EDBT 2026 Demo / reviewers in the wild / expert
Subramanian Venkateswaran
dblp:168/3480
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2015
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 87% Integrated circuit design · 13% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation
circuit simulation |
0.2 | 1 | 2015 | Efficient FinFET Device Model Implementation for SPICE Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Electronic design automation › circuit simulation › analog circuit simulation
SPICE simulation |
0.2 | 1 | 2015 | Efficient FinFET Device Model Implementation for SPICE Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Integrated circuit design › semiconductor devices › multi-gate devices
FinFET |
0.1 | 1 | 2015 | Efficient FinFET Device Model Implementation for SPICE Simulation · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2015 |
Methods — techniques the papers use, named apart from their topics
verilog compiler · 0.2computer algebra · 0.2BSIM-CMG · 0.2
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2015 | Efficient FinFET Device Model Implementation for SPICE SimulationabstractWith the steady growth of chip complexity and shrinking feature size, multiple challenges are emerging for transistor level circuit simulation. Compact SPICE models are a fundamental part of circuit verification, serving as a bridge between the semiconductor design and foundry. It is also an integral part of SPICE simulators, which directly affects tool performance and therefore design schedule. While the advanced 3-D technology nodes deliver superior level of scalability, simulation cost is rapidly increasing due to the computational complexity introduced by device model equations and the number of iterations required for numerical methods. In this paper, an efficient solution is proposed to reduce the computational cost associated with UC Berkeley BSIM-CMG device model evaluation, by applying robust Verilog compiler and computer algebra techniques to the device model equations. As a result of this implementation, simulation time reduction is up to 72% for complex blocks of the latest generation processor design. Alexander Korobkov, Subramanian Venkateswaran |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 3 |