In this paper we discuss parametric measurements of devices implemented in a commercial 14nm CMOS FinFET process taken at cryogenic temperatures. The data may be used to create cryo-CMOS device models for developing CMOS control and readout circuits of qubits in quantum computer. Access to a large number of devices was enabled using an integrated digitally addressable analog multiplexer; the combination of this multiplexer and the set of devices accessible through the multiplexer forms an addressable parametric array. We will discuss the test structure, the measurement technique, the test challenges, and the device parameter shifts that we have observed, over a temperature range from 300K down to 7.9K. The addressable nature of the multiplexer allows investigation of a variety of device types in a single sample cool down. In addition, the accessibility of large numbers of devices allows statistics to be gathered on the variation of key device parameter spreads with temperature.

Future generations of quantum computers are expected to operate in a paradigm where multi-qubit devices will predominantly perform circuits to support quantum error correction. Highly integrated cryogenic electronics are a key enabling technology to support the control of the large numbers of physical qubits that will be required in this fault-tolerant, error-corrected regime. Here, we describe our perspectives on cryoelectronics-driven qubit control architectures, and will then describe an implementation of a scalable, low-power, cryogenic qubit state controller that includes a domain-specific processor and a SSB upconversion I/Q-mixer-based RF AWG. We will also describe an FPGA-based emulation platform that is able to closely reproduce the system intention, and which was used to verify different aspects of the ASIC system design in in situ transmon qubit control experiments.

We present a scalable methodology for the agile physical design of tile-based heterogeneous system-on-chip (SoC) architectures that simplifies the reuse and integration of open-source hardware components. The methodology leverages the regularity of the on-chip communication infrastructure, which is based on a multi-plane network-on-chip (NoC), and the modularity of socket interfaces, which connect the tiles to the NoC. Each socket also provides its tile with a set of platform services, including independent clocking and voltage control. As a result, the physical design of each tile can be decoupled from its location in the top-level floorplan of the SoC and the overall SoC design can benefit from a hierarchical timing-closure flow, design reuse and, if necessary, fast respin. With the proposed methodology we completed two SoC tapeouts of increasing complexity, which illustrate its capabilities and the resulting gains in terms of design productivity.

Emerging technologies provide SoCs with fine-grained DVFS capabilities both in space (number of domains) and time (transients in the order of tens of nanoseconds). Analyzing these systems requires cycle-accurate accounting of rapidly-changing dynamics and complex interactions among accelerators, interconnect, memory, and OS. We present an FPGA-based infrastructure that facilitates such analyses for high-performance embedded systems. We show how our infrastructure can be used to first generate SoCs with loosely-coupled accelerators, and then perform design-space exploration considering several DVFS policies under full-system workload scenarios, sweeping spatial and temporal domain granularity.