This paper combines a useful review of progress during the past year, a description of present programs and immediate goals, and some forecasts of ultimate goals. Although the author, as director of Texas Instruments' semiconductor research and development laboratories, deals primarily with programs and points of view at TI, he makes enough references to work at other companies to build up a reasonably comprehensive picture of the large-scale integration field. Four main areas are covered: bipolar chip technology, full-slice technology, MOS technology, and hybrid technology.