The number of cores in a single chip keeps increasing with process technology scaling, requiring a scalable interconnection network topology. Buffered wormhole-switched interconnect architectures are attractive for such multicore architectures. The 2D mesh on-chip interconnect provides a scalable, cost-efficient, flexible, and reliable next-generation interconnect topology in this context. In this paper, we provide a microarchitecture for a power and area efficient router for a 2D mesh interconnect. We propose an efficient crossbar implementation, called MoDe-X, that uses a reasonable power-performance tradeoff. The MoDe-X router uses a Modular-Decoupled Crossbar (MoDe-X) that incorporates dimensional decomposition and segmentation to achieve power and area savings. However, unlike most prior work that considers only logical representation of the crossbars, MoDe-X is a physically aware router accounting for the actual layout of router components to reflect practical design requirements. Our simulation results and power estimate show that the MoDe-X router architectures can reduce the overall router area by up to 40 percent and power consumption by up to 35 percent with very little performance impact that occurs only at higher loads. Further, by applying aggressive power gating techniques the net power reductions can be as much as 99 percent for some workloads with no additional performance impact.

Many-core chip multiprocessors can be expected to scale to tens of cores and beyond in the near future. Existing and emerging workloads on general-purpose many-core processors typically exhibit fast-changing, unpredictable on-chip communication traffic full of burstiness and jitters between different functional blocks. To provide high sustainable performance, scalable interconnects with a rich feature set including support for adaptive and flexible communication, performance isolation, and fault-tolerance are needed. 2D mesh and torus are attractive choices because they are physical layout friendly and scale more gracefully in network latency and bisection bandwidth than other simple interconnects such as buses or rings. However, the adoption of 2D mesh/torus in many-core processor designs is dependent on a verifiable and robust micro-architecture and a validated set of features. FPGA based systems have recently become a cost-effective, rapid prototyping vehicle for chip multiprocessor architectures. In this paper we present an FPGA based prototype of 2D on-die interconnect architecture. Our prototype is a highly configurable full-scale design that supports options selecting many different micro-architectural features and routing algorithms. The prototype incorporates a synthetic traffic generator to exercise and evaluate our design. To facilitate evaluation and characterization, a rich development environment and novel software capabilities including a very detailed performance visualization infrastructure has been developed. We demonstrate the experiment results of several configurations on a 6x6 2D network emulator setup in this paper.

The advent of diminutive technology feature sizes has led to escalating transistor densities. Burgeoning transistor counts are casting a dark shadow on modern chip design: global interconnect delays are dominating gate delays and affecting overall system performance. Networks-on-Chip (NoC) are viewed as a viable solution to this problem because of their scalability and optimized electrical properties. However, on-chip routers are susceptible to another artifact of deep submicron technology, Process Variation (PV). PV is a consequence of manufacturing imperfections, which may lead to degraded performance and even erroneous behavior. In this work, we present the first comprehensive evaluation of NoC susceptibility to PV effects, and we propose an array of architectural improvements in the form of a new router design-called SturdiSwitch-to increase resiliency to these effects. Through extensive reengineering of critical components, SturdiSwitch provides increased immunity to PV while improving performance and increasing area and power efficiency.

The trend towards integrating multiple cores on the same die has accentuated the need for larger on-chip caches. Such large caches are constructed as a multitude of smaller cache banks interconnected through a packet-based network-on-chip (NoC) communication fabric. Thus, the NoC plays a critical role in optimizing the performance and power consumption of such non-uniform cache-based multicore architectures. While almost all prior NoC studies have focused on the design of router microarchitectures for achieving this goal, in this paper, we explore the role of data compression on NoC performance and energy behavior. In this context, we examine two different configurations that explore combinations of storage and communication compression: (1) Cache compression (CC) and (2) Compression in the NIC (NC). We also address techniques to hide the decompression latency by overlapping with NoC communication latency. Our simulation results with a diverse set of scientific and commercial benchmark traces reveal that CC can provide up to 33% reduction in network latency and up to 23% power savings. Even in the case of NC - where the data is compressed only when passing through the NoC fabric of the NUCA architecture and stored uncompressed - performance and power savings of up to 32% and 21%, respectively, can be obtained. These performance benefits in the interconnect translate up to 17% reduction in CPI. These benefits are orthogonal to any router architecture and make a strong case for utilizing compression for optimizing the performance and power envelope of NoC architectures. In addition, the study demonstrates the criticality of designing faster routers in shaping the performance behavior.

Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core/SoC systems in deep sub-micron technology. However, almost all prior studies have focused on 2D NoC designs. Since three dimensional (3D) integration has emerged to mitigate the interconnect delay problem, exploring the NoC design space in 3D can provide ample opportunities to design high performance and energy-efficient NoC architectures. In this paper, we propose a 3D stacked NoC router architecture, called MIRA, which unlike the 3D routers in previous works, is stacked into multiple layers and optimized to reduce the overall area requirements and power consumption. We discuss the design details of a four-layer 3D NoC and its enhanced version with additional express channels, and compare them against a (6times6) 2D design and a baseline 3D design. All the designs are evaluated using a cycle-accurate 3D NoC simulator, and integrated with the Orion power model for performance and power analysis. The simulation results with synthetic and application traces demonstrate that the proposed multi-layered NoC routers can outperform the 2D and naive 3D designs in terms of performance and power. It can achieve up to 42% reduction in power consumption and up to 51% improvement in average latency with synthetic workloads. With real workloads, these benefits are around 67% and 38%, respectively.

Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities and burgeoning die sizes in multi-core architectures. Partitioning a larger die into smaller segments and then stacking them in a 3D fashion can significantly reduce latency and energy consumption. Such benefits emanate from the notion that inter-wafer distances are negligible compared to intra-wafer distances. This attribute substantially reduces global wiring length in 3D chips. The work in this paper integrates the increasingly popular idea of packet-based Networks-on-Chip (NoC) into a 3D setting. While NoCs have been studied extensively in the 2D realm, the microarchitectural ramifications of moving into the third dimension have yet to be fully explored. This paper presents a detailed exploration of inter-strata communication architectures in 3D NoCs. Three design options are investigated; a simple bus-based inter-wafer connection, a hop-by-hop standard 3D design, and a full 3D crossbar implementation. In this context, we propose a novel partially-connected 3D crossbar structure, called the 3D Dimensionally-Decomposed (DimDe) Router, which provides a good tradeoff between circuit complexity and performance benefits. Simulation results using (a) a stand-alone cycle-accurate 3D NoC simulator running synthetic workloads, and (b) a hybrid 3D NoC/cache simulation environment running real commercial and scientific benchmarks, indicate that the proposed DimDe design provides latency and throughput improvements of over 20% on average over the other 3D architectures, while remaining within 5% of the full 3D crossbar performance. Furthermore, based on synthesized hardware implementations in 90 nm technology, the DimDe architecture outperforms all other designs -- including the full 3D crossbar -- by an average of 26% in terms of the Energy-Delay Product (EDP).

The advent of deep sub-micron technology has exacerbated reliability issues in on-chip interconnects. In particular, single event upsets, such as soft errors, and hard faults are rapidly becoming a force to be reckoned with. This spiraling trend highlights the importance of detailed analysis of these reliability hazards and the incorporation of comprehensive protection measures into all Network-on-Chip (NoC) designs. In this paper, we examine the impact of transient failures on the reliability of on-chip interconnects and develop comprehensive counter-measures to either prevent or recover from them. In this regard, we propose several novel schemes to remedy various kinds of soft error symptoms, while keeping area and power overhead at a minimum. Our proposed solutions are architected to fully exploit the available infrastructures in an NoC and enable versatile reuse of valuable resources. The effectiveness of the proposed techniques has been validated using a cycle-accurate simulator.

