architectures are separately designed under different constraints. Jointly designing communication architectures for both interchip and intrachip communication could, however, potentially yield better solutions. In this paper, we present a unified inter/intrachip optical network, called UNION, for chip multiprocessors (CMPs). UNION is based on recent progresses in nanophotonic technologies. It connects not only cores on a single CMP, but also multiple CMPs in a system. UNION employs a hierarchical optical network to separate interchip communication traffic from intrachip communication traffic. It fully utilizes a single optical network to transmit both payload and control packets. The network controller on each CMP not only manages intrachip communications, but also collaborates with each other to facilitate interchip communications. We compared UNION with a matched electrical counterpart in 45-nm process. Simulation results for eight real CMP applications show that on average UNION improves CMP performance by 3× while reducing 88% of network energy consumption.

By integrating multiple processing units and memories on a single chip, multiprocessor system-on-chip (MPSoC) can provide higher performance per energy and lower cost per function to applications with growing complexity. In order to maintain the power budget, power gating technique is widely used to reduce the leakage power. However, it will introduce significant power/ground (P/G) noises, and threat the reliability of MPSoCs. With significant area, power and performance overheads, traditional methods rely on reinforced circuits or fixed protection strategies to reduce P/G noises caused by power gating. In this paper, we propose a systematic approach to actively alleviating P/G noises using the parasitic capacitance of on-chip memories through sensor network on-chip (SENoC). We utilize the parasitic capacitance of on-chip memories as dynamic decoupling capacitance to suppress P/G noises and develop a detailed Hspice model for related study. SENoC is developed to not only monitor and report P/G noises but also coordinate processing units and memories to alleviate such transient threats at run time. Extensive evaluations show that compared with traditional methods, our approach saves 11.7% to 62.2% energy consumption and achieves 13.3% to 69.3% performance improvement for different applications and MPSoCs with different scales. We implement the circuit details of our approach and show its low area and energy consumption overheads.

Network-on-chip (NoC) can improve the performance, power efficiency, and scalability of multiprocessor system-on-chip (MPSoC). Optical NoCs, which are based on CMOS-compatible optical waveguides and microresonators, have significant bandwidth and power advantages over metallic interconnects. We propose a low-cost mesh-based hybrid optical-electronic NoC, HOME, with non-blocking 5×5, 4×4 and 3×3 optical switching fabrics. We systematically analyzed the key characteristics of HOME for a 64-core MPSoC in 45nm under different traffic conditions. Besides, we quantitatively analyzed the thermal effects in the 64-core HOME under temperature variations.

Optical networks-on-chip (ONoCs) are emerging communication architectures that can potentially offer ultrahigh communication bandwidth and low latency to multiprocessor systems-on-chip (MPSoCs). In addition to ONoC architectures, 3-D integrated technologies offer an opportunity to continue performance improvements with higher integration densities. In this paper, we present a 3-D mesh-based ONoC for MPSoCs, and new low-cost nonblocking 4$\,\times\,$4, 5$\,\times\,$5, 6$\,\times\,$6, and 7$\,\times\,$7 optical routers for dimension-order routing in the 3-D mesh-based ONoC. Besides, we propose an optimized floorplan for the 3-D mesh-based ONoC. The floorplan follows the regular 3-D mesh topology but implements all optical routers in a single optical layer. The floorplan is optimized to minimize the number of extra waveguide crossings caused when merging the 3-D ONoC to one optical layer. Based on a set of real applications and uniform traffic pattern, we develop a SystemC-based cycle-accurate NoC simulator and compare the 3-D mesh-based ONoC with the matched 2-D mesh-based ONoC and 2-D electronic NoC for performance and energy efficiency. Additionally, we quantitatively analyze thermal effects on the 3-D 8$\,\times\,$8$\,\times\,$2 mesh-based ONoC.

Crosstalk noise is an intrinsic characteristic as well as a potential issue of photonic devices. In large scale optical networks-on-chips (ONoCs), crosstalk noise could cause severe performance degradation and prevent ONoC from communicating properly. The novel contribution of this paper is the systematical modeling and analysis of the crosstalk noise and the signal-to-noise ratio (SNR) of optical routers and mesh-based ONoCs using a formal method. Formal analytical models for the worst-case crosstalk noise and minimum SNR in mesh-based ONoCs are presented. The crosstalk analysis is performed at device, router, and network levels. A general 5$\,\times\,$5 optical router model is proposed for router level analysis. The minimum SNR optical link candidates, which constrain the scalability of mesh-based ONoCs, are identified. It is also shown that symmetric mesh-based ONoCs have the best SNR performance. The presented formal analyses can be easily applied to other optical routers and mesh-based ONoCs. Finally, we present case studies of mesh-based ONoCs using the optimized crossbar and Crux optical routers to evaluate the proposed formal method. We find that crosstalk noise can significantly limit the scalability of mesh-based ONoCs. For example, when the mesh-based ONoC size, using optimized crossbar, is larger than 8$\,\times\,$8, the optical signal power is smaller than the crosstalk noise power; when the network size is 16$\,\times\,$16 and the input power is 0 dBm, in the worst-case, the signal power is${-}{\rm 24.9}~{\rm dBm}$and the crosstalk noise power is${-}{\rm 11}~{\rm dBm}$.

