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Igor W. Farmaga

dblp:10/3843 · also Igor V. Farmaga · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 1994
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Performance modeling and evaluation · 50% Electronic design automation · 50%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
electrothermal simulation		 0.011994
MONSTR: A Complete Thermal Simulator of Electronic Systems · DAC 1994
Performance modeling and evaluation › simulation
thermal simulation		 0.011994
MONSTR: A Complete Thermal Simulator of Electronic Systems · DAC 1994
Performance modeling and evaluation › simulation › thermal simulation
3d thermal simulation		 0.011994
MONSTR: A Complete Thermal Simulator of Electronic Systems · DAC 1994
Electronic design automation
thermal analysis		 0.011994
MONSTR: A Complete Thermal Simulator of Electronic Systems · DAC 1994

Methods — techniques the papers use, named apart from their topics

fourier series · 0.0finite element method · 0.0finite difference method · 0.0
YearPublicationVenuePosition
1994 MONSTR: A Complete Thermal Simulator of Electronic Systems
abstract
This paper presents a new approach to 3-dimensional thermal simulation of arbitrary electronic systems.This approach is based on the combination of numerical (finite elements and finite differences) and analytical (Fourier series) techniques which are very general and extremely efficient.Complex electronic systems (monolithic IC's, multichip modules, including their packaging) can be analyzed in minutes on PC's to produce a detailed temperature distributions within the system structure.The software system, MON-STR, has been developed and applied to several industrial examples.The results of this analysis are directly entered to the circuit simulator, HSPICE, as the actual temperature for each circuit element and thus an integrated electro-thermal simulation is performed.
Vladimir A. Koval, Igor W. Farmaga, Andrzej J. Strojwas, Stephen W. Director
 DAC2