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Makoto Motoyoshi

dblp:118/1836 · DBLP profile ↗
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1ranked-venue papers
1as first author
0since 2021 · last 2009
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Integrated circuit design · 100%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Integrated circuit design
3d integration		 0.112009
Through-Silicon Via (TSV) · Proc. IEEE 2009
Integrated circuit design › 3d integration
through-silicon via		 0.112009
Through-Silicon Via (TSV) · Proc. IEEE 2009
Integrated circuit design › 3d integration
3D LSI		 0.012009
Through-Silicon Via (TSV) · Proc. IEEE 2009
Integrated circuit design
digital circuit design		 0.012009
Through-Silicon Via (TSV) · Proc. IEEE 2009
YearPublicationVenuePosition
2009 Through-Silicon Via (TSV)
abstract
Recently, the development of three-dimensional large-scale integration (3D-LSI) has been accelerated. Its stage has changed from the research level or limited production level to the investigation level with a view to mass production. The 3D-LSI using through-silicon via (TSV) has the simplest structure and is expected to realize a high-performance, high-functionality, and high-density LSI cube. This paper describes the current and future 3D-LSI technologies with TSV.
Makoto Motoyoshi
 Proc. IEEE1