Eric Qin 0001

dblp:224/2813 · also Eric C. Qin · DBLP profile ↗
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9ranked-venue papers
2as first author
6since 2021 · last 2023
—ORCID · none

Domains — the database's venue-derived domains; a paper can count in several

Systems, architecture and hardware · 9 · 2 first-author · 6 since 2021
YearPublicationVenuePosition
2023 VEGETA: Vertically-Integrated Extensions for Sparse/Dense GEMM Tile Acceleration on CPUs
abstract
Deep Learning (DL) acceleration support in CPUs has recently gained a lot of traction, with several companies (Arm, Intel, IBM) announcing products with specialized matrix engines accessible via GEMM instructions. CPUs are pervasive and need to handle diverse requirements across DL workloads running in edge/HPC/cloud platforms. Therefore, as DL workloads embrace sparsity to reduce the computations and memory size of models, it is also imperative for CPUs to add support for sparsity to avoid under-utilization of the dense matrix engine and inefficient usage of the caches and registers. This work presents VEGETA, a set of ISA and microarchitecture extensions over dense matrix engines to support flexible structured sparsity for CPUs, enabling programmable support for diverse DL models with varying degrees of sparsity. Compared to the state-of-the-art (SOTA) dense matrix engine in CPUs, a VEGETA engine provides 1.09×, 2.20×, 3.74×, and 3.28× speed-ups when running 4:4 (dense), 2:4, 1:4, and unstructured (95%) sparse DNN layers.
Geonhwa Jeong, Sana Damani, Abhimanyu Bambhaniya, Eric Qin 0001, Christopher J. Hughes, Sreenivas Subramoney, Hyesoon Kim, Tushar Krishna
HPCA4
2022 Self adaptive reconfigurable arrays (SARA): learning flexible GEMM accelerator configuration and mapping-space using ML
abstract
This work demonstrates a scalable reconfigurable accelerator (RA) architecture designed to extract maximum performance and energy efficiency for GEMM workloads. We also present a self-adaptive (SA) unit, which runs a learnt model for one-shot configuration optimization in hardware offloading the software stack thus easing the deployment of the proposed design. We evaluate an instance of the proposed methodology with a 32.768 TOPS reference implementation called SAGAR, that can provide the same mapping flexibility as a compute equivalent distributed system while achieving 3.5X more power efficiency and 3.2X higher compute density demonstrated via architectural and post-layout simulation.
Ananda Samajdar, Eric Qin 0001, Michael Pellauer, Tushar Krishna
DAC2
2022 Understanding the Design-Space of Sparse/Dense Multiphase GNN dataflows on Spatial Accelerators
abstract
Graph Neural Networks (GNNs) have garnered a lot of recent interest because of their success in learning representations from graph-structured data across several critical applications in cloud and HPC. Owing to their unique compute and memory characteristics that come from an interplay between dense and sparse phases of computations, the emergence of recon-figurable dataflow (aka spatial) accelerators offers promise for acceleration by mapping optimized dataflows (i.e., computation order and parallelism) for both phases. The goal of this work is to characterize and understand the design-space of dataflow choices for running GNNs on spatial accelerators in order for mappers or design-space exploration tools to optimize the dataflow based on the workload. Specifically, we propose a taxonomy to describe all possible choices for mapping the dense and sparse phases of GNN inference, spatially and temporally over a spatial accelerator, capturing both the intra-phase dataflow and the inter-phase (pipelined) dataflow. Using this taxonomy, we do deep-dives into the cost and benefits of several dataflows and perform case studies on implications of hardware parameters for dataflows and value of flexibility to support pipelined execution.
Raveesh Garg, Eric Qin 0001, Francisco Muñoz-Martínez, Robert Guirado, Akshay Jain 0001, Sergi Abadal, José L. Abellán, Manuel E. Acacio, Eduard Alarcón, Sivasankaran Rajamanickam, Tushar Krishna
IPDPS2
2021 RASA: Efficient Register-Aware Systolic Array Matrix Engine for CPU
abstract
As AI-based applications become pervasive, CPU vendors are starting to incorporate matrix engines within the datapath to boost efficiency. Systolic arrays have been the premier architectural choice as matrix engines in offload accelerators. However, we demonstrate that incorporating them inside CPUs can introduce under-utilization and stalls due to limited register storage to amortize the fill and drain times of the array. To address this, we propose RASA, Register-Aware Systolic Array. We develop techniques to divide an execution stage into several sub-stages and overlap instructions to hide overheads and run them concurrently. RASA-based designs improve performance significantly with negligible area and power overhead.
Geonhwa Jeong, Eric Qin 0001, Ananda Samajdar, Christopher J. Hughes, Sreenivas Subramoney, Hyesoon Kim, Tushar Krishna
DAC2
2021 Extending Sparse Tensor Accelerators to Support Multiple Compression Formats
abstract
Sparsity, which occurs in both scientific applications and Deep Learning (DL) models, has been a key target of optimization within recent ASIC accelerators due to the potential memory and compute savings. These applications use data stored in a variety of compression formats. We demonstrate that both the compactness of different compression formats and the compute efficiency of the algorithms enabled by them vary across tensor dimensions and amount of sparsity. Since DL and scientific workloads span across all sparsity regions, there can be numerous format combinations for optimizing memory and compute efficiency. Unfortunately, many proposed accelerators operate on one or two fixed format combinations. This work proposes hardware extensions to accelerators for supporting numerous format combinations seamlessly and demonstrates ~ 4 x speedup over performing format conversions in software.
