The development of Ferroelectric Field-Effect Transistor (FeFET) manufacturing requires high-quality test solutions, yet research on FeFET testing is still in a nascent stage. To generate a dedicated test method for FeFETs, it is critical to have a deep understanding of manufacturing defects and accurately model them. In this work, we introduce the unique defect, Anomalous Charge Trapping (ACT), in FeFETs. The ACT-defective FeFET is characterized, and the physical mechanism of the defect is explained. Then, we apply the Deviceaware Test (DAT) method to design a specific ACT-defective FeFET model, which includes the physical impact of the defect on the electrical parameters of defect-free models, and calibrate the model with measurement data. Fault modeling is performed based on circuit-level simulations, and dedicated test solutions are proposed.

Ferroelectric Field-Effect Transistors (FeFETs) are promising candidates for non-volatile memory (NVM) technologies, especially in embedded systems and edge computing. However, due to their physical characteristics, FeFETs exhibit unique defects—such as Threshold Voltage Shifting (TVS) caused by trap charges in the oxide layer—that are not captured by conventional defect models. This study adopts the Device-Aware Test (DAT) methodology to model these defects by incorporating their impact into the electrical parameters, calibrated using measurement data. Defect injection, circuit-level simulations, and fault analysis are performed to derive realistic fault models. Finally, the March algorithm and Design-for-Test (DfT) techniques are proposed to effectively detect these defects.

Abstract Hafnium (Hf) oxide-based ferroelectric materials have emerged as a transformative platform for next-generation non-volatile memory and advanced computing technologies. This review comprehensively examines the development, challenges, and applications of HfO 2 ferroelectrics, emphasizing their CMOS compatibility, scalability, and robust polarization at nanoscale dimensions. Breakthroughs in doping strategies, stress engineering, and VO control have stabilized the metastable orthorhombic phase, enabling high-performance devices such as ferroelectric RAM (FeRAM), ferroelectric field-effect transistors (FeFETs), and ferroelectric tunnel junctions (FTJs). These devices offer ultrafast switching, low power consumption, and multi-level storage, driving innovations in neuromorphic computing, in-memory processing, and cryogenic systems; nonetheless, they face ongoing challenges in reliability, such as fatigue and imprint effects, and scalability at sub-5 nm technology nodes. Emerging frontiers, such as wurtzite-structured nitrides (e.g., AlScN) and antiferroelectric ZrO 2 -based systems, have garnered significant attention due to their exceptionally high remanent polarization and promising potential for enhanced endurance, respectively. Further addressing the reliability issues of these emerging ferroelectric materials and the challenges associated with large-scale integration processes through interdisciplinary efforts will unlock the full potential of ferroelectric technologies, positioning them as pivotal enablers of post-Moore computing architectures and sustainable AI-driven applications.

As emerging non-volatile memory (NVM) devices, Ferroelectric Field-Effect Transistors (FeFETs) present distinctive opportunities for the design of ultra-dense and low-leakage memory systems. For matured FeFET manufacturing, it is extremely important to have an understanding of manufacturing defects and accurately model them to develop effective test solutions. This paper introduces a comprehensive framework for defect and fault modeling, which enables the development of test solutions. First, a classification of FeFET manufacturing defects is provided; both conventional defects (such as contacts and interconnect defects) as well as unique FeFET defects are discussed. The latter FeFET specific defect leads to unique faults that cannot be adequately described using traditional modeling approaches. Then, the Device-Aware Test (DAT) method is used to effectively and appropriately model, analyze and develop test solutions for such unique defects; the approach will be illustrated for Stuck-at-Polarization (SAP) defects.

Electrical impedance tomography (EIT) reconstructs the internal impedance distribution by making voltage and current measurements on the object's boundary. The image reconstruction for EIT is a non-linear inverse problem. A generalized solutions based on an inverse operator is ill-conditioned and highly sensitive to the noise. In order to improve the quality of reconstructed images, this paper presents a new framework based on deep neural network (DNN) model. We apply the stacked autoencoder (SAE) and a logistic regression (LR) layer to constitute a 4-layer DNN model. This model is trained with simulation data to obtain the relationship between voltage measurements and the corresponding conductivity distribution, and then test the trained DNN model with untrained simulation data and experimental data, respectively. The output of the network is considered as the estimate of the conductivity distribution for image reconstruction. Both simulation and experimental results show the effectiveness of the proposed framework in improving the quality of reconstructed images.