Hardware implementations of encryption engines are susceptible to Power Side Channel Attacks (PSCA) and countermeasures only make attacks harder without eliminating them. This work presents a temperature tolerant 65nm CMOS passive on-chip PSCA detection sensor for a AES-128 engine. The design uses on-chip sub-threshold oscillator to detect the resistor normally placed by an attacker on the power-line of an AES chip to mount PSCA. The measurement demonstrates 99.9% probability of successful detection, 1.1ms detection time, minimal area overhead compared to the encryption area and 0.83mW power.

This paper presents a simulation-based study to evaluate the effect of Hot Carrier Injection (HCI) on the characteristics of an on-chip, digitally-controlled, switched inductor voltage regulator (IVR) architecture. Our methodology integrates device-level aging models, circuit simulations in SPICE, and control loop simulations in Simulink. We characterize the effect of HCI on individual components of an IVR, and their combined effect on the efficiency and transient performance. Our analysis using an IVR designed in 65nm CMOS shows that aging of the power stages has a smaller impact on performance compared to that of the control loop. Further, we perform a comparative analysis to show that, with a 1.8V supply, HCI leads to higher aging-induced degradation of IVR than Negative Bias Temperature Instability (NBTI). Finally, our simulation shows that parasitic inductance near IVR input aggravates NBTI and parasitic capacitance near IVR output aggravates HCI effects on IVR’s performance.

The optimal selection of an interposer substrate is important in 2.5D systems, because its physical, material and electrical characteristics govern the overall system performance, reliability and cost. Several materials have been proposed that offer various tradeoffs including silicon, organic, glass and etc. In this paper, we conduct a quantitative comparison between two 2.5D IC designs based on silicon vs. liquid crystal polymer (LCP) interposer technologies in the overall system level for the first time. We also investigate tradeoffs in power, performance and area (PPA), signal integrity (SI) and power integrity (PI) depending on the interposer technologies. Through our flow, we generate a large-scale benchmark architecture with commercial-grade GDS layouts of interposer and chiplets using two different interposer substrates. Then, we model transmission lines and power delivery network (PDN) of each 2.5D IC design. Finally, we perform PPA analysis, SI and PI on both 2.5D IC designs to observe the quantitative tradeoffs between two designs. Our experiment shows that silicon interposer-based design has 10.46% less power, 0.25× smaller area and 0.57× shorter average wirelength compared to LCP interposer-based design. However, LCP-based design has 0.59× smaller PDN DC impedance and 0.75× shorter worst delay of interposer wire while maintaining the power delivery efficiency. Lastly, our cost analysis of 2.5D IC design indicates that the overall cost of organic LCP technology, if both the chiplets and their interposer costs are combined, is 2.69× higher than the silicon even the cost of LCP interposer is 1.91% of silicon interposer. This indicates that LCP technology is prohibitive unless the interconnect and bump dimensions are dramatically reduced.

A new trend in system-on-chip (SoC) design is chiplet-based IP reuse using 2.5-D integration. Complete electronic systems can be created through the integration of chiplets on an interposer, rather than through a monolithic flow. This approach expands access to a large catalog of off-the-shelf intellectual properties (IPs), allows reuse of them, and enables heterogeneous integration of blocks in different technologies. In this article, we present a highly integrated design flow that encompasses architecture, circuit, and package to build and simulate heterogeneous 2.5-D designs. Our target design is 64core architecture based on Reduced Instruction Set Computer (RISC)-V processor. We first chipletize each IP by adding logical protocol translators and physical interface modules. We convert a given register transfer level (RTL) for 64-core processor into chiplets, which are enhanced with our centralized network-onchip. Next, we use our tool to obtain physical layouts, which is subsequently used to synthesize chip-to-chip I/O drivers and these chiplets are placed/routed on a silicon interposer. Our package models are used to calculate power, performance, and area (PPA) and reliability of 2.5-D design. Our design space exploration (DSE) study shows that 2.5-D integration incurs 1.29× power and 2.19× area overheads compared with 2-D counterpart. Moreover, we perform DSE studies for power delivery scheme and interposer technology to investigate the tradeoffs in 2.5-D integrated chip (IC) designs.