Eric Qin 0001, Geonhwa Jeong, William Won, Sheng-Chun Kao, Hyoukjun Kwon, Sudarshan Srinivasan, Dipankar Das 0002, Gordon Euhyun Moon, Sivasankaran Rajamanickam, Tushar Krishna
IPDPS1
2021 Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems
abstract
The 2-D CMOS process technology scaling may have reached its pinnacle, yet it is not feasible to manufacture all computing elements at lower technological nodes. This has opened a new branch of chip designing that allows chiplets on different technological nodes to be integrated into a single package using interposers, the passive interconnection mediums. However, establishing a high-frequency communication over an entirely passive layer is one of the significant design challenges of 2.5-D systems. In this article, we present a robust clocking architecture for a 2.5-D system consisting of 64 processor cores. This clocking scheme consists of two major components, namely, interposer clocking and on-chiplet clocking. The interposer clocking consists of clocks used to achieve global synchronicity and clocks for interchiplet communication established using the AIB protocol. We synthesized these clocking components using commercial EDA tools and analyzed them using standard tools, on-chip, and package models. We also compare these results against a 2-D design of the same benchmark and another 2.5-D clocking architecture. Our experiments show that the absolute clock power is up to 16% less, and the ratio of clock power to system power is up to 4% less in the 2.5-D design than its 2-D counterpart.
Gauthaman Murali, Heechun Park, Eric Qin 0001, Hakki Mert Torun, Majid Ahadi Dolatsara, Madhavan Swaminathan, Tushar Krishna, Sung Kyu Lim
IEEE Trans. Very Large Scale Integr. Syst.3
2020 SIGMA: A Sparse and Irregular GEMM Accelerator with Flexible Interconnects for DNN Training
abstract
The advent of Deep Learning (DL) has radically transformed the computing industry across the entire spectrum from algorithms to circuits. As myriad application domains embrace DL, it has become synonymous with a genre of workloads across vision, speech, language, recommendations, robotics, and games. The key compute kernel within most DL workloads is general matrix-matrix multiplications (GEMMs), which appears frequently during both the forward pass (inference and training) and backward pass (training). GEMMs are a natural choice for hardware acceleration to speed up training, and have led to 2D systolic architectures like NVIDIA tensor cores and Google Tensor Processing Unit (TPU). Unfortunately, emerging GEMMs in DL are highly irregular and sparse, which lead to poor data mappings on systolic architectures. This paper proposes SIGMA, a flexible and scalable architecture that offers high utilization of all its processing elements (PEs) regardless of kernel shape and sparsity. Within SIGMA includes a novel reduction tree microarchitecture named Forwarding Adder Network (FAN). SIGMA performs 5.7x better than systolic array architectures for irregular sparse matrices, and roughly 3x better than state-of-the-art sparse accelerators. We demonstrate an instance of SIGMA operating at 10.8 TFLOPS efficiency across arbitrary levels of sparsity, with a 65.10 mm^2 and 22.33 W footprint on a 28 nm process.
Eric Qin 0001, Ananda Samajdar, Hyoukjun Kwon, Vineet Nadella, Sudarshan Srinivasan, Dipankar Das 0002, Bharat Kaul, Tushar Krishna
HPCA1
2020 Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse
abstract
A new trend in system-on-chip (SoC) design is chiplet-based IP reuse using 2.5-D integration. Complete electronic systems can be created through the integration of chiplets on an interposer, rather than through a monolithic flow. This approach expands access to a large catalog of off-the-shelf intellectual properties (IPs), allows reuse of them, and enables heterogeneous integration of blocks in different technologies. In this article, we present a highly integrated design flow that encompasses architecture, circuit, and package to build and simulate heterogeneous 2.5-D designs. Our target design is 64core architecture based on Reduced Instruction Set Computer (RISC)-V processor. We first chipletize each IP by adding logical protocol translators and physical interface modules. We convert a given register transfer level (RTL) for 64-core processor into chiplets, which are enhanced with our centralized network-onchip. Next, we use our tool to obtain physical layouts, which is subsequently used to synthesize chip-to-chip I/O drivers and these chiplets are placed/routed on a silicon interposer. Our package models are used to calculate power, performance, and area (PPA) and reliability of 2.5-D design. Our design space exploration (DSE) study shows that 2.5-D integration incurs 1.29× power and 2.19× area overheads compared with 2-D counterpart. Moreover, we perform DSE studies for power delivery scheme and interposer technology to investigate the tradeoffs in 2.5-D integrated chip (IC) designs.
Gauthaman Murali, Heechun Park, Eric Qin 0001, Hyoukjun Kwon, Venakata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Nihar Dasari, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim
IEEE Trans. Very Large Scale Integr. Syst.4
2019 Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse
abstract
A new trend in complex SoC design is chiplet-based IP reuse using 2.5D integration. In this paper we present a highly-integrated design flow that encompasses architecture, circuit, and package to build and simulate heterogeneous 2.5D designs. We chipletize each IP by adding logical protocol translators and physical interface modules. These chiplets are placed/routed on a silicon interposer next. Our package models are then used to calculate PPA and signal/power integrity of the overall system. Our design space exploration study using our tool flow shows that 2.5D integration incurs 2.1x PPA overhead compared with 2D SoC counterpart.
Gauthaman Murali, Heechun Park, Eric Qin 0001, Hyoukjun Kwon, Venakata Chaitanya Krishna Chekuri, Nihar Dasari, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim
DAC4