Demo Data from EDBT 2026 / reviewers in the wild / expert
Flaviana Calignano
dblp:168/3159
· DBLP profile ↗
3ranked-venue papers
1as first author
1since 2021 · last 2021
0000-0001-7672-7650ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 3 · 1 first-author · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Hardware accelerators and domain-specific architectures · 100% | |
| Computer networks
3 papers |
Physical-layer communications · 54% Internet of things and sensor networks · 46% | |
| Computer graphics and multimedia
1 paper |
Computational fabrication · 100% |
Topics — the 2 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Computational fabrication
additive manufacturing |
0.3 | 1 | 2017 | Overview on Additive Manufacturing Technologies · Proc. IEEE 2017 |
Internet of things and sensor networks
industrial sensing |
0.1 | 1 | 2021 | Optimizing Quality Inspection and Control in Powder Bed Metal Additive Manufacturing: Challenges and Research Directions · Proc. IEEE 2021 |
Methods — techniques the papers use, named apart from their topics
machine learning · 1.0electromagnetic characterization · 0.3
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2021 | Optimizing Quality Inspection and Control in Powder Bed Metal Additive Manufacturing: Challenges and Research DirectionsabstractOne of the key targets of Industry 4.0 and digital production, in general, is the support of faster, cleaner, and increasingly customizable manufacturing processes. Additive manufacturing (AM) is a natural fit in this context, as it offers the possibility to produce complex parts without the design constraints of traditional manufacturing routes, typically reducing both material waste and time to market. Nonetheless, the lack of repeatability of the manufacturing process, which typically translates into a lack of reproducibility and reliability of the quality of the final products compared to traditional subtractive technologies, is currently one of the major barriers to the widespread adoption of AM in mass production. To overcome this limitation, there are growing efforts in recent years toward better integration of advanced information technologies into AM, exploiting the layer-by-layer nature of the build. The consequence of these efforts is twofold: 1) the integration of advanced sensing technologies into the AM systems, making possible the in situ monitoring of huge amounts of data at multiple time scales and resolutions and 2) the ever-increasing role of data-driven approaches [especially machine learning (ML)] in the analysis of such data to provide real-time quality monitoring and process optimization. This article introduces and reviews the key technological developments of this phenomenon, with a special focus on metal powder bed fusion (PBF) technologies that are attracting the highest attention by the industrial AM community. After introducing the main manufacturing quality issues and needs that have to be developed and optimized, we provide a wide overview of the latest progress of in situ monitoring and control in metal PBF, with special regards to sensing technologies and ML approaches. Finally, we identify the open challenges and future research directions in this field. Santa Di Cataldo, Sara Vinco, Gianvito Urgese, Flaviana Calignano, Elisa Ficarra, Alberto Macii, Enrico Macii |
Proc. IEEE | 4 |
| 2017 | Overview on Additive Manufacturing TechnologiesabstractThis paper provides an overview on the main additive manufacturing/3D printing technologies suitable for many satellite applications and, in particular, radio-frequency components. In fact, nowadays they have become capable of producing complex net-shaped or nearly net-shaped parts in materials that can be directly used as functional parts, including polymers, metals, ceramics, and composites. These technologies represent the solution for low-volume, high-value, and highly complex parts and products. Flaviana Calignano, Diego Manfredi, Elisa Paola Ambrosio, Sara Biamino, Mariangela Lombardi, Eleonora Atzeni, Alessandro Salmi, Paolo Minetola, Luca Iuliano, Paolo Fino |
Proc. IEEE | 1 |
| 2017 | Selective Laser Melting Manufacturing of Microwave Waveguide DevicesabstractAdditive manufacturing technologies are currently envisaged to boost the development of a next generation of microwave and millimeter-wave devices intended for, among others, satellite telecommunications, navigation, imaging, radio-astronomy, and cosmology. Due to their excellent electromagnetic and mechanical properties, all-metal waveguide components are key building blocks of several radio frequency (RF) systems used in these application domains. This article reports on the prospects originating from the application of all-metal 3D printing to the manufacturing of high-performance microwave waveguide devices. The technology investigated is the selective laser melting process, where a laser beam is used to fuse metal powder particles spread over a building platform. The complete parts are built by overlapping several constant-thickness layers. An overview on process parameters, material properties, and design rules is reported for this technology. The electromagnetic properties of test samples built in Al and Ti alloys have been experimentally characterized. A robust design of Ku/K-band filters aimed at satellite telecommunications has been implemented in several prototypes manufactured in Al. The corresponding measured performance confirm the applicability of the laser selective melting process to the intended applications. Oscar A. Peverini, Mauro Lumia, Flaviana Calignano, Giuseppe Addamo, Massimo Lorusso, Elisa Paola Ambrosio, Diego Manfredi, Giuseppe Virone |
Proc. IEEE | 3 |