Large-scale millimeter-wave (mm-Wave) integrated phased array is the key technology to enable broadband 5G and satellite communications. This paper details the design considerations, challenges and trade-offs of mm-Wave integrated phased arrays based on bulk CMOS and multi-layer hybrid PCB technologies. Both technologies attain high yield and low cost for mass production. Important beamforming building blocks are addressed and compared in detail. Demonstrators of integrated phased arrays are presented from circuit to board levels. The 1024- and 4096-element integrated phased arrays achieve the EIRP of 72.5 and 84.0 dBm respectively. Finally, relevant phased-array transceivers and antennas from the recent literature are discussed.

This paper describes a high‐speed CORDIC‐based digital outphasing modulator. Fixed‐point Matlab model of the outphasing modulator is developed to evaluate the system performance and define the circuit design parameters. Design issues such as signal quantization error, delay mismatch, and phase overflowing are addressed to enable hardware implementation. The complete outphasing modulator is fully custom designed in 40 nm CMOS, which can be integrated in a millimeter‐wave outphasing transmitter to enhance the system average efficiency. Tested with 10.56 Gb/s 64‐QAM, this work achieves an EVM of 3.2% and fulfils the IEEE 802.11ad spectral mask requirements.