EDBT 2026 Demo / reviewers in the wild / expert
Huifu Duan
dblp:212/7270
· DBLP profile ↗
1ranked-venue papers
0as first author
1since 2021 · last 2023
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Applied, interdisciplinary, general and emerging computing · 1 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
1 paper |
Integrated circuit design · 62% Memory systems · 38% |
Topics — the 3 heaviest of 3, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Integrated circuit design
memory circuit design |
0.7 | 1 | 2023 | Hf0.5Zr0.5O2 1T-1C FeRAM arrays with excellent endurance performance for embedded memory · Sci. China Inf. Sci. 2023 |
Memory systems › on-chip memory
embedded memory |
0.2 | 1 | 2023 | Hf0.5Zr0.5O2 1T-1C FeRAM arrays with excellent endurance performance for embedded memory · Sci. China Inf. Sci. 2023 |
Memory systems
non-volatile memory |
0.2 | 1 | 2023 | Hf0.5Zr0.5O2 1T-1C FeRAM arrays with excellent endurance performance for embedded memory · Sci. China Inf. Sci. 2023 |
Methods — techniques the papers use, named apart from their topics
hafnium zirconium oxide ferroelectric · 0.7
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2023 | Hf0.5Zr0.5O2 1T-1C FeRAM arrays with excellent endurance performance for embedded memory
Wenwu Xiao, Huifu Duan, Fujun Bai, Qiwei Ren, Genquan Han |
Sci. China Inf. Sci. | 4 |