The performance of multiprocessor systems, such as chip multiprocessors (CMPs), is determined not only by individual processor performance, but also by how efficiently the processors collaborate with one another. It is the communication architecture that determines the collaboration efficiency on the hardware side. Optical networks-on-chip (ONoCs) are emerging communication architectures that can potentially offer ultra-high communication bandwidth and low latency to multiprocessor systems. Thermal sensitivity is an intrinsic characteristic of photonic devices used by ONoCs as well as a potential issue. This paper systematically modeled and quantitatively analyzed the thermal effects in ONoCs. We used an 8$\times$8 mesh-based ONoC as a case study and evaluated the impacts of thermal effects in the average power efficiency for real MPSoC applications. We revealed three important factors regarding ONoC power efficiency under temperature variations, and proposed several techniques to reduce the temperature sensitivity of ONoCs. These techniques include the optimal initial setting of microresonator resonant wavelength, increasing the 3-dB bandwidth of optical switching elements by parallel coupling multiple microresonators, and the use of passive-routing optical router Crux to minimize the number of switching stages in mesh-based ONoCs. We gave a mathematical analysis of periodically parallel coupling of multiple microresonators and show that the 3-dB bandwidth of optical switching elements can be widened nearly linearly with the ring number. Evaluation results for different real MPSoC applications show that, on the basis of thermal tuning, the optimal device setting improves the average power efficiency by 54% to 1.2 pJ/bit when chip temperature reaches 85$^{\circ}$C. The findings in this paper can help support the further development of this emerging technology.

Networks-on-chip (NoCs) are emerging as a key on-chip communication architecture for multiprocessor systems-on-chip (MPSoCs). Optical communication technologies are introduced to NoCs in order to empower ultra-high bandwidth with low power consumption. However, in existing optical NoCs, communication locality is poorly supported, and the importance of floorplanning is overlooked. These significantly limit the power efficiency and performance of optical NoCs. In this work, we address these issues and propose a torus-based hierarchical hybrid optical-electronic NoC, called THOE. THOE takes advantage of both electrical and optical routers and interconnects in a hierarchical manner. It employs several new techniques including floorplan optimization, an adaptive power control mechanism, low-latency control protocols, and hybrid optical-electrical routers with a low-power optical switching fabric. Both of the unfolded and folded torus topologies are explored for THOE. Based on a set of real MPSoC applications, we compared THOE with a typical torus-based optical NoC as well as a torus-based electronic NoC in 45nm on a 256-core MPSoC, using a SystemC-based cycle-accurate NoC simulator. Compared with the matched electronic torus-based NoC, THOE achieves 2.46X performance and 1.51X network switching capacity utilization, with 84% less energy consumption. Compared with the optical torus-based NoC, THOE achieves 4.71X performance and 3.05X network switching capacity utilization, while reducing 99% of energy consumption. Besides real MPSoC applications, a uniform traffic pattern is also used to show the average packet delay and network throughput of THOE. Regarding hardware cost, THOE reduces 75% of laser sources and half of optical receivers compared with the optical torus-based NoC.

Crosstalk noise is an intrinsic characteristic of photonic devices used by optical networks-on-chip (ONoCs) as well as a potential issue. For the first time, this paper analyzed and modeled the crosstalk noise, signal-to-noise ratio (SNR), and bit error rate (BER) of optical routers and ONoCs. The analytical models for crosstalk noise, minimum SNR, and maximum BER in meshbased ONoCs are presented. An automated crosstalk analyzer for optical routers is developed. We find that crosstalk noise significantly limits the scalability of ONoCs. For example, due to crosstalk noise, the maximum BER is 10-3 on the 8x8 mesh-based ONoC using an optimized crossbar-based optical router. To achieve the BER of 10-9 for reliable transmissions, the maximum ONoC size is 6x6. A novel compact high-SNR optical router is proposed to improve the maximum ONoC size to 8x8.