3D-memory is one of promising applications in 3D-IC technology. With a 3D integration technology, the effective density of memories can increase and the interconnect distance from processor to memory can be shortened. Due to its stacked structure, the upper dies behave as shields blocking outer particles from reaching lower dies, and it makes error rate of the top layer largest among all layers. From a heat perspective, the lower dies would suffer from reliability problems since the lower dies are placed on top of logic die. The heat dissipation can more influence lower dies than upper dies. This creates unequal a reliability distribution for each layer in 3D-memories. A novel ECC organization scheme for 3D-memory to secure reliable operations under soft error rate (SER) profiles is introduced in this paper. The proposed scheme does not require additional redundant arrays. Instead, it utilizes unused spare columns of relatively reliable layer memories to store additional check-bits of less reliable layer memories. It forms a heterogeneous ECC organization across different layers which enhances ECC capabilities in less reliable layers. In addition, redundancy sharing scheme for yield enhancement can be implemented with the proposed scheme. Experimental results show that a memory with the proposed method can tolerate more than three times of a bit-error rate compared to the conventional memory.

Due to the emergence of extremely high density memory along with the growing number of embedded memories, memory yield is an important issue. Memory self-repair using redundancies to increase the yield of memories is widely used. Because high density memories are vulnerable to soft errors, memory error correction code (ECC) plays an important role in memory design. In this paper, methods to exploit spare columns including replaced defective columns are proposed to improve memory ECC. To utilize replaced defective columns, the defect information needs to be stored. Two approaches to store defect information are proposed-one is to use a spare column and the other is to use a content-addressable-memory. Experimental results show that the proposed method can significantly enhance the ECC performance.