Demo Data from EDBT 2026 / reviewers in the wild / expert
Kevin P. Pipe
dblp:18/11097
· DBLP profile ↗
2ranked-venue papers
0as first author
0since 2021 · last 2013
0000-0002-9778-3130ORCID · corroborated
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 2Software engineering, systems software and programming languages · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Energy-efficient computing · 64% Embedded and real-time systems · 22% Processor architecture and microarchitecture · 15% |
Topics — the 5 heaviest of 5, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Energy-efficient computing › power management › peak power management
computational sprinting |
0.3 | 2 | 2013 | Computational sprinting on a hardware/software testbed · ASPLOS 2013 Computational sprinting · HPCA 2012 |
Energy-efficient computing
thermal management |
0.3 | 2 | 2013 | Computational sprinting on a hardware/software testbed · ASPLOS 2013 Computational sprinting · HPCA 2012 |
Embedded and real-time systems
mobile computing |
0.2 | 1 | 2013 | Computational sprinting on a hardware/software testbed · ASPLOS 2013 |
Processor architecture and microarchitecture
multicore design |
0.1 | 1 | 2012 | Computational sprinting · HPCA 2012 |
Embedded and real-time systems › mobile computing
mobile computing platforms |
0.0 | 1 | 2012 | Computational sprinting · HPCA 2012 |
Methods — techniques the papers use, named apart from their topics
power budgeting · 0.1phase-change material thermal capacitance · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2013 | Computational sprinting on a hardware/software testbedabstractCMOS scaling trends have led to an inflection point where thermal constraints (especially in mobile devices that employ only passive cooling) preclude sustained operation of all transistors on a chip --- a phenomenon called "dark silicon." Recent research proposed computational sprinting --- exceeding sustainable thermal limits for short intervals --- to improve responsiveness in light of the bursty computation demands of many media-rich interactive mobile applications. Computational sprinting improves responsiveness by activating reserve cores (parallel sprinting) and/or boosting frequency/voltage (frequency sprinting) to power levels that far exceed the system's sustainable cooling capabilities, relying on thermal capacitance to buffer heat. Arun Raghavan, Laurel Emurian, Marios C. Papaefthymiou, Kevin P. Pipe, Thomas F. Wenisch, Milo M. K. Martin |
ASPLOS | 5 |
| 2012 | Computational sprintingabstractAlthough transistor density continues to increase, voltage scaling has stalled and thus power density is increasing each technology generation. Particularly in mobile devices, which have limited cooling options, these trends lead to a utilization wall in which sustained chip performance is limited primarily by power rather than area. However, many mobile applications do not demand sustained performance; rather they comprise short bursts of computation in response to sporadic user activity. To improve responsiveness for such applications, this paper explores activating otherwise powered-down cores for sub-second bursts of intense parallel computation. The approach exploits the concept of computational sprinting, in which a chip temporarily exceeds its sustainable thermal power budget to provide instantaneous throughput, after which the chip must return to nominal operation to cool down. To demonstrate the feasibility of this approach, we analyze the thermal and electrical characteristics of a smart-phone-like system that nominally operates a single core (~1W peak), but can sprint with up to 16 cores for hundreds of milliseconds. We describe a thermal design that incorporates phase-change materials to provide thermal capacitance to enable such sprints. We analyze image recognition kernels to show that parallel sprinting has the potential to achieve the task response time of a 16W chip within the thermal constraints of a 1W mobile platform. Arun Raghavan, Anuj Chandawalla, Marios C. Papaefthymiou, Kevin P. Pipe, Thomas F. Wenisch, Milo M. K. Martin |
HPCA | 5 |