Demo Data from EDBT 2026 / reviewers in the wild / expert
John W. Balde
dblp:172/9984
· DBLP profile ↗
1ranked-venue papers
1as first author
0since 2021 · last 1992
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1 · 1 first-author
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 100% |
Topics — the 2 heaviest of 2, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › packaging
multichip module |
0.0 | 1 | 1992 | Crisis in technology: the questionable US ability to manufacture thin-film multichip modules · Proc. IEEE 1992 |
Integrated circuit design
packaging |
0.0 | 1 | 1992 | Crisis in technology: the questionable US ability to manufacture thin-film multichip modules · Proc. IEEE 1992 |
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1992 | Crisis in technology: the questionable US ability to manufacture thin-film multichip modulesabstractIt is argued that even though the technology choices are available, the ability to procure deposited multichip modules (MCM-D) in the US is seriously threatened by the inability to obtain volume orders. The result is the withdrawal of capital at just the time when the capabilities are more and more certain. The future capability in the necessary thin-film multichip module technology may not exist if the companies with capability fold before volume orders are placed. A prescription to stimulate volume production of thin-film MCMs is offered.> John W. Balde |
Proc. IEEE | 1 |