Demo Data from EDBT 2026 / reviewers in the wild / expert
Lukasz G. Szafaryn
dblp:124/2029
· DBLP profile ↗
5ranked-venue papers
1as first author
0since 2021 · last 2019
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 5 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
3 papers |
Hardware reliability and fault tolerance · 70% Processor architecture and microarchitecture · 15% Memory systems · 14% |
Topics — the 6 heaviest of 7, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Hardware reliability and fault tolerance › soft errors
cross-layer resilience |
0.6 | 2 | 2018 | Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience) · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2018 Clear: cross-layer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor cores · DAC 2016 |
Hardware reliability and fault tolerance › soft errors
silent data corruption |
0.6 | 2 | 2018 | Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience) · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2018 Clear: cross-layer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor cores · DAC 2016 |
Hardware reliability and fault tolerance
soft errors |
0.6 | 2 | 2018 | Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience) · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2018 Clear: cross-layer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor cores · DAC 2016 |
Memory systems
cache |
0.4 | 1 | 2019 | Killi: Runtime Fault Classification to Deploy Low Voltage Caches without MBIST · HPCA 2019 |
Hardware reliability and fault tolerance › error correction
error-correcting codes |
0.1 | 1 | 2019 | Killi: Runtime Fault Classification to Deploy Low Voltage Caches without MBIST · HPCA 2019 |
Processor architecture and microarchitecture › microprocessor design
processor core design |
0.1 | 1 | 2016 | Clear: cross-layer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor cores · DAC 2016 |
Methods — techniques the papers use, named apart from their topics
microarchitectural recovery · 0.6logic-level parity checking · 0.6circuit-level hardening · 0.6runtime fault classification · 0.4parity · 0.4
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2019 | Killi: Runtime Fault Classification to Deploy Low Voltage Caches without MBISTabstractSupply voltage (VDD) scaling is one of the most effective mechanisms to reduce energy consumption in high-performance microprocessors. However, VDD scaling is challenging for SRAM-based on-chip memories such as caches due to persistent failures at low voltage (LV). Previously designed LV-enabling mechanisms require additional Memory Built-in Self-Test (MBIST) steps, employed either offline or online to identify persistent failures for every LV operating mode. However, these additional MBIST steps are time consuming, resulting in extended boot time or delayed power state transitions. Furthermore, most prior techniques combine MBIST-based solutions with customized Error Correction Codes (ECC), which suffer from non-trivial area or performance overheads. In this paper, we highlight the practical challenges for deploying LV techniques and propose a new low-cost error protection scheme, called Killi, which leverages conventional ECC and parity to enable LV operation. Foremost, the failing lines are discovered dynamically at runtime using both parity and ECC, negating the need for extra MBIST testing. Killi then provides on demand error protection by decoupling cheap error detection from expensive error correction. Killi provides error detection capability to all lines using parity but employs Single Error Correction, Double Error Detection (SECDED) ECC for a subset of the lines with a single LV fault. All lines with more than one fault are disabled. We evaluate this completely hardware enclosed solution on a GPU write-through L2 cache and show that the Vmin (minimum reliable VDD) can be reduced to 62.5% of nominal VDD when operating at 1GHz with only a maximum of 0.8% performance degradation. As a result, an 8CU GPU with Killi can reduce the power consumption of the L2 cache by 59.3% compared to the baseline L2 cache running at nominal VDD. In addition, Killi reduces the error protection area overhead by 50% compared to SECDED ECC. Shrikanth Ganapathy, John Kalamatianos, Bradford M. Beckmann, Steven E. Raasch, Lukasz G. Szafaryn |
HPCA | 5 |
| 2018 | Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience)abstractWe present cross-layer exploration for architecting resilience, a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, and area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, and algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets and single-event multiple upsets in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (586 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a $50 {\times }$ improvement in silent data corruption (SDC) rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, (application-aware) selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a $50{\times }$ improvement in SDC rate). Eric Cheng, Shahrzad Mirkhani, Lukasz G. Szafaryn, Chen-Yong Cher, Hyungmin Cho, Kevin Skadron, Mircea R. Stan, Klas Lilja, Jacob A. Abraham, Pradip Bose, Subhasish Mitra |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 3 |
| 2017 | Cross-Layer Resilience in Low-Voltage Digital Systems: Key InsightsabstractCLEAR (Cross-Layer Exploration for Architecting Resilience) is a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to hardware errors: achieve desired resilience targets at low cost (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). CLEAR automatically and systematically explores the large space of resilience techniques and their combinations, derives cost-effective solutions, provides guidelines for designing new techniques, and offers insights into how to design cost-effective digital systems resilient to hardware errors: 1. circuit-level techniques are crucial; 2. application-level guidance is essential; 3. existing architecture and software techniques are generally expensive or provide too little resilience; 4. some previously published techniques suffer from inaccurate analysis, leading to incorrect conclusions; 5. cost-effective protection from multiple error sources is achieved by combining techniques targeting each specific error source. Eric Cheng, Jacob A. Abraham, Pradip Bose, Alper Buyuktosunoglu, Keith A. Campbell, Deming Chen, Chen-Yong Cher, Hyungmin Cho, Binh Q. Le, Klas Lilja, Shahrzad Mirkhani, Kevin Skadron, Mircea R. Stan, Lukasz G. Szafaryn, Christos Vezyrtzis, Subhasish Mitra |
ICCD | 14 |
| 2016 | Clear: cross-layer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor coresabstractWe present a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets (SEUs) and single-event multiple upsets (SEMUs) in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (798 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. We demonstrate the practicality and effectiveness of our framework using two diverse designs: a simple, in-order processor core and a complex, out-of-order processor core. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a 50× improvement in silent data corruption rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a 50× improvement in silent data corruption rate). Eric Cheng, Shahrzad Mirkhani, Lukasz G. Szafaryn, Chen-Yong Cher, Hyungmin Cho, Kevin Skadron, Mircea R. Stan, Klas Lilja, Jacob A. Abraham, Pradip Bose, Subhasish Mitra |
DAC | 3 |
| 2013 | Trellis: Portability across architectures with a high-level framework
Lukasz G. Szafaryn, Todd Gamblin, Bronis R. de Supinski, Kevin Skadron |
J. Parallel Distributed Comput. | 1 |