EDBT 2026 Demo / reviewers in the wild / expert
Greg Sadowski
dblp:135/8456
· DBLP profile ↗
3ranked-venue papers
0as first author
0since 2021 · last 2017
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 3Software engineering, systems software and programming languages · 1Applied, interdisciplinary, general and emerging computing · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Memory systems · 32% High-performance computing · 16% Processor architecture and microarchitecture · 16% |
Topics — the 7 heaviest of 7, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Memory systems
3d-stacked memory |
0.3 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
GPUs and heterogeneous computing › heterogeneous architecture
accelerated processing unit |
0.3 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
Hardware accelerators and domain-specific architectures › accelerator integration
CPU-GPU integration |
0.3 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
High-performance computing › supercomputing
exascale computing |
0.3 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
Processor architecture and microarchitecture › multicore design
heterogeneous processor architecture |
0.3 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
Memory systems › DRAM › DRAM architecture
high bandwidth memory |
0.3 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
Integrated circuit design › heterogeneous integration
chiplet-based design |
0.1 | 1 | 2017 | Design and Analysis of an APU for Exascale Computing · HPCA 2017 |
Methods — techniques the papers use, named apart from their topics
architectural simulation · 0.3
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2017 | An asynchronous NoC router in a 14nm FinFET library: Comparison to an industrial synchronous counterpartabstractAn asynchronous high-performance low-power 5-port network-on-chip (NoC) router is introduced. The proposed router integrates low-latency input buffers using a circular FIFO design, and a novel end-to-end credit-based virtual channel (VC) flow control for a replicated switch architecture. This asynchronous router is then compared to an AMD synchronous router, in a realistic advanced 14nm FinFET library. This is the first such comparison, to the best of our knowledge, using a real synchronous router baseline already fabricated in several commercial products. Initial post-synthesis pre-layout experiments show dominating results for the asynchronous router, when compared to the synchronous router. In particular, 55% less area and 28% latency improvement are observed for the asynchronous implementation. Also, 88% and 58% savings in idle and active power, respectively, are obtained. Weiwei Jiang 0002, Davide Bertozzi, Gabriele Miorandi, Steven M. Nowick, Wayne P. Burleson, Greg Sadowski |
DATE | 6 |
| 2017 | Design and Analysis of an APU for Exascale ComputingabstractThe challenges to push computing to exaflop levels are difficult given desired targets for memory capacity, memory bandwidth, power efficiency, reliability, and cost. This paper presents a vision for an architecture that can be used to construct exascale systems. We describe a conceptual Exascale Node Architecture (ENA), which is the computational building block for an exascale supercomputer. The ENA consists of an Exascale Heterogeneous Processor (EHP) coupled with an advanced memory system. The EHP provides a high-performance accelerated processing unit (CPU+GPU), in-package high-bandwidth 3D memory, and aggressive use of die-stacking and chiplet technologies to meet the requirements for exascale computing in a balanced manner. We present initial experimental analysis to demonstrate the promise of our approach, and we discuss remaining open research challenges for the community. Thiruvengadam Vijayaraghavan, Yasuko Eckert, Gabriel H. Loh, Michael J. Schulte, Mike Ignatowski, Bradford M. Beckmann, William C. Brantley, Joseph L. Greathouse, Wei Huang 0004, Arun Karunanithi, Onur Kayiran, Mitesh R. Meswani, Indrani Paul, Matthew Poremba, Steven E. Raasch, Steven K. Reinhardt, Greg Sadowski, Vilas Sridharan |
HPCA | 17 |
| 2013 | Low-power Networks-on-Chip: Progress and remaining challengesabstractAfter a long period of academic and industrial research, networks-on-chips (NoCs) are starting to be incorporated into commercial multi-processor designs. NoCs have proven themselves to scale better than bus-based designs and they are here to stay. It is still important to note, however, that even well-designed NoCs consume a large portion of a given system's power budget. This brief paper and accompanying presentation discuss what options are available to designers who need to reduce NoC power consumption, their benefits, and their limitations. Techniques discussed here include general NoC system design as well as disruptive interconnect mediums and their associated strategies. Mark Buckler, Wayne P. Burleson, Greg Sadowski |
ISLPED | 3 |