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Dan Burke

dblp:132/8827 · DBLP profile ↗
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1ranked-venue papers
1as first author
0since 2021 · last 2013
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 1 · 1 first-author

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Computer architecture, parallel and distributed computing, and storage systems
1 paper
Energy-efficient computing · 67% Electronic design automation · 33%
Interdisciplinary, comprehensive, and emerging computing
1 paper
Computational science and engineering · 100%

Topics — the 5 heaviest of 5, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Electronic design automation
circuit simulation
0.212013
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2013
Energy-efficient computing › thermal modeling
compact thermal model
0.212013
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2013
Energy-efficient computing
thermal modeling
0.212013
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2013
Computational science and engineering › numerical analysis
model reduction
0.012013
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2013
Computational science and engineering
numerical analysis
0.012013
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2013

Methods — techniques the papers use, named apart from their topics

krylov subspace model reduction · 0.3finite cloud method · 0.3
YearPublicationVenuePosition
2013 Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques
abstract
This paper presents a procedure for the creation of versatile and powerful thermal compact models of integrated optical devices and demonstrates their use in an optical circuit level simulator. A detailed 3-D model of the device is first built using a meshless finite cloud method, producing a large linear sparse set of equations. This model is then reduced to a compact representation using a Krylov subspace model reduction (MR) technique. Such a reduced model is described by small dense matrices, but can reproduce the original temperature distribution within acceptable error. Three devices are used as demonstration models for the technique: a microdisc laser and two microring-based devices, a modulator, and an optical switch. All three devices are built in a silicon on oxide platform. Using MR the linear systems describing these models are reduced from thousands of unknowns to systems with less than 100 reduced variables. It is then demonstrated how the reduced compact models can be linked together to describe a complete optical system with solution errors of lower than 1%. Finally, it is shown how this reduced thermal model can be utilized in a circuit level opto-electronic circuit simulator and simulations are presented, demonstrating the effectiveness of the reduced models in speeding up simulation times or enabling otherwise intractable problems.
Dan Burke, Tom J. Smy
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.1