Packet-based on-chip networks are increasingly being adopted in complex system-on-chip (SoC) designs supporting numerous homogeneous and heterogeneous functional blocks. These network-on-chip (NoC) architectures are required to not only provide ultra-low latency, but also occupy a small footprint and consume as little energy as possible. Further, reliability is rapidly becoming a major challenge in deep sub-micron technologies due to the increased prominence of permanent faults resulting from accelerated aging effects and manufacturing/testing challenges. Towards the goal of designing low-latency, energy-efficient and reliable on-chip communication networks, we propose a novel fine-grained modular router architecture. The proposed architecture employs decoupled parallel arbiters and uses smaller crossbars for row and column connections to reduce output port contention probabilities as compared to existing designs. Furthermore, the router employs a new switch allocation technique known as "mirroring effect" to reduce arbitration depth and increase concurrency. In addition, the modular design permits graceful degradation of the network in the event of permanent faults and also helps to reduce the dynamic power consumption. Our simulation results indicate that in an 8 times 8 mesh network, the proposed architecture reduces packet latency by 4-40% and power consumption by 6-20% as compared to two existing router architectures. Evaluation using a combined performance, energy and fault-tolerance metric indicates that the proposed architecture provides 35-50% overall improvement compared to the two earlier routers

The advent of deep sub-micron technology has recently highlighted the criticality of the on-chip interconnects. As diminishing feature sizes have led to increases in global wiring delays, network-on-chip (NoC) architectures are viewed as a possible solution to the wiring challenge and have recently crystallized into a significant research thrust. Both NoC performance and energy budget depend heavily on the routers' buffer resources. This paper introduces a novel unified buffer structure, called the dynamic virtual channel regulator (ViChaR), which dynamically allocates virtual channels (VC) and buffer resources according to network traffic conditions. ViChaR maximizes throughput by dispensing a variable number of VCs on demand. Simulation results using a cycle-accurate simulator show a performance increase of 25% on average over an equal-size generic router buffer, or similar performance using a 50% smaller buffer. ViChaR's ability to provide similar performance with half the buffer size of a generic router is of paramount importance, since this can yield total area and power savings of 30% and 34%, respectively, based on synthesized designs in 90 nm technology

Network-on-Chip (NoC) architectures employing packet-based communication are being increasingly adopted in System-on-Chip (SoC) designs. In addition to providing high performance, the fault tolerance and reliability of these networks is becoming a critical issue due to several artifacts of deep sub-micron technologies. Consequently, it is important for a designer to have access to fast methods for evaluating the performance, reliability, and energy-efficiency of an on-chip network. Towards this end, first, we propose a novel path-sensitive router architecture for low-latency applications. Next, we present a queuing-theory-based model for evaluating the performance and energy behavior of on-chip networks. Then the model is used to demonstrate the effectiveness of our proposed router. The performance (average latency) and energy consumption results from the analytical model are validated with those obtained from a cycle-accurate simulator. Finally, we explore error detection and correction mechanisms that provide different energy-reliability- performance tradeoffs and extend our model to evaluate the on-chip network in the presence of these error protection schemes. Our reliability exploration culminates with the introduction of an array of transient fault protection techniques, both architectural and algorithmic, to tackle reliability issues within the router's individual hardware components. We propose a complete solution safeguarding against both the traditional link faults and internal router upsets, without incurring any significant latency, area and power overhead.

The increased deployment of System-on-Chip designs has drawn attention to the limitations of on-chip interconnects. As a potential solution to these limitations, Networks-on -Chip (NoC) have been proposed. The NoC routing algorithm significantly influences the performance and energy consumption of the chip. We propose a router architecture which utilizes adaptive routing while maintaining low latency. The two-stage pipelined architecture uses look ahead routing, speculative allocation, and optimal output path selection concurrently. The routing algorithm benefits fromcongestionaware flow control, making better routing decisions. We simulate and evaluate the proposed architecture in terms of network latency and energy consumption. Our results indicate that the architecture is effective in balancing the performance and energy of NoC designs.