Demonstration venue · read-only. Every page can be browsed; the buttons that would change it are switched off. Create an account to run TaxoReview on your own data. A simulation from public publication records: the people listed were not invited and did not agree to review.
? Tutorial for this page

Chi-Ping Yang

dblp:129/2151 · DBLP profile ↗
← Back
3ranked-venue papers
0as first author
0since 2021 · last 2015
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 3Software engineering, systems software and programming languages · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Performance modeling and evaluation · 77% Integrated circuit design · 12% Energy-efficient computing · 12%

Topics — the 4 heaviest of 4, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Performance modeling and evaluation › simulation › thermal simulation
3d thermal simulation
0.212015
LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015
Performance modeling and evaluation › simulation
thermal simulation
0.212015
LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015
Integrated circuit design
3d integration
0.112015
LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015
Energy-efficient computing
thermal management
0.112015
LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015

Methods — techniques the papers use, named apart from their topics

matrix solver · 0.2look-up table approach · 0.2incremental thermal updating · 0.2
YearPublicationVenuePosition
2015 LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs
abstract
To sustain Moore's law, three-dimensional integrated circuit (3-D IC) is a promising solution to achieve high performance and low cost targets. However, its operating temperature is higher than that of a 2-D IC because of its high power density of stacked dies and ill of heat dissipation capability. Therefore, on-chip thermal effects have become major concerns of 3-D ICs. Utilizing look-up table approach, this paper, LUTSim, provides two thermal simulation engines, I-LUTSim and S-LUTSim, to efficiently calculate the thermal profile of a 3-D IC. I-LUTSim is suitable for full-chip thermal analysis, and S-LUTSim is suited for incremental-thermal updating. With utilizing the prebuilt tables, compared with a commercial tool ANSYS, the absolute error of I-LUTSim is less than 0.29%. Moreover, with negligible loss of accuracy, I-LUTSim can be 38.8 times faster than a well-known matrix solver SuperLU for performing full-chip thermal simulation. Besides, S-LUTSim can be over 1.05 million times faster than SuperLU for adjusting the thermal profile after inserting/removing a through silicon via.
Yu-Min Lee, Chi-Wen Pan, Pei-Yu Huang, Chi-Ping Yang
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.4
2013 I-LUTSim: An iterative look-up table based thermal simulator for 3-D ICs
abstract
This work presents an iterative look-up table based thermal simulator, I-LUTSim, to efficiently estimate the temperature profile of three-dimensional integrated circuits. I-LUTSim includes two stages. First, the pre-process stage constructs thermal impulse response tables. Then, the simulation stage iteratively calculates the temperature profile via the table lookup. With this two-stage scheme, the maximum absolute error of I-LUTSim is less than 0.41% compared with that of a commercial tool ANSYS. Moreover, I-LUTSim is at least an order of magnitude faster than a fast matrix solver SuperLU [1] for the full-chip temperature simulation.
Chi-Wen Pan, Yu-Min Lee, Pei-Yu Huang, Chi-Ping Yang, Chang-Tzu Lin, Chia-Hsin Lee, Yung-Fa Chou, Ding-Ming Kwai
ASP-DAC4
2013 NUMANA: a hybrid <u>num</u>erical and <u>ana</u>lytical thermal simulator for 3-D ICs
abstract
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
Yu-Min Lee, Tsung-Heng Wu, Pei-Yu Huang, Chi-Ping Yang
DATE4