Computing modules in typical data center nodes or server racks consist of several multicore chips either on a board or in a System-in-Package (SiP) environment. State-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the destination chip over a wireline interconnect fabric. This multihop communication increases energy consumption while decreasing data bandwidth in a multichip system. Also, traditional I/O does not scale well with technology generations due to limitations of pitch. Moreover, intra-chip and inter-chip communication protocol within such a multichip system is often decoupled to facilitate design flexibility. However, a seamless interconnection between on-chip and off-chip data transfer can improve the communication efficiency significantly. Here, we propose the design of a seamless hybrid wired and wireless interconnection network for multichip systems with dimensions spanning up to tens of centimeters with on-chip wireless transceivers. We demonstrate with cycle accurate simulations that such a design increases the bandwidth and reduces the energy consumption in comparison to state-of-the-art wireline I/O based multichip communication.