Demo Data from EDBT 2026 / reviewers in the wild / expert
Paul A. McConnelee
dblp:203/3703
· DBLP profile ↗
1ranked-venue papers
0as first author
0since 2021 · last 2005
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 100% |
Topics — the 2 heaviest of 2, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
flexible electronics |
0.1 | 1 | 2005 | A Transparent, High Barrier, and High Heat Substrate for Organic Electronics · Proc. IEEE 2005 |
Integrated circuit design › semiconductor devices
organic electronics |
0.0 | 1 | 2005 | A Transparent, High Barrier, and High Heat Substrate for Organic Electronics · Proc. IEEE 2005 |
Methods — techniques the papers use, named apart from their topics
transparent coating · 0.1roll-to-roll fabrication · 0.1
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2005 | A Transparent, High Barrier, and High Heat Substrate for Organic ElectronicsabstractThe use of plastic film substrates for organic electronic devices promises to enable new applications, such as flexible displays and conformal lighting, and a new low-cost paradigm through high-volume roll-to-roll fabrication. Unfortunately, presently available substrates cannot yet deliver this promise because of the challenge in achieving the required combination of optical transparency, impermeability to water and oxygen, mechanical flexibility, high-temperature capability, and chemical resistance. Here, we describe the development and performance of a plastic substrate comprising a high heat polycarbonate film combined with a unique transparent coating package that is aimed at meeting this challenge. Tae Won Kim, Ahmet Gün Erlat, Matthew Pellow, Donald F. Foust, Marc Schaepkens, Christian M. Heller, Paul A. McConnelee, Thomas P. Feist, Anil R. Duggal |
Proc. IEEE | 9 |