The diversity communication tasks impose strict requirements on the reconfigurable ability and size of next-generation wireless systems. In this work, a 3-D network is proposed to enhance reconfiguration ability and reduce size, weight, loss, and cost of wireless systems. The network comprises a signal routing Chiplet and 3-D heterogeneous interconnections composed of through silicon via (TSV) and redistribution layer (RDL), enabling dynamic reconfiguration of wireless system architectures. A transmission matrix-based design method is given. For frequency-domain reconfiguration performance, an insertion loss can of less than 2.8 dB and an isolation greater than 35 dB are achieved from dc to 5 GHz. For the time-domain reconfiguration performance, as the data rate increases from 1 to 10 Gb/s, the eye diagram shows an opening from 96.83% to 60% of peak-peak amplitude, jitter ranging from 0.1% to 7% unit interval (UI).

Accurate and fast multiphysics coupling analysis is of great significance to the design of microsystems. In this article, we propose a fast analysis method to improve the computational efficiency of the multiphysics coupling problem in 3-D microsystems. In this method, an iterative dual cell method (IDCM) is developed to deal with electro-thermal coupling problems, and the superposition principle is used to calculate thermal stress. The comparison between the proposed method and the finite element method (FEM) shows that IDCM and superposition principle have high accuracy, and IDCM can reduce the calculation time by up to 30% than FEM. This article studies in detail the changes of temperature and stress with two types of Through silicon via arrays, (TSV) and discusses the influence of the C4-bump layout on the stress distribution. Our work demonstrated that the proposed method can quickly and accurately perform multiphysics coupling analyzes of 3-D microsystems.