Demo Data from EDBT 2026 / reviewers in the wild / expert
Chia-Cheng Pai
dblp:221/2857
· DBLP profile ↗
4ranked-venue papers
0as first author
1since 2021 · last 2021
—ORCID · none
Domains — the database's venue-derived domains; a paper can count in several
Systems, architecture and hardware · 4 · 1 since 2021
Expertise — from the expertise taxonomy: the topics of the expert's papers under the CCF categories. A weight counts papers with recency: 1 for a paper about the topic, 0.3 when the topic is its context, halved every five years.
| Computer architecture, parallel and distributed computing, and storage systems
2 papers |
Electronic design automation · 95% Integrated circuit design · 5% |
Topics — the 8 heaviest of 8, each with the papers that count most for it
| Topic | Weight | Papers | Last | Evidence papers |
|---|---|---|---|---|
Electronic design automation › hardware verification and test
asynchronous circuit testing |
0.4 | 1 | 2019 | DR-Scan: Dual-Rail Asynchronous Scan DfT and ATPG · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2019 |
Electronic design automation
hardware verification and test |
0.4 | 1 | 2019 | DR-Scan: Dual-Rail Asynchronous Scan DfT and ATPG · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2019 |
Electronic design automation › physical design › routing › VLSI routing
obstacle-avoiding routing |
0.3 | 1 | 2018 | Efficient multi-layer obstacle-avoiding region-to-region rectilinear steiner tree construction · DAC 2018 |
Electronic design automation
physical design |
0.3 | 1 | 2018 | Efficient multi-layer obstacle-avoiding region-to-region rectilinear steiner tree construction · DAC 2018 |
Electronic design automation › physical design
routing |
0.3 | 1 | 2018 | Efficient multi-layer obstacle-avoiding region-to-region rectilinear steiner tree construction · DAC 2018 |
Electronic design automation › physical design › routing
steiner tree construction |
0.3 | 1 | 2018 | Efficient multi-layer obstacle-avoiding region-to-region rectilinear steiner tree construction · DAC 2018 |
Integrated circuit design
asynchronous circuit design |
0.1 | 1 | 2019 | DR-Scan: Dual-Rail Asynchronous Scan DfT and ATPG · IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2019 |
Electronic design automation › physical design
engineering change order |
0.1 | 1 | 2018 | Efficient multi-layer obstacle-avoiding region-to-region rectilinear steiner tree construction · DAC 2018 |
Methods — techniques the papers use, named apart from their topics
vertex coloring · 0.4full-scan dft · 0.4ATPG · 0.4spanning graph construction · 0.3
| Year | Publication | Venue | Position |
|---|---|---|---|
| 2021 | Clock-Less DFT and BIST for Dual-Rail Asynchronous Circuits
Tsai-Chieh Chen, Chia-Cheng Pai, Yi-Zhan Hsieh, Hsiao-Yin Tseng, Chien-Mo James Li, Tsung-Te Liu, I-Wei Chiu |
J. Electron. Test. | 2 |
| 2019 | DR-Scan: Dual-Rail Asynchronous Scan DfT and ATPGabstractDue to many state-holding elements in asynchronous circuits, many faults need two-pattern tests. This paper presents a test methodology (DR-scan) for dual-rail asynchronous circuits. Our design for testability is a full-scan, clock-less technique that supports both one-pattern and two-pattern tests for single stuck-at faults. DR-scan is able to test memory elements in dual-rail logic without breaking local feedback loops. To reduce test time, we choose a minimum set of selected test configurations (TCs). If there are more than one selected TCs, we need to split scan latches into multiple scan chains. To apply two-pattern tests, we partition the circuit using vertex coloring. With our test methodology, we can apply traditional full-scan automatic test pattern generation (ATPG) to generate two-pattern tests with high test coverage. Experimental results show our methodology can achieve test coverage up to nearly 94% for various asynchronous circuits. Shih-An Hsieh, Ying-Hsu Wang, Ting-Yu Shen, Kuan-Yen Huang, Chia-Cheng Pai, Tsai-Chieh Chen, Chien-Mo James Li |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. | 5 |
| 2018 | Efficient multi-layer obstacle-avoiding region-to-region rectilinear steiner tree constructionabstractAs Engineering Change Order (ECO) has attracted substantial attention in modern VLSI design, the open net problem, which aims at constructing a shortest obstacle-avoiding path to reconnect the net shapes in an open net, becomes more critical in the ECO stage. This paper addresses a multi-layer obstacle-avoiding region-to-region Steiner minimal tree (SMT) construction problem that connects all net shapes by edges on a layer or vias between layers, and avoids running through any obstacle with a minimal total cost. Existing multi-layer obstacle-avoiding SMT algorithms consider pin-to-pin connections instead of region-to-region ones, which would limit the solution quality due to its lacking region information. In this paper, we present an efficient algorithm based on our new multi-layer obstacle-avoiding region-to-region spanning graph to solve the addressed problem, which guarantees to find an optimal solution for a net connecting two regions on a single layer. Experimental results show that our algorithm outperforms all the participating routers of the 2017 CAD Contest at ICCAD in both solution quality and runtime. Run-Yi Wang, Chia-Cheng Pai, Hsiang-Ting Wen, Yu-Cheng Pai, Yao-Wen Chang, Chien-Mo James Li, Jie-Hong Roland Jiang |
DAC | 2 |
| 2018 | Test methodology for PCHB/PCFB Asynchronous CircuitsabstractAmong many asynchronous design styles, precharge half/full buffers (PCHB/PCFB) are popular due to small area and high performance. This paper proposes new test methodology for PCHB/PCFB asynchronous circuits. Our proposed design for testability (DfT) does not break any internal feedback loop so it is small in area. There are two major theoretical contributions in this paper. First, this paper analyzes the fault effects of transition delay faults, which were not studied in depth by previous research. Second, we also analyze faults on fanout branches that break the isochronic fork assumption. One important conclusion is that these faults can not only degrade the circuit performance but also modify data so they must be tested. We propose three-pattern tests for stuck-at faults and four-pattern tests for transition delay faults. In addition, we propose a new model for ATPG so that existing tools can be used. On the average, our work achieves 93% and 92% stuck-at and transition delay fault coverage, respectively, which is much higher than previous techniques. Ting-Yu Shen, Chia-Cheng Pai, Tsai-Chieh Chen, Chien-Mo James Li, Samuel Pan |
ITC | 2 |