Jorge Gomez 0001

dblp:164/8807-1 · also Jorge Tomás Gómez · DBLP profile ↗
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3ranked-venue papers
0as first author
3since 2021 · last 2025
0000-0001-7918-4655ORCID · reported

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 3 · 3 since 2021
YearPublicationVenuePosition
2025 H4H: Hybrid Convolution-Transformer Architecture Search for NPU-CIM Heterogeneous Systems for AR/VR Applications
abstract
Low-latency and low-power edge AI is crucial for Augmented/Virtual Reality applications. Recent advances demonstrate that hybrid models, combining convolution layers (CNN) and transformers (ViT), often achieve a superior accuracy/performance tradeoff on various computer vision and machine learning (ML) tasks. However, hybrid ML models can present system challenges for latency and energy efficiency due to their diverse nature in dataflow and memory access patterns. In this work, we leverage architecture heterogeneity from Neural Processing Units (NPU) and Compute-In-Memory (CIM) and explore diverse execution schemas for efficient hybrid model executions. We introduce H4H-NAS, a two-stage Neural Architecture Search (NAS) framework to automate the design of hybrid CNN/ViT models for heterogeneous edge systems featuring both NPU and CIM. We propose a two-phase incremental supernet training in our NAS to resolve gradient conflicts between sampled subnets caused by different block types in a hybrid model search space. Our H4H-NAS approach is also powered by a performance estimator built with NPU performance results measured on real silicon, and CIM performance based on industry IPs. H4H-NAS searches hybrid CNN-ViT models with fine granularity and achieves significant (up to 1.34%) top-1 accuracy improvement on ImageNet-1k. Moreover, results from our algorithm/hardware co-design reveal up to 56.08% overall latency and 41.72% energy improvements by introducing heterogeneous computing over baseline solutions. Overall, our framework guides the design of hybrid network architectures and system architectures for NPU+CIM heterogeneous systems.
Yiwei Zhao 0001, Sai Qian Zhang, Syed Shakib Sarwar, Kleber Stangherlin, Jorge Gomez 0001, Jae-sun Seo, Barbara De Salvo, Chiao Liu, Phillip B. Gibbons, Ziyun Li 0001
ASP-DAC6
2025 Exploring MRAM for On-Chip Texture Storage in Rendering Applications
abstract
In recent years, Magnetoresistive Random-Access Memory (MRAM) has attracted considerable attention as a high-density, non-volatile alternative to conventional embedded memory technologies. While MRAM has been recently adopted for storing neural network weights, its application in rendering workloads remains unexplored. In this study, we investigate the potential of MRAM for on-chip texture storage within a tile-based rasterization workload. Leveraging Siracusa, a RISC-V-based System-on-Chip (SoC) that integrates both MRAM and SRAM at the same memory hierarchy level, we conduct a comparative evaluation focusing on latency and energy consumption across varying frame rates. The results suggest that MRAM achieves substantial energy savings at lower frame rates due to its ability to enter deep-sleep mode between rendering cycles. However, this benefit diminishes as frame rates increase, with SRAM becoming more energy-efficient beyond a threshold of 43 frames per second. These findings demonstrate that MRAM is particularly wellsuited to read-intensive, energy-constrained rendering tasks.
Nicolás Villegas, Stefano Romanini, Moritz Scherer 0001, Warren Hunt, Syed Shakib Sarwar, Barbara De Salvo, Chiao Liu, Francesco Conti 0001, Davide Rossi 0001, Luca Benini, Jorge Gomez 0001
VLSI-SoC11
2024 Thermally Constrained Codesign of Heterogeneous 3-D Integration of Compute-in-Memory, Digital ML Accelerator, and RISC-V Cores for Mixed ML and Non-ML Workloads
abstract
Heterogeneous 3-D (H3D) integration not only reduces the chip form factor and fabrication cost but also allows the merging of diverse compute paradigms that suit different applications. This is especially attractive when modern algorithms, such as the augmented reality/virtual reality (AR/VR) workloads, consist of mixed machine learning (ML) and non-ML workloads. To date, codesign that considers the thermal, latency, and power constraints of H3D hardware is largely unexplored. In this work, a thermally aware framework for H3D hardware design is developed to evaluate the thermal, latency, and power trade-offs for a heterogeneous system with compute-in-memory (CIM), digital ML cores, and RISC-V cores. The framework solves for runtime tunable operating points described as the optimal speedup factor, the number of activated RISC-V cores, the cooling coefficient, and the activity rate based on user-defined criteria, achieving up to 135 TOPS and 215 TOPS/W under$74~^{\circ }$C for the AR/VR workloads.
Yuan-Chun Luo, Anni Lu, Janak Sharda, Moritz Scherer 0001, Jorge Gomez 0001, Syed Shakib Sarwar, Ziyun Li 0001, Reid Frederick Pinkham, Barbara De Salvo, Shimeng Yu
IEEE Trans. Very Large Scale Integr. Syst.5