Evgenii B. Rudnyi

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2ranked-venue papers

0as first author

0since 2021 · last 2019

—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Artificial intelligence and machine learning · 1Systems, architecture and hardware · 1

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems

1 paper

Electronic design automation · 61% Energy-efficient computing · 30% Integrated circuit design · 9%

Topics — the 4 heaviest of 4, each with the papers that count most for it

Topic	Weight	Papers	Last	Evidence papers
Energy-efficient computing › thermal modeling compact thermal model	0.1	1	2005	Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2005
Electronic design automation electrothermal simulation	0.1	1	2005	Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2005
Electronic design automation › circuit simulation model order reduction	0.1	1	2005	Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2005
Integrated circuit design microelectromechanical systems	0.0	1	2005	Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2005

Methods — techniques the papers use, named apart from their topics

successive series expansion · 0.1finite element model reduction · 0.1

Year	Publication	Venue	Position
2019	Efficient Design Optimization Of A Thermoelectric Generator By A Combination Of Model Order Reduction And Thermal Submodeling Techniques Chengdong Yuan, Gunasheela Sadashivaiah, Tamara Bechtold, Evgenii B. Rudnyi	ECMS	4
2005	Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation abstract Compact thermal models are often used during joint electrothermal simulation of microelectromechanical systems (MEMS) and circuits. Formal model reduction allows generation of compact thermal models automatically from high-dimensional finite-element models. Unfortunately, it requires fixing a film coefficient employed to describe the convection boundary conditions. As a result, compact models produced by model reduction do not comply with the requirements of being boundary condition independent. In the present paper, the authors suggest an approach of successive series expansion with respect to the film coefficient as well as to the frequency during model reduction that allows to overcome the problem and keep the film coefficient as a symbolic parameter in the reduced model. The approach is justified with a numerical example of electrothermal simulation of a microthruster unit. Lihong Feng, Evgenii B. Rudnyi, Jan G. Korvink	IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.	2