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Ziyue Liu 0003

dblp:150/8404-3 · DBLP profile ↗
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3ranked-venue papers
1as first author
3since 2021 · last 2025
0000-0001-9538-5350ORCID · conflict

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 2 · 1 first-author · 2 since 2021Artificial intelligence and machine learning · 1 · 1 since 2021

Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.

Artificial intelligence
1 paper
Efficient and distributed learning · 75% Language models and text generation · 25%
Computer architecture, parallel and distributed computing, and storage systems
1 paper
Performance modeling and evaluation · 50% Electronic design automation · 25% Integrated circuit design · 25%
Interdisciplinary, comprehensive, and emerging computing
1 paper
Computational science and engineering · 100%

Topics — the 9 heaviest of 9, each with the papers that count most for it

TopicWeightPapersLastEvidence papers
Natural language and speech › Language models and text generation
large language model fine-tuning
0.912025
QuZO: Quantized Zeroth-Order Fine-Tuning for Large Language Models · EMNLP 2025
Machine learning › Efficient and distributed learning
model compression
0.912025
QuZO: Quantized Zeroth-Order Fine-Tuning for Large Language Models · EMNLP 2025
Machine learning › Efficient and distributed learning
parameter-efficient fine-tuning
0.912025
QuZO: Quantized Zeroth-Order Fine-Tuning for Large Language Models · EMNLP 2025
Machine learning › Efficient and distributed learning › model compression
quantization
0.912025
QuZO: Quantized Zeroth-Order Fine-Tuning for Large Language Models · EMNLP 2025
Integrated circuit design
3d integration
0.712023
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design · DAC 2023
Performance modeling and evaluation › simulation › thermal simulation
3d thermal simulation
0.712023
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design · DAC 2023
Electronic design automation
physical design
0.712023
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design · DAC 2023
Performance modeling and evaluation › simulation
thermal simulation
0.712023
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design · DAC 2023
Computational science and engineering › scientific machine learning
operator learning
0.212023
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design · DAC 2023

Methods — techniques the papers use, named apart from their topics

operator learning · 1.3neural network · 1.3zeroth-order optimization · 0.9quantization · 0.9
YearPublicationVenuePosition
2025 Enhanced Operator Learning for Scalable and Ultra-fast Thermal Simulation in 3D-IC Design
abstract
Thermal simulation plays a critical role in the design of 3D integrated circuits (3D-ICs), where accurate and efficient temperature predictions are essential to ensure component reliability and performance. Recently, deep learning methods have shown great potential in accelerating these simulations. DeepOHeat [1] is one such approach, designed to learn solution operators that map single or multiple configurations of heat equations---such as surface power, volume power, or heat transfer coefficients---directly to the 3D temperature distribution. By utilizing a physics-informed DeepONet framework[2], DeepOHeat effectively captures complex relationships between design parameters and temperature fields, even when no training data is available and only PDE constraints are imposed.
Xinling Yu, Ziyue Liu 0003, Hai Li 0008, Ian A. Young, Zheng Zhang 0005
ASP-DAC2
2025 QuZO: Quantized Zeroth-Order Fine-Tuning for Large Language Models
abstract
Jiajun Zhou, Yifan Yang, Kai Zhen, Ziyue Liu, Yequan Zhao, Ershad Banijamali, Athanasios Mouchtaris, Ngai Wong, Zheng Zhang. Proceedings of the 2025 Conference on Empirical Methods in Natural Language Processing. 2025.
Jiajun Zhou 0004, Kai Zhen, Ziyue Liu 0003, Yequan Zhao, Seyed Ershad Banijamali, Athanasios Mouchtaris, Ngai Wong 0001, Zheng Zhang 0005
EMNLP4
2023 DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design
abstract
Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many unseen new designs. However, existing works either solve 2D temperature fields only or do not generalize well to new designs with unseen design configurations (e.g., heat sources and boundary conditions). In this paper, for the first time, we propose DeepOHeat, a physics-aware operator learning framework to predict the temperature field of a family of heat equations with multiple parametric or non-parametric design configurations. This framework learns a functional map from the function space of multiple key PDE configurations (e.g., boundary conditions, power maps, heat transfer coefficients) to the function space of the corresponding solution (i.e., temperature fields), enabling fast thermal analysis and optimization by changing key design configurations (rather than just some parameters). We test DeepOHeat on some industrial design cases and compare it against Celsius 3D from Cadence Design Systems. Our results show that, for the unseen testing cases, a well-trained DeepOHeat can produce accurate results with 1000× to 300000× speedup.
Ziyue Liu 0003, Yixing Li, Xinling Yu, Shinyu Shiau, Xin Ai 0007, Zhiyu Zeng, Zheng Zhang 0005
DAC1