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Sing B. Kang

dblp:12/3147 · DBLP profile ↗
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3ranked-venue papers
0as first author
0since 2021 · last 1990
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 3Systems, architecture and hardware · 1Graphics, computer vision, multimedia, augmented reality and games · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Electronic design automation · 100%

Topics — the 1 heaviest of 2, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation › hardware test
integrated circuit testing
0.011988
IC wire bond inspection using elliptical model approximation · ICRA 1988

Methods — techniques the papers use, named apart from their topics

elliptical model fitting · 0.0
YearPublicationVenuePosition
1990 Fuzzy quaternion approach to object recognition incorporating Zernike moment invariants
abstract
A novel approach to 3-D object recognition based on fuzzy subset theory is described. This method uses Zernike moment invariants of the silhouette of the unknown object to form a set of fuzzy-weighted quantities called fuzzy quaternions. These are matched against those of known objects at predetermined viewpoints. The determination of the Zernike moment invariants can be faster if the equivalent contour integrals are calculated instead. By employing a novel rho -correction scheme, errors due to the digitization are reduced. To speed up the recognition process, a modified Nelder-Mead simplex method is used. Preliminary results demonstrate the potential of the fuzzy quaternion as a viable basis for discrimination. It is concluded that the primary merits of this approach are the ease of model formation, the simplicity of the recognition scheme, and the speed of object recognition. Its disadvantages include the inability to recognize occluded objects and a poor object recognition rate for high perspective distortion of objects.>
King Ngi Ngan, Sing B. Kang
ICPR (1)2
1989 Geometric modelling of IC die bonds for inspection
King Ngi Ngan, Sing B. Kang
Pattern Recognit. Lett.2
1988 IC wire bond inspection using elliptical model approximation
abstract
An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected. >
King Ngi Ngan, Sing B. Kang
ICRA2