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Laurel Emurian

dblp:127/3042 · DBLP profile ↗
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1ranked-venue papers
0as first author
0since 2021 · last 2013
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1Software engineering, systems software and programming languages · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Energy-efficient computing · 67% Embedded and real-time systems · 33%

Topics — the 3 heaviest of 3, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Energy-efficient computing › power management › peak power management
computational sprinting
0.212013
Computational sprinting on a hardware/software testbed · ASPLOS 2013
Embedded and real-time systems
mobile computing
0.212013
Computational sprinting on a hardware/software testbed · ASPLOS 2013
Energy-efficient computing
thermal management
0.212013
Computational sprinting on a hardware/software testbed · ASPLOS 2013
YearPublicationVenuePosition
2013 Computational sprinting on a hardware/software testbed
abstract
CMOS scaling trends have led to an inflection point where thermal constraints (especially in mobile devices that employ only passive cooling) preclude sustained operation of all transistors on a chip --- a phenomenon called "dark silicon." Recent research proposed computational sprinting --- exceeding sustainable thermal limits for short intervals --- to improve responsiveness in light of the bursty computation demands of many media-rich interactive mobile applications. Computational sprinting improves responsiveness by activating reserve cores (parallel sprinting) and/or boosting frequency/voltage (frequency sprinting) to power levels that far exceed the system's sustainable cooling capabilities, relying on thermal capacitance to buffer heat.
Arun Raghavan, Laurel Emurian, Marios C. Papaefthymiou, Kevin P. Pipe, Thomas F. Wenisch, Milo M. K. Martin
ASPLOS2