Demo Data from EDBT 2026 / reviewers in the wild / expert
Thomas Hornak
dblp:20/3492
· DBLP profile ↗
2ranked-venue papers
0as first author
0since 2021 · last 1991
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Computer networks · 2
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Integrated circuit design · 100% | |
| Computer networks
2 papers |
Physical-layer communications · 64% Optical networks · 36% |
Topics — the 5 heaviest of 7, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design › high-speed integrated circuits › high-speed integrated circuit design
clock and data recovery |
0.0 | 1 | 1991 | A 1.5 Gb/s Link Interface Chipset for Computer Data Transmission · IEEE J. Sel. Areas Commun. 1991 |
Integrated circuit design › analog and mixed-signal circuits › mixed-signal circuit design
phase-locked loop |
0.0 | 1 | 1991 | A 1.5 Gb/s Link Interface Chipset for Computer Data Transmission · IEEE J. Sel. Areas Commun. 1991 |
Physical-layer communications › modulation
line coding |
0.0 | 1 | 1991 | A 1.5 Gb/s Link Interface Chipset for Computer Data Transmission · IEEE J. Sel. Areas Commun. 1991 |
Optical networks
optical link |
0.0 | 1 | 1978 | System and Circuit Considerations for Integrated Industrial Fiber Optic Data Links · IEEE Trans. Commun. 1978 |
Integrated circuit design › analog and mixed-signal circuits
mixed-signal circuit design |
0.0 | 1 | 1978 | System and Circuit Considerations for Integrated Industrial Fiber Optic Data Links · IEEE Trans. Commun. 1978 |
Methods — techniques the papers use, named apart from their topics
experimental measurement · 0.0pulse bipolar line coding · 0.0ON-OFF modulation · 0.0
| Year | Publication | Venue | Position |
|---|---|---|---|
| 1991 | A 1.5 Gb/s Link Interface Chipset for Computer Data TransmissionabstractThe authors designed a set of four ICs to provide encoding, multiplexing, clock extraction/demultiplexing, and decoding for gigabit-rate serial data transmission. These chips form a high bandwidth data link for point-to-point communication. A new line code is implemented that provides DC balance, efficient encoding, framing, and simple clock extraction. Embedded in the code is a fixed transition used by the phase/frequency locked loop (PLL) for simple clock extraction and frame synchronization. Unlike other links, this PLL requires no trimming for data retiming, either in production or later. An on-chip voltage-controlled oscillator (VCO) with a tuning range of 1.1-1.6 GHz is available for use with the PLL. With this chip set the authors demonstrated a transmission rate of 16 bits in parallel at 75 MHz or, with encoding overhead, a serial rate of 1.5 Gb/s.> Richard C. Walker, Thomas Hornak, Chu-Sun Yen, Joey Doernberg, Kent H. Springer |
IEEE J. Sel. Areas Commun. | 2 |
| 1978 | System and Circuit Considerations for Integrated Industrial Fiber Optic Data LinksabstractThis paper describes system and circuit considerations for transmit/receive integrated circuits meeting the requirements of industrial fiber optic data links. The integrated circuits are: TTL compatible, operate with arbitrary data format over the range from d.c. to a maximum NRZ data rate of 15 Mbits/s with a 10-9error rate at a minimum receiver detector current of 125 nA, have >55 dB electrical dynamic range and an automatic link monitor, operate from a single +5 V supply and are temperature and voltage compensated. These circuits utilize an internal pulse bipolar line coding to accommodate an arbitrary input signal format or, by switching a control input, an ON-OFF modulation for zero average TTL input signals operating above 2 Mbit/s data rate. William W. Brown, Delon C. Hanson, Thomas Hornak, Steven E. Garvey |
IEEE Trans. Commun. | 3 |