A new trend in complex SoC design is chiplet-based IP reuse using 2.5D integration. In this paper we present a highly-integrated design flow that encompasses architecture, circuit, and package to build and simulate heterogeneous 2.5D designs. We chipletize each IP by adding logical protocol translators and physical interface modules. These chiplets are placed/routed on a silicon interposer next. Our package models are then used to calculate PPA and signal/power integrity of the overall system. Our design space exploration study using our tool flow shows that 2.5D integration incurs 2.1x PPA overhead compared with 2D SoC counterpart.

Integrated voltage regulators (IVR) with embedded inductors is an emerging technology that provides point-of-load voltage regulation to high-performance systems. Conventional two-step approaches to the design of IVRs can suffer from suboptimal design as the optimal inductor depends on the characteristics of the buck converter (BC). Furthermore, inductor-level trade-offs such as AC and DC resistance, inductance and area can not be determined independently from the BC. This co-dependency of the BC and the inductor creates a highly non-linear response surface, which raises the necessity of co-optimization, involving multiple time-consuming electromagnetics (EM) simulations. In this paper, we propose a machine learning based optimization methodology that eliminates EM simulations from the optimization loop to significantly reduce the optimization complexity. A novel technique named as Spectral Transposed Convolutional Neural Network (S-TCNN) is presented to derive an accurate predictive model of the inductor frequency response using a small amount of training data. The derived S-TCNN is then used along with a time-domain model of the BC to perform multi-objective optimization that approximates the Pareto front for 5 objectives, namely inductor area, BC settling time, voltage conversion efficiency, droop and ripple. The resulting methodology provides multiple Pareto optimal inductors in an efficient and fully automated fashion, thereby allows to rapidly determine the optimal trade-offs for possibly contradicting design objectives. We demonstrate the proposed framework on co-optimization of solenoidal inductor with magnetic core and BC that are integrated on silicon interposer.

This paper demonstrates an electronic design automation (EDA) tool flow for generation of digitally controlled high-bandwidth on-chip voltage regulators for easy integration in a digital SoC. The proposed flow optimizes the control loop and power stage of an integrated voltage regulator (IVR) to achieve desired transient performance and/or efficiency. The GDSII of the optimized IVR is generated by coupling logic synthesis and physical design of digital blocks, automated generation of power stage layout, and top-level integration of all modules. We demonstrate the developed flow for inductive IVRs in 130nm and 65nm CMOS process. We show feasibility of fast design space exploration, optimization, layout generation as well as automated integration of the generated IVR with a RISC-V core.

This paper demonstrates autotuning of the coefficients of the feedback loop of an inductive integrated voltage regulator (IVR) using an on-chip delay sensor. The proposed approach improves the effective performance of the digital core under variations in the on-die/package integrated passives and transistor process. A 130-nm CMOS test-chip is designed containing a multisampled 125-MHz IVR with a wirebond inductor, on-die capacitor, and all-digital proportional-integral-differential (PID) controller powering a parallel Advanced Encryption Standard (AES) engine. The autotuning is performed using a Vernier delay line based on-chip delay sensor and an all-digital tuning engine. The measurement results demonstrate up to 5.2% improvement in the maximum operating frequency of the AES core using performance-based autotuning.

This paper presents an auto-tuning method for fully integrated voltage regulators (IVRs) driving digital cores against variations in passive as well as process/temperature of the core. The key contribution is to perform auto-tuning of the coefficients of the feedback loop of the IVR based on the performance of the digital cores. Simulations using a high-frequency IVR Simulink model and digital logic in 45nm CMOS process shows that the proposed performance driven auto-tuning demonstrates potential for up to 12% increase in system performance under inductance and threshold variation.