Demo Data from EDBT 2026 / reviewers in the wild / expert
Yasumitsu Orii
dblp:09/1666
· DBLP profile ↗
2ranked-venue papers
1as first author
1since 2021 · last 2023
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Artificial intelligence and machine learning · 1Systems, architecture and hardware · 1 · 1 first-author · 1 since 2021Databases, data management, data science and information retrieval · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Interdisciplinary, comprehensive, and emerging computing
1 paper |
Computational science and engineering · 100% | |
| Artificial intelligence
1 paper |
Generative modeling · 100% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Machine learning › Generative modeling › molecular generation
molecular graph generation |
0.4 | 1 | 2020 | Molecular Inverse-Design Platform for Material Industries · KDD 2020 |
Computational science and engineering › materials informatics
inverse molecular design |
0.4 | 1 | 2020 | Molecular Inverse-Design Platform for Material Industries · KDD 2020 |
Computational science and engineering › materials science
materials discovery |
0.4 | 1 | 2020 | Molecular Inverse-Design Platform for Material Industries · KDD 2020 |
Methods — techniques the papers use, named apart from their topics
substructure-based feature encoding · 0.9graph generation · 0.9
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2023 | Semiconductor Packaging Revolution in the Era of Chiplets : Keynote 1abstractSince the semiconductor cost for state-of-the-art nodes is increasing, “Chiplet” technology is in the spotlight as a new evolutionary path to scale up integration and improve performance and reduce the total cost. With an SoC, a chip might incorporate a CPU, plus an additional several IP blocks on the same chip. That design is then scaled by the advanced node, which is an expensive process. With a chiplet model, those several IP blocks are hardened into smaller dies(chiplets) and those dies are integrated on an interposer to build a system. Those chips must be connected in the shortest length while considering signal integrity and power integrity so that the cutting-edge packaging technology is the key to improve the performance of IT equipments. In this presentation, the advanced 2.1D, 2.3D, 2.5D and 3D packaging technologies will be introduced as well as the several interposer technologies. Yasumitsu Orii |
ITC-Asia | 1 |
| 2020 | Molecular Inverse-Design Platform for Material IndustriesabstractThe discovery of new materials has been the essential force which brings a discontinuous improvement to industrial products' performance. However, the extra-vast combinatorial design space of material structures exceeds human experts' capability to explore all, thereby hampering material development. In this paper, we present a material industry-oriented web platform of an AI-driven molecular inverse-design system, which automatically designs brand new molecular structures rapidly and diversely. Different from existing inverse-design solutions, in this system, the combination of substructure-based feature encoding and molecular graph generation algorithms allows a user to gain high-speed, interpretable, and customizable design process. Also, a hierarchical data structure and user-oriented UI provide a flexible and intuitive workflow. The system is deployed on IBM's and our client's cloud servers and has been used by 5 partner companies. To illustrate actual industrial use cases, we exhibit inverse-design of sugar and dye molecules, that were carried out by experimental chemists in those client companies. Compared to a general human chemist's standard performance, the molecular design speed was accelerated more than 10 times, and greatly increased variety was observed in the inverse-designed molecules without loss of chemical realism. Seiji Takeda, Toshiyuki Hama, Hsiang-Han Hsu, Victoria A. Piunova, Dmitry Zubarev, Dan Sanders 0002, Jed W. Pitera, Makoto Kogoh, Takumi Hongo, Yenwei Cheng, Wolf Bocanett, Hideaki Nakashika, Akihiro Fujita, Yuta Tsuchiya, Katsuhiko Hino, Kentaro Yano, Shuichi Hirose, Hiroki Toda, Yasumitsu Orii, Daiju Nakano |
KDD | 19 |