Demo Data from EDBT 2026 / reviewers in the wild / expert
Chin Siong Ong
dblp:19/6014
· DBLP profile ↗
3ranked-venue papers
0as first author
0since 2021 · last 2009
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 3
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Electronic design automation · 91% Performance modeling and evaluation · 9% |
Topics — the 4 heaviest of 4, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › physical design › parasitic extraction
capacitance extraction |
0.0 | 1 | 2004 | A multiparameter moment-matching model-reduction approach for generating geometrically parameterized interconnect performance models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2004 |
Electronic design automation
interconnect modeling |
0.0 | 1 | 2004 | A multiparameter moment-matching model-reduction approach for generating geometrically parameterized interconnect performance models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2004 |
Electronic design automation › physical design
parasitic extraction |
0.0 | 1 | 2004 | A multiparameter moment-matching model-reduction approach for generating geometrically parameterized interconnect performance models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2004 |
Performance modeling and evaluation › network performance analysis
interconnect performance modeling |
0.0 | 1 | 2004 | A multiparameter moment-matching model-reduction approach for generating geometrically parameterized interconnect performance models · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2004 |
Methods — techniques the papers use, named apart from their topics
multiparameter moment matching · 0.0model order reduction · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2009 | An electrical-level superposed-edge approach to statistical serial link simulationabstractBrute-force simulation approaches to estimating serial-link bit-error rates (BERs) become computationally intractable for the case when BERs are low and the interconnect electrical response is slow enough to generate intersymbol interference that spans dozens of bit periods. Electrical-level statistical simulation approaches based on superposing pulse responses were developed to address this problem, but such pulse-based methods have difficulty analyzing jitter and rise/fall asymmetry. In this paper we present a superposing-edge approach for statistical simulation, as edge-based methods handle rise/fall asymmetry and jitter in straightforward way. We also resolve a key problem in using edge-based approaches, that edges are always correlated, by deriving an efficient inductive approach for propagating the edge correlations. Examples are presented demonstrating the edge-based method's accuracy and effectiveness in analyzing combinations of uniform, Gaussian, and periodic distributed random jitter. Michael J. Tsuk, Daniel Dvorscak, Chin Siong Ong, Jacob K. White 0001 |
ICCAD | 3 |
| 2004 | A multiparameter moment-matching model-reduction approach for generating geometrically parameterized interconnect performance modelsabstractIn this paper, we describe an approach for generating accurate geometrically parameterized integrated circuit interconnect models that are efficient enough for use in interconnect synthesis. The model-generation approach presented is automatic, and is based on a multiparameter moment matching model-reduction algorithm. A moment-matching theorem proof for the algorithm is derived, as well as a complexity analysis for the model-order growth. The effectiveness of the technique is tested using a capacitance extraction example, where the plate spacing is considered as the geometric parameter, and a multiline bus example, where both wire spacing and wire width are considered as geometric parameters. Experimental results demonstrate that the generated models accurately predict capacitance values for the capacitor example, and both delay and cross-talk effects over a reasonably wide range of spacing and width variation for the multiline bus example. Luca Daniel, Chin Siong Ong, Sok Chay Low, Kwok Hong Lee, Jacob K. White 0001 |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 2 |
| 2002 | Geometrically parameterized interconnect performance models for interconnect synthesisabstractIn this paper we describe an approach for generating geometrically-parameterized integrated-circuit interconnect models that are efficient enough for use in interconnect synthesis. The model generation approach presented is automatic, and is based on a multi-parameter model-reduction algorithm. The effectiveness of the technique is tested using a multi-line bus example, where both wire spacing and wire width are considered as geometric parameters. Experimental results demonstrate that the generated models accurately predict both delay and cross-talk effects over a wide range of spacing and width variation. Luca Daniel, Chin Siong Ong, Sok Chay Low, Kwok Hong Lee, Jacob K. White 0001 |
ISPD | 2 |