3D intelligence leverages rich 3D features and stands as a promising frontier in AI, with 3D rendering fundamental to many downstream applications. 3D Gaussian Splatting (3DGS), an emerging high-quality 3D rendering method, requires significant computation, making real-time execution on existing GPU-equipped edge devices infeasible. Previous efforts to accelerate 3DGS rely on dedicated accelerators that require substantial integration overhead and hardware costs. This work proposes an acceleration strategy that leverages the similarities between the 3DGS pipeline and the highly optimized conventional graphics pipeline in modern GPUs. Instead of developing a dedicated accelerator, we enhance existing GPU rasterizer hardware to efficiently support 3DGS operations. Our results demonstrate a 23× increase in processing speed and a 24 × reduction in energy consumption, with improvements yielding 6× faster end-to-end runtime for the original 3DGS algorithm and 4× for the latest efficiency-improved pipeline, achieving 24 FPS and 46 FPS respectively. These enhancements incur only a minimal area overhead of 0.2% relative to the entire SoC chip area, underscoring the practicality and efficiency of our approach for enabling 3DGS rendering on resource-constrained platforms.

Macro placement is a critical very large-scale integration (VLSI) physical design problem that significantly impacts the design power-performance-area (PPA) metrics. This paper proposes AutoDMP, a methodology that leverages DREAMPlace, a GPU-accelerated placer, to place macros and standard cells concurrently in conjunction with automated parameter tuning using a multi-objective hyperparameter optimization technique. As a result, we can generate high-quality predictable solutions, improving the macro placement quality of academic benchmarks compared to baseline results generated from academic and commercial tools. AutoDMP is also computationally efficient, optimizing a design with 2.7 million cells and 320 macros in 3 hours on a single NVIDIA DGX Station A100. This work demonstrates the promise and potential of combining GPU-accelerated algorithms and ML techniques for VLSI design automation.

Vectored IR drop analysis is a critical step in chip signoff that checks the power integrity of an on-chip power delivery network. Due to the prohibitive runtimes of dynamic IR drop analysis, the large number of test patterns must be whittled down to a small subset of worst-case IR vectors. Unlike the traditional slow heuristic method that select a few vectors with incomplete coverage, MAVIREC uses machine learning techniques -- 3D convolutions and regression-like layers -- for accurately recommending a larger subset of test patterns that exercise worst-case scenarios. In under 30 minutes, MAVIREC profiles 100K-cycle vectors and provides better coverage than a state-of-the-art industrial flow. Further, MAVIREC's IR drop predictor shows 10x speedup with under 4mV RMSE relative to an industrial flow.

Logic "re"-simulation can be defined as gate level simulation where the input waveforms at every primary input and pseudo-primary input (such as register/RAM outputs) are known. Such waveforms could come from the unit's RTL simulation trace or Automatic Test Pattern Generation (ATPG) vectors. This type of simulation is useful in doing functional verification on gate level netlists and power analysis, since we can take the known trace on all primary and pseudo-primary inputs, re-simulate the trace using propagation of signals through timing-aware gate-level combinational logic, and verify that results at the primary and pseudo-primary outputs match the reference RTL simulation results. However, gate level simulation is usually much slower than RTL simulation. Thus, there is motivation for faster solutions. In this contest, we ask contestants to use Graphic Processing Units (GPUs) to speedup the re-simulation task.

This work demonstrates a dual-core RISC-V system-on-chip (SoC) with integrated fine-grain power management. The 28-nm fully depleted silicon-on-insulator (FD-SOI) SoC integrates switched-capacitor voltage converters and 4-Gb/s off-chip serial links. The SoC runs applications with operating system support on dual RISC-V Rocket cores with vector accelerators. Runtime monitoring of microarchitectural counters allows prediction of future compute intensity, enabling the voltage state of the managed core to be adjusted quickly to optimize energy efficiency without sacrificing overall performance.

This paper introduces PRIMAL, a novel learning-based framework that enables fast and accurate power estimation for ASIC designs. PRIMAL trains machine learning (ML) models with design verification testbenches for characterizing the power of reusable circuit building blocks. The trained models can then be used to generate detailed power profiles of the same blocks under different workloads. We evaluate the performance of several established ML models on this task, including ridge regression, gradient tree boosting, multi-layer perceptron, and convolutional neural network (CNN). For average power estimation, ML-based techniques can achieve an average error of less than 1% across a diverse set of realistic benchmarks, outperforming a commercial RTL power estimation tool in both accuracy and speed (15x faster). For cycle-by-cycle power estimation, PRIMAL is on average 50x faster than a commercial gate-level power analysis tool, with an average error less than 5%. In particular, our CNN-based method achieves a 35x speed-up and an error of 5.2% for cycle-by-cycle power estimation of a RISC-V processor core. Furthermore, our case study on a NoC router shows that PRIMAL can achieve a small estimation error of 4.5% using cycle-approximate traces from SystemC simulation.

This article consists of a collection of slides from the author's conference presentation.

Deep neural networks have been adopted in a wide range of application domains, leading to high demand for inference accelerators. However, the high cost associated with ASIC hardware design makes it challenging to build custom accelerators for different targets. To lower design cost, we propose MAGNet, a modular accelerator generator for neural networks. MAGNet takes a target application consisting of one or more neural networks along with hardware constraints as input and produces synthesizable RTL for a neural network accelerator ASIC as well as valid mappings for running the target networks on the generated hardware. MAGNet consists of three key components: (i) MAGNet Designer, a highly configurable architectural template designed in C++ and synthesizable by high-level synthesis tools. MAGNet Designer supports a wide range of design-time parameters such as different data formats, diverse memory hierarchies, and dataflows. (ii) MAGNet Mapper, an automated framework for exploring different software mappings for executing a neural network on the generated hardware. (iii) MAGNet Tuner, a design space exploration framework encompassing the designer, the mapper, and a deep learning framework to enable fast design space exploration and co-optimization of architecture and application. We demonstrate the utility of MAGNet by designing an inference accelerator optimized for image classification application using three different neural networks-AlexNet, ResNet, and DriveNet. MAGNet-generated hardware is highly efficient and leverages a novel multi-level dataflow to achieve 40 fJ/op and 2.8 TOPS/mm2in a 16nm technology node for the ResNet-50 benchmark with <; 1% accuracy loss on the ImageNet dataset.

Package-level integration using multi-chip-modules (MCMs) is a promising approach for building large-scale systems. Compared to a large monolithic die, an MCM combines many smaller chiplets into a larger system, substantially reducing fabrication and design costs. Current MCMs typically only contain a handful of coarse-grained large chiplets due to the high area, performance, and energy overheads associated with inter-chiplet communication. This work investigates and quantifies the costs and benefits of using MCMs with fine-grained chiplets for deep learning inference, an application area with large compute and on-chip storage requirements. To evaluate the approach, we architected, implemented, fabricated, and tested Simba, a 36-chiplet prototype MCM system for deep-learning inference. Each chiplet achieves 4 TOPS peak performance, and the 36-chiplet MCM package achieves up to 128 TOPS and up to 6.1 TOPS/W. The MCM is configurable to support a flexible mapping of DNN layers to the distributed compute and storage units. To mitigate inter-chiplet communication overheads, we introduce three tiling optimizations that improve data locality. These optimizations achieve up to 16% speedup compared to the baseline layer mapping. Our evaluation shows that Simba can process 1988 images/s running ResNet-50 with batch size of one, delivering inference latency of 0.50 